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    MEMS-based wafer level packaging for thermo-electric IR detectors
    1.
    发明授权
    MEMS-based wafer level packaging for thermo-electric IR detectors 有权

    公开(公告)号：US10439118B2

    公开(公告)日：2019-10-08

    申请号：US14958552

    申请日：2015-12-03

    Applicant: Maxim Integrated Products, Inc.

    Inventor： Arvin Emadi ,  Nicole D. Kerness ,  Arkadii V. Samoilov ,  Abhishek Sahasrabudhe

    IPC: G01J5/12 ,  H01L35/02 ,  H01L35/14 ,  H01L35/20 ,  G01J5/02 ,  H01L27/146

    Abstract: A device and techniques for fabricating the device are described for forming a wafer-level thermal sensor package using microelectromechanical system (MEMS) processes. In one or more implementations, a wafer level thermal sensor package includes a thermopile stack, which includes a substrate, a dielectric membrane, a first thermoelectric layer, a first interlayer dielectric, a second thermoelectric layer, a second interlayer dielectric, a metal connection assembly, a passivation layer, where the passivation layer includes at least one of a trench or a hole, and where the substrate includes a cavity adjacent to the at least one trench or hole, and a bond pad disposed on the passivation layer and electrically coupled to the metal connection assembly; and a cap wafer assembly coupled to the thermopile stack, the cap wafer assembly including a wafer having a cavity formed on a side of the wafer configured to be adjacent to the thermopile stack.

    Time of flight sensors and sensing methods
    3.
    发明授权
    Time of flight sensors and sensing methods 有权

    公开(公告)号：US12164063B2

    公开(公告)日：2024-12-10

    申请号：US17861238

    申请日：2022-07-10

    Applicant: Maxim Integrated Products, Inc.

    Inventor： Arvin Emadi ,  Charles J. Razzell ,  John P. Hanks

    IPC: G01C3/08 ,  G01S7/4913 ,  G01S7/4915 ,  G01S17/36

    Abstract: A time of flight sensor includes a time of flight (TOF) processor having a digital TOF port, a digital input port, and a digital output port, the TOF processor comprising a phase detector including cyclically rotating demultiplexer (DEMUX), a first summer coupled to a first DEMUX output, a second summer coupled to a second DEMUX output, a third summer coupled to a third DEMUX output, a fourth summer coupled to a fourth DEMUX output, and a phase estimator coupled to outputs of the first summer, the second summer, the third summer and the fourth summer and having a phase estimate output; a driver having a digital driver port coupled to the digital TOF port and a driver output port; and an analog-to-digital converter (ADC) having an output port coupled to the digital input port of the digital TOF processor.

    Fully integrated gas concentration sensor
    4.
    发明授权
    Fully integrated gas concentration sensor 有权

    公开(公告)号：US10168211B1

    公开(公告)日：2019-01-01

    申请号：US15836219

    申请日：2017-12-08

    Applicant: Maxim Integrated Products, Inc.

    Inventor： Arvin Emadi ,  Arkadii V. Samoilov ,  Nicole D. Kerness

    IPC: G01J3/26 ,  G01N21/3504 ,  G01J3/10 ,  G01J3/42

    Abstract: A gas concentration sensor is includes an integrated die-form electromagnetic radiation source and an integrated die-form infrared detector. In one or more implementations, the gas concentration sensor includes a package substrate defining at least one aperture, a gas permeable mesh coupled to the package substrate and covering at least a portion of the at least one aperture, a die-form electromagnetic radiation source positioned in an interior region of the package substrate, a die-form detector positioned in the interior region of the package substrate, and control circuitry operably coupled to the die-form detector and configured to detect and calibrate one or more signal outputs from the die-form detector to determine a gas concentration within the interior region of the package substrate. The gas concentration sensor can be configured for specific detection of various gases through control of the spectral wavelengths emitted by the electromagnetic radiation source(s) and/or detected by the detector(s).

    System including distance sensor for non-contact temperature sensing
    5.
    发明授权
    System including distance sensor for non-contact temperature sensing 有权

    公开(公告)号：US09891110B1

    公开(公告)日：2018-02-13

    申请号：US14669335

    申请日：2015-03-26

    Applicant: Maxim Integrated Products, Inc.

    Inventor： Cheng-Wei Pei ,  Arvin Emadi

    IPC: G01J5/02

    CPC classification number: G01J5/0275 ,  G01J5/026

    Abstract: A system includes a temperature sensor and a distance sensor. The distance sensor provides an indication of distance between the temperature sensor and an object to be measured. By determining the distance between the temperature sensor and the object, the system determines whether the object is sufficiently close to the temperature sensor to make an accurate temperature measurement, such as by determining whether the object completely fills the field of view of the sensor. In an implementation, the distance sensor includes a light source and a photodetector configured to detect light having wavelengths that correspond to those generated by the light source.

