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    FORMATION OF A THERMOPILE SENSOR UTILIZING CMOS FABRICATION TECHNIQUES
    1.
    发明申请
    FORMATION OF A THERMOPILE SENSOR UTILIZING CMOS FABRICATION TECHNIQUES 有权
    使用CMOS制造技术形成热传感器

    公开(公告)号：US20150325770A1

    公开(公告)日：2015-11-12

    申请号：US14573156

    申请日：2014-12-17

    申请人： MAXIM INTEGRATED PRODUCTS, INC.

    发明人： Arvin Emadi ,  Stanley Barnett

    IPC分类号： H01L35/34 ,  H01L35/04 ,  H01L35/14

    CPC分类号： H01L35/00 ,  G01J5/0853 ,  G01J5/12 ,  H01L27/14649 ,  H01L35/04 ,  H01L35/14 ,  H01L35/325 ,  H01L35/34

    摘要： Techniques are described to form an absorption stack proximate to a thermopile sensor. In one or more implementations, a thermopile sensor is formed proximate to a semiconductor wafer. An absorption stack is formed proximate to the semiconductor wafer and includes a first layer, a second layer, and a third layer. The first layer may be a material having absorption and/or reflective characteristics. The second layer may be a material having wave phase shift characteristic characteristics. The third layer may be a material having a reflective characteristic.

    摘要翻译： 描述了技术以形成靠近热电堆传感器的吸收堆叠。 在一个或多个实施方案中，热电堆传感器形成在半导体晶片附近。 在半导体晶片附近形成吸收层，并且包括第一层，第二层和第三层。 第一层可以是具有吸收和/或反射特性的材料。 第二层可以是具有波相移特性的材料。 第三层可以是具有反射特性的材料。

    Thermopile temperature sensor with a reference sensor therein
    2.
    发明授权
    Thermopile temperature sensor with a reference sensor therein 有权

    公开(公告)号：US09851258B2

    公开(公告)日：2017-12-26

    申请号：US14671007

    申请日：2015-03-27

    申请人： Maxim Integrated Products, Inc.

    发明人： Cheng-Wei Pei ,  Craig A. Easson ,  Arvin Emadi ,  Nicole D. Kerness ,  Stanley Barnett

    IPC分类号： G01J5/00 ,  G01J5/12 ,  G01J5/04 ,  G01J5/06

    CPC分类号： G01J5/12 ,  G01J5/045 ,  G01J5/06 ,  G01J2005/068

    摘要： A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

    Light sensor having IR cut interference filter with color filter integrated on-chip
    3.
    发明授权
    Light sensor having IR cut interference filter with color filter integrated on-chip 有权
    具有红外线截止干涉滤光片的光传感器，集成片上滤色片

    公开(公告)号：US08809099B2

    公开(公告)日：2014-08-19

    申请号：US14044284

    申请日：2013-10-02

    申请人： Maxim Integrated Products, Inc.

    发明人： Zhihai Wang ,  Nicole D. Kerness ,  Stanley Barnett

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14621 ,  G02B5/285 ,  H01L27/14618 ,  H01L27/14645 ,  H01L27/14685 ,  H01L31/02162 ,  H01L31/02325 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Techniques are described to furnish a light sensor that includes a patterned IR interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR interference filter configured to block infrared light is disposed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors.

    摘要翻译： 描述了技术来提供光传感器，其包括与图案化彩色滤光器集成的图案化IR干涉滤光器。 在一个或多个实施方案中，光传感器包括具有表面的基板。 构造成阻挡红外光的IR干涉滤光器设置在基板的表面上。 光传感器还包括放置在IR干涉滤光片上方或下方的一个或多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。

    Light sensor having IR cut interference filter with color filter integrated on-chip
    5.
    发明授权
    Light sensor having IR cut interference filter with color filter integrated on-chip 有权
    具有红外线截止干涉滤光片的光传感器，集成片上滤色片

    公开(公告)号：US09129874B1

    公开(公告)日：2015-09-08

    申请号：US14461561

    申请日：2014-08-18

    申请人： Maxim Integrated Products, Inc.

    发明人： Zhihai Wang ,  Nicole D. Kerness ,  Stanley Barnett

    IPC分类号： H01L31/0232 ,  H01L27/146

    CPC分类号： H01L27/14621 ,  G02B5/285 ,  H01L27/14618 ,  H01L27/14645 ,  H01L27/14685 ,  H01L31/02162 ,  H01L31/02325 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Techniques are described to furnish a light sensor that includes a patterned IR interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR interference filter configured to block infrared light is disposed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors.

