公开(公告)号：US20050287820A1

公开(公告)日：2005-12-29

申请号：US10518475

申请日：2003-06-16

Applicant: Torbjorn Ling ,  Lars Montelius ,  Matthias Keil ,  Marc Beck

Inventor： Torbjorn Ling ,  Lars Montelius ,  Matthias Keil ,  Marc Beck

IPC: B29C33/42 ,  B29C33/56 ,  B41M20060101 ,  B41M1/06 ,  B81C1/00 ,  G03F7/00 ,  G11B5/855 ,  H01L21/31 ,  H01L21/469

CPC classification number: B29C33/56 ,  B29C33/424 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017 ,  G11B5/855

Abstract: A metal mold for use in a nano-imprinting process comprises a firmly adhering monomolecular non-sticking layer. The later was obtained by subjecting the mold to a reaction with a fluoroalkyl compound having a mercapto group. As a result of said reaction, the layer comprises an organic sulfide of said metal.

Abstract translation: 用于纳米压印方法的金属模具包括牢固粘附的单分子不粘层。 后者是通过使模具与具有巯基的氟烷基化合物进行反应而获得的。 作为所述反应的结果，该层包含所述金属的有机硫化物。

公开(公告)号：US08426025B2

公开(公告)日：2013-04-23

申请号：US12635296

申请日：2009-12-10

Applicant: Matthias Keil ,  Jakob Nilsson ,  Johan Ring ,  Babak Heidari

Inventor： Matthias Keil ,  Jakob Nilsson ,  Johan Ring ,  Babak Heidari

IPC: B32B27/08

CPC classification number: B29C33/3857 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/31504 ,  Y10T428/3154

Abstract: The invention provides a modification of a polymer film surface interaction properties. In this process a polymer carrier object is covered by a chemical composition, comprising photo-polymerizable compounds, photo-initiators or catalysts with the ability to initiate polymerization and semi-fluorinated molecules. The so-produced polymer mold contains semi-fluorinated moieties, which are predominantly located on the surface and on the surface near region of the patterned surface. The polymer mold is suitable as a template with modified properties in a nano-imprint lithography process.

Abstract translation: 本发明提供了聚合物膜表面相互作用特性的改进。 在该方法中，聚合物载体物体被包含可光聚合化合物，具有引发聚合能力和半氟化分子的光引发剂或催化剂的化学组合物覆盖。 如此生产的聚合物模具包含半氟化部分，其主要位于图案表面附近的表面和表面附近。 聚合物模具适合作为纳米压印光刻工艺中具有改性特性的模板。

公开(公告)号：US20070166557A1

公开(公告)日：2007-07-19

申请号：US11597570

申请日：2005-05-27

Applicant: Matthias Keil ,  Goran Frennesson ,  Marc Beck ,  Babak Heidari

Inventor： Matthias Keil ,  Goran Frennesson ,  Marc Beck ,  Babak Heidari

IPC: B22C3/00 ,  B32B15/04

CPC classification number: B05D1/60 ,  B05D1/185 ,  B29C33/56 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017 ,  Y10T428/31678

Abstract: The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected from the group consisting of phosphonic acids, phosphonic acids, phosphonates and phosphonate salts, phosphonates and phosphonate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.

Abstract translation: 本发明涉及一种具有抗粘性的新型金属模具，其特征在于包括贱金属模和包含磷原子和烷基链的氟化烷基磷酸衍生物或氟化烷基聚磷酸衍生物的防粘层。 抗粘剂层直接粘结在母模金属模的表面上。 贱金属模可以是例如。 镍和所述氟化烷基磷酸衍生物或所述氟代烷基聚磷酸衍生物可以选自膦酸，膦酸，膦酸酯和膦酸盐，膦酸盐和膦酸盐或它们各自的低聚物，使得 磷原子直接与烷基链结合，使得磷原子直接与烷基链结合。

公开(公告)号：US20130201614A1

公开(公告)日：2013-08-08

申请号：US13878369

申请日：2011-09-23

Applicant: Matthias Keil

Inventor： Matthias Keil

IPC: H05K7/20 ,  H05K13/04

CPC classification number: H05K7/20409 ,  H01L21/565 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K13/04 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic module and to a method for producing same, comprising a mould body (2), a first circuit carrier (3; 13) having a first inner face (3a; 13a), on which electronic components (5) are arranged, and a first outer face (3b; 13b), a second circuit carrier (4; 14) having a second inner face (4a; 14a), on which electronic components (5) are arranged, and a second outer face (4b; 14b), and at least one spring device (6, 7; 16) which connects the inner faces (3a, 14a; 13a, 14a), or surfaces of electronic components (5) arranged thereon, of the first and second circuit carriers (3, 4; 13, 14), wherein the first and second outer faces (3a, 4a; 13a, 14a) are exposed towards the outside of the electronic module in order to emit heat directly to the outside, and wherein the first and second outer faces (3a, 4a; 13a, 14a) are parallel to each other.