    THERMOPILE TEMPERATURE SENSOR FIELD OF VIEW NARROWING USING INTEGRATED LIGHT BLOCKING LAYER AND LENS
    6.
    发明申请
    THERMOPILE TEMPERATURE SENSOR FIELD OF VIEW NARROWING USING INTEGRATED LIGHT BLOCKING LAYER AND LENS 有权
    热敏温度传感器使用集成的光阻挡层和镜头的视野

    公开(公告)号：US20160282194A1

    公开(公告)日：2016-09-29

    申请号：US14865593

    申请日：2015-09-25

    Applicant: Maxim Integrated Products, Inc.

    Inventor： Stanley Barnett ,  Cheng-Wei Pei ,  Arvin Emadi ,  Jerome C. Bhat

    IPC: G01K7/02 ,  H01L35/34 ,  H01L35/32

    CPC classification number: H01L35/34 ,  G01J5/022 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/04 ,  G01J5/0806 ,  G01J5/12 ,  G01J2005/065 ,  H01L35/32

    Abstract: A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

    Abstract translation: 描述了一种传感器装置，传感器封装和用于制造传感器装置的方法，其包括设置在热电堆装置上的集成光阻挡器和配置成将光引导到热电堆装置的透镜。 在实施例中，热电堆装置包括基板; 设置在所述基板上的热电堆膜，所述热电堆膜包括至少一个钝化层; 设置在热电堆膜内的热电堆，热电堆包括至少一个热电偶; 以及靠近所述热电堆膜设置的遮光层，所述遮光层包括靠近所述热电堆设置的孔。

    THERMOPILE TEMPERATURE SENSOR WITH A REFERENCE SENSOR THEREIN
    7.
    发明申请
    THERMOPILE TEMPERATURE SENSOR WITH A REFERENCE SENSOR THEREIN 有权
    具有参考传感器的温度传感器

    公开(公告)号：US20160123816A1

    公开(公告)日：2016-05-05

    申请号：US14671007

    申请日：2015-03-27

    Applicant: Maxim Integrated Products, Inc.

    Inventor： Cheng-Wei Pei ,  Craig A. Easson ,  Arvin Emadi ,  Nicole D. Kerness ,  Stanley Barnett

    IPC: G01J5/12

    CPC classification number: G01J5/12 ,  G01J5/045 ,  G01J5/06 ,  G01J2005/068

    Abstract: A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

    Abstract translation: 具有热电堆传感器和设置在其中的参考热电堆传感器的传感器封装。 在一个或多个实施方案中，传感器封装包括衬底，设置在衬底上的热电堆传感器，设置在衬底上的参考热电堆传感器，以及设置在热电堆传感器和参考热电堆传感器上的盖组件。 盖组件包括通过在有限的波长范围内发生的电磁辐射和设置在盖组件上的电磁阻挡器的透明结构。 电磁阻挡器限定热电堆传感器上的孔，使得电磁阻挡器的至少一部分位于参考热电堆传感器上方。 电磁阻止器被配置为至少基本上阻挡在有限的波长范围内发生的电磁辐射到达参考热电堆传感器。

    TIME OF FLIGHT SENSORS AND SENSING METHODS
    9.
    发明申请
    TIME OF FLIGHT SENSORS AND SENSING METHODS 有权

    公开(公告)号：US20220350004A1

    公开(公告)日：2022-11-03

    申请号：US17861238

    申请日：2022-07-10

    Applicant: Maxim Integrated Products, Inc.

    Inventor： Arvin Emadi ,  Charles J. Razzell ,  John P. Hanks

    IPC: G01S7/4913 ,  G01S7/4915 ,  G01S17/36

    Abstract: A time of flight sensor includes a time of flight (TOF) processor having a digital TOF port, a digital input port, and a digital output port, the TOF processor comprising a phase detector including cyclically rotating demultiplexer (DEMUX), a first summer coupled to a first DEMUX output, a second summer coupled to a second DEMUX output, a third summer coupled to a third DEMUX output, a fourth summer coupled to a fourth DEMUX output, and a phase estimator coupled to outputs of the first summer, the second summer, the third summer and the fourth summer and having a phase estimate output; a driver having a digital driver port coupled to the digital TOF port and a driver output port; and an analog-to-digital converter (ADC) having an output port coupled to the digital input port of the digital TOF processor.

    Non-contact temperature measurement sensor
    10.
    发明授权
    Non-contact temperature measurement sensor 有权

    公开(公告)号：US10436647B2

    公开(公告)日：2019-10-08

    申请号：US16149627

    申请日：2018-10-02

    Applicant: Maxim Integrated Products, Inc.

    Inventor： Jerome C. Bhat ,  Kuolung Lei ,  Craig A. Easson ,  Arvin Emadi ,  Judy Hermann

    IPC: G01J5/00 ,  G01K1/00 ,  G01K1/08 ,  G01J5/12 ,  G01J5/04 ,  G01J5/02 ,  G01J5/06 ,  G01J5/08

    Abstract: The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.

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