摘要:
An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame. The electrical pins may be movable along the axial length of the prober bars, or may be selectively pushed down to contact selected contact pads on the substrate.
摘要:
An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame.
摘要:
A method of testing electronic devices on substrates is described. The method includes placing a configurable prober over a first substrate, testing the first substrate, re-configuring the configurable prober, placing the configurable prober over a second substrate, and testing the second substrate.
摘要:
An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame. The electrical pins may be movable along the axial length of the prober bars, or may be selectively pushed down to contact selected contact pads on the substrate.
摘要:
A method of testing electronic devices on substrates is described. The method includes placing a configurable prober over a first substrate, testing the first substrate, re-configuring the configurable prober, placing the configurable prober over a second substrate, and testing the second substrate.
摘要:
An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame.
摘要:
Embodiments of the invention relate to methods and apparatus for minimizing electrostatic discharge in processing and testing systems utilizing large area substrates in the production of flat panel displays, solar panels, and the like. In one embodiment, an apparatus is described. The apparatus includes a testing chamber, a substrate support disposed in the testing chamber, the substrate support having a substrate support surface, a structure disposed in the testing chamber, the structure having a length that spans a width of the substrate support surface, the structure being linearly movable relative to the substrate support, and a brush device having a plurality of conductive bristles coupled to the structure and spaced a distance away from the substrate support surface of the substrate support, the brush device electrically coupling the support surface to ground through the structure.
摘要:
A continuity test system adapted for testing individual contact pins within a flat panel test system is disclosed. The method and apparatus is designed to test continuity of individual contact pins via connection of a contact test pad assembly to a plurality of pins within a user defined pin arrangement. The contact test pad assembly has a plurality of contact points mounted thereon adapted to be in communication with individual contact pins within the defined pin arrangement. The system uses a test circuit in communication with the contact test pad assembly that is in communication with a power source and a controller that receives continuity information from the circuit and provides results to a user.