Abstract translation: 本发明涉及一种电子模块及其制造方法，包括模体（2），具有第一内表面（3a; 13a）的第一电路载体（3; 13），电子部件（5） 和第一外表面（3b; 13b），具有第二内表面（4a; 14a）的第二电路载体（4; 14），电子元件（5）布置在其上，第二外表面 4b，14b）和连接第一和第二电路的内表面（3a，14a; 13a，14a）或其上布置的电子元件（5）的表面的至少一个弹簧装置（6,7; 16） 载体（3,4; 13,14），其中所述第一和第二外表面（3a，4a; 13a，14a）朝向所述电子模块的外部暴露，以便将热量直接发射到外部，并且其中所述第一 和第二外表面（3a，4a; 13a，14a）彼此平行。

公开(公告)号：US20120297856A1

公开(公告)日：2012-11-29

申请号：US13576411

申请日：2010-02-05

Applicant: Matthias Keil ,  Gang Luo ,  Ye Zhou

Inventor： Matthias Keil ,  Gang Luo ,  Ye Zhou

IPC: B21D31/00

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

Abstract: A method and process for obtaining a metal stamp from an intermediate polymer stamp comprising the steps of providing a first print layer on top of a first polymer layer, imprinting structures to obtain an intermediate stamp. A conductive layer is provided on top of the structures to obtain a seed layer if the imprinted polymer is a non-conductive, plating metal on top of the intermediate polymer stamp to obtain a metal stamp then separating the intermediate stamp from the metal stamp. This invention demonstrates stamp replication in high throughput and at low cost.

Abstract translation: 一种用于从中间聚合物印模获得金属印模的方法和方法，包括以下步骤：在第一聚合物层的顶部上提供第一印刷层，压印结构以获得中间印模。 如果压印的聚合物是不导电的，在中间聚合物印模的顶部上镀覆金属，以获得金属印模，然后将中间印模与金属印模分离，则在结构的顶部上提供导电层以获得种子层。 本发明以高产量和低成本证明印模复制。

公开(公告)号：US08119197B2

公开(公告)日：2012-02-21

申请号：US12751239

申请日：2010-03-31

Applicant: Matthias Keil ,  Göran Frennesson ,  Marc Beck ,  Babak Heidari

Inventor： Matthias Keil ,  Göran Frennesson ,  Marc Beck ,  Babak Heidari

IPC: C23C16/00 ,  B05D3/00

CPC classification number: B05D1/60 ,  B05D1/185 ,  B29C33/56 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017 ,  Y10T428/31678

Abstract: The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected front the group consisting of phosphonic acids, phosphinic acids, phosphonates and phosphonate salts, phosphinates and phosphinate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.

Abstract translation: 本发明涉及一种具有抗粘性的新型金属模具，其特征在于包括贱金属模和包含磷原子和烷基链的氟化烷基磷酸衍生物或氟化烷基多磷酸衍生物的防粘层。 抗粘剂层直接粘结在母模金属模的表面上。 贱金属模可以是例如。 镍和所述氟化烷基磷酸衍生物或所述氟代烷基聚磷酸衍生物可以选自由膦酸，次膦酸，膦酸盐和膦酸盐，次膦酸盐和次膦酸盐或它们各自的低聚物组成的组， 磷原子直接与烷基链结合，使得磷原子直接与烷基链结合。

公开(公告)号：US09063408B2

公开(公告)日：2015-06-23

申请号：US12635329

申请日：2009-12-10

Applicant: Jakob Nilsson ,  Matthias Keil ,  Johan Ring ,  Babak Heidari

Inventor： Jakob Nilsson ,  Matthias Keil ,  Johan Ring ,  Babak Heidari

IPC: G03F7/00 ,  G03F7/038 ,  C08F2/50 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/004

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0048 ,  G03F7/038

Abstract: The invention to provide curable materials, comprising photo-reactive compounds, in particular, photoinitiators and polymerizable mono- or multifunctional monomers such as acrylates or epoxides. The material may also contain fluoro-surfactants completely or partly terminated by functional groups with the ability to bind covalently to said chemical composition under curing. The curable compositions are either purely acrylate based or a hybrid of different types of monomers such as acrylates, epoxides or vinyl ethers. The polymerizable monomers may cure with the use of different types of photoinitiator, such as free radical photoinitiators or cationic photoinitiators, ultimately forming a hybrid resist comprising interpenetrating networks of different types of monomers e.g. acrylates and epoxides. The acrylate/epoxide hybrid system has showed improved replication properties in terms of high nano-imprint lithography process fidelity, due to increased conversion of acrylates and low shrinkage.