    摘要翻译： 描述了技术来提供光传感器，其包括与图案化彩色滤光器集成的图案化IR干涉滤光器。 在一个或多个实施方案中，光传感器包括具有表面的基板。 构造成阻挡红外光的IR干涉滤光器设置在基板的表面上。 光传感器还包括放置在IR干涉滤光片上方或下方的一个或多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。

    LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER INTEGRATED ON-CHIP
    7.
    发明申请
    LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER INTEGRATED ON-CHIP 有权
    具有彩色滤光片集成片上红外线切割干涉滤光片的光传感器

    公开(公告)号：US20140035012A1

    公开(公告)日：2014-02-06

    申请号：US14044284

    申请日：2013-10-02

    申请人： Maxim Integrated Products, Inc.

    发明人： Zhihai Wang ,  Nicole D. Kerness ,  Stanley Barnett

    IPC分类号： H01L31/0232 ,  H01L27/146

    CPC分类号： H01L27/14621 ,  G02B5/285 ,  H01L27/14618 ,  H01L27/14645 ,  H01L27/14685 ,  H01L31/02162 ,  H01L31/02325 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Techniques are described to furnish a light sensor that includes a patterned IR interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR interference filter configured to block infrared light is disposed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors.

    摘要翻译： 描述了技术来提供光传感器，其包括与图案化彩色滤光器集成的图案化IR干涉滤光器。 在一个或多个实施方案中，光传感器包括具有表面的基板。 构造成阻挡红外光的IR干涉滤光器设置在基板的表面上。 光传感器还包括放置在IR干涉滤光片上方或下方的一个或多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。

    THERMOPILE TEMPERATURE SENSOR FIELD OF VIEW NARROWING USING INTEGRATED LIGHT BLOCKING LAYER AND LENS
    8.
    发明申请
    THERMOPILE TEMPERATURE SENSOR FIELD OF VIEW NARROWING USING INTEGRATED LIGHT BLOCKING LAYER AND LENS 有权
    热敏温度传感器使用集成的光阻挡层和镜头的视野

    公开(公告)号：US20160282194A1

    公开(公告)日：2016-09-29

    申请号：US14865593

    申请日：2015-09-25

    申请人： Maxim Integrated Products, Inc.

    发明人： Stanley Barnett ,  Cheng-Wei Pei ,  Arvin Emadi ,  Jerome C. Bhat

    IPC分类号： G01K7/02 ,  H01L35/34 ,  H01L35/32

    CPC分类号： H01L35/34 ,  G01J5/022 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/04 ,  G01J5/0806 ,  G01J5/12 ,  G01J2005/065 ,  H01L35/32

    摘要： A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

    摘要翻译： 描述了一种传感器装置，传感器封装和用于制造传感器装置的方法，其包括设置在热电堆装置上的集成光阻挡器和配置成将光引导到热电堆装置的透镜。 在实施例中，热电堆装置包括基板; 设置在所述基板上的热电堆膜，所述热电堆膜包括至少一个钝化层; 设置在热电堆膜内的热电堆，热电堆包括至少一个热电偶; 以及靠近所述热电堆膜设置的遮光层，所述遮光层包括靠近所述热电堆设置的孔。

    THERMOPILE TEMPERATURE SENSOR WITH A REFERENCE SENSOR THEREIN
    9.
    发明申请
    THERMOPILE TEMPERATURE SENSOR WITH A REFERENCE SENSOR THEREIN 有权
    具有参考传感器的温度传感器

    公开(公告)号：US20160123816A1

    公开(公告)日：2016-05-05

    申请号：US14671007

    申请日：2015-03-27

    申请人： Maxim Integrated Products, Inc.

    发明人： Cheng-Wei Pei ,  Craig A. Easson ,  Arvin Emadi ,  Nicole D. Kerness ,  Stanley Barnett

    IPC分类号： G01J5/12

    CPC分类号： G01J5/12 ,  G01J5/045 ,  G01J5/06 ,  G01J2005/068

    摘要： A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

    摘要翻译： 具有热电堆传感器和设置在其中的参考热电堆传感器的传感器封装。 在一个或多个实施方案中，传感器封装包括衬底，设置在衬底上的热电堆传感器，设置在衬底上的参考热电堆传感器，以及设置在热电堆传感器和参考热电堆传感器上的盖组件。 盖组件包括通过在有限的波长范围内发生的电磁辐射和设置在盖组件上的电磁阻挡器的透明结构。 电磁阻挡器限定热电堆传感器上的孔，使得电磁阻挡器的至少一部分位于参考热电堆传感器上方。 电磁阻止器被配置为至少基本上阻挡在有限的波长范围内发生的电磁辐射到达参考热电堆传感器。