Abstract translation: 本发明提供可固化材料，其包含光反应性化合物，特别是光引发剂和可聚合的单或多官能单体如丙烯酸酯或环氧化物。 该材料还可以含有完全或部分由官能团封端的氟表面活性剂，其具有在固化下与所述化学组合物共价键合的能力。 可固化组合物是纯丙烯酸酯基或不同类型的单体如丙烯酸酯，环氧化物或乙烯基醚的杂化物。 可聚合单体可以使用不同类型的光引发剂（例如自由基光引发剂或阳离子光引发剂）固化，最终形成包含不同类型单体的互穿网络的混合抗蚀剂。 丙烯酸酯和环氧化物。 由于丙烯酸酯的转化率增加和收缩率低，丙烯酸酯/环氧化物混合体系在高纳米压印光刻工艺保真度方面具有改进的复制性能。

公开(公告)号：US08970030B2

公开(公告)日：2015-03-03

申请号：US13878369

申请日：2011-09-23

Applicant: Matthias Keil

Inventor： Matthias Keil

IPC: H01L23/34 ,  H05K7/20 ,  H01L21/56 ,  H01L23/495 ,  H05K13/04 ,  H01L23/00

CPC classification number: H05K7/20409 ,  H01L21/565 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K13/04 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic module and to a method for producing same, comprising a mold body (2), a first circuit carrier (3; 13) having a first inner face (3a; 13a), on which electronic components (5) are arranged, and a first outer face (3b; 13b), a second circuit carrier (4; 14) having a second inner face (4a; 14a), on which electronic components (5) are arranged, and a second outer face (4b; 14b), and at least one spring device (6, 7; 16) which connects the inner faces (3a, 14a; 13a, 14a), or surfaces of electronic components (5) arranged thereon, of the first and second circuit carriers (3, 4; 13, 14), wherein the first and second outer faces (3a, 4a; 13a, 14a) are exposed towards the outside of the electronic module in order to emit heat directly to the outside, and wherein the first and second outer faces (3a, 4a; 13a, 14a) are parallel to each other.

Abstract translation: 本发明涉及一种电子模块及其制造方法，包括模体（2），具有第一内表面（3a; 13a）的第一电路载体（3; 13），电子部件（5） 和第一外表面（3b; 13b），具有第二内表面（4a; 14a）的第二电路载体（4; 14），电子元件（5）布置在其上，第二外表面 4b，14b）和连接第一和第二电路的内表面（3a，14a; 13a，14a）或其上布置的电子元件（5）的表面的至少一个弹簧装置（6,7; 16） 载体（3,4; 13,14），其中所述第一和第二外表面（3a，4a; 13a，14a）朝向所述电子模块的外部暴露，以便将热量直接发射到外部，并且其中所述第一 和第二外表面（3a，4a; 13a，14a）彼此平行。

公开(公告)号：US07854873B2

公开(公告)日：2010-12-21

申请号：US11450377

申请日：2006-06-12

Applicant: Babak Heidari ,  Marc Beck ,  Matthias Keil

Inventor： Babak Heidari ,  Marc Beck ,  Matthias Keil

IPC: B29C59/02

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G11B7/263 ,  Y10T428/24355 ,  Y10T428/31504

Abstract: A method is provided for transferring a pattern from a template (1) to an object (12) in an imprint process, using a two-step process. The first step includes contacting a pattern of the template surface with a polymer material comprising one or more Cyclic Olefin Copolymers (COCs), to produce a flexible polymer replica having a structured surface with an inverse of the pattern of the template surface. In a second step, after releasing the flexible polymer replica from the template, the inverse pattern of the flexible polymer replica is pressed into a resist layer on a substrate, to imprint a replica of the pattern of the template surface in therein.

Abstract translation: 提供了一种用于使用两步法在压印过程中将图案从模板（1）传送到对象（12）的方法。 第一步包括将模板表面的图案与包含一种或多种环烯烃共聚物（COC）的聚合物材料接触，以产生具有与模板表面图案相反的结构化表面的柔性聚合物复制品。 在第二步骤中，在从模板中释放柔性聚合物复制品之后，将柔性聚合物复制品的反向图案压入基板上的抗蚀剂层中，以在其中印刷模板表面的图案的副本。

公开(公告)号：US07717693B2

公开(公告)日：2010-05-18

申请号：US11597570

申请日：2005-05-27

Applicant: Matthias Keil ,  Göran Frennesson ,  Marc Beck ,  Babak Heidari

Inventor： Matthias Keil ,  Göran Frennesson ,  Marc Beck ,  Babak Heidari

IPC: B29C59/00 ,  B29C33/56 ,  B28B7/38

CPC classification number: B05D1/60 ,  B05D1/185 ,  B29C33/56 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017 ,  Y10T428/31678

Abstract: The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected from the group consisting of phosphonic acids, phosphonic acids, phosphonates and phosphonate salts, phosphonates and phosphonate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.

Abstract translation: 本发明涉及一种具有抗粘性的新型金属模具，其特征在于包括贱金属模和包含磷原子和烷基链的氟化烷基磷酸衍生物或氟化烷基聚磷酸衍生物的防粘层。 抗粘剂层直接粘结在母模金属模的表面上。 贱金属模可以是例如。 镍和所述氟代烷基磷酸衍生物或所述氟化烷基聚磷酸衍生物可以选自膦酸，膦酸，膦酸盐和膦酸盐，膦酸盐和膦酸盐或它们各自的低聚物，使得 磷原子直接与烷基链结合，使得磷原子直接与烷基链结合。