公开(公告)号：US09534955B2

公开(公告)日：2017-01-03

申请号：US14671063

申请日：2015-03-27

申请人： Maxim Integrated Products, Inc.

发明人： Christopher F. Edwards ,  Dan G. Allen ,  Cheng-Wei Pei ,  Timothy K. McGuire ,  Joy T. Jones ,  Nicole D. Kerness

IPC分类号： G01T1/24 ,  G01J3/28 ,  G01J3/36 ,  G01J1/04 ,  G01J1/42

CPC分类号： G01J3/2803 ,  G01J1/0488 ,  G01J1/4228 ,  G01J1/429 ,  G01J3/36 ,  G01J2001/4266 ,  G01J2003/2806

摘要： The present disclosure describes an ultraviolet (UV) sensor configured to detect a target UV spectrum (e.g., UVB spectrum). The UV sensor includes a first photodiode with a first UV spectral response and a second photodiode with a second UV spectral response. A filter layer having a graded spectral response is formed over the second photodiode, and the second UV spectral response is affected by a controlled parameter (e.g., thickness) of the filter layer. The UV sensor further includes a subtraction circuit coupled with the first photodiode and the second photodiode. The subtraction circuit is configured to provide a differential response based on a difference between the first UV spectral response and the second UV spectral response. The controlled parameter of the filter layer can be selected such that the differential response provides a detected spectral response of the target spectrum.

摘要翻译： 本公开描述了配置成检测目标UV光谱（例如UVB光谱）的紫外（UV）传感器。 UV传感器包括具有第一UV光谱响应的第一光电二极管和具有第二UV光谱响应的第二光电二极管。 在第二光电二极管上形成具有梯度光谱响应的滤光层，并且第二UV光谱响应受过滤层的受控参数（例如，厚度）的影响。 UV传感器还包括与第一光电二极管和第二光电二极管耦合的减法电路。 减法电路被配置为基于第一UV光谱响应和第二UV光谱响应之间的差异提供差分响应。 可以选择滤波层的受控参数，使得差分响应提供检测到的目标光谱的光谱响应。

公开(公告)号：US20160163942A1

公开(公告)日：2016-06-09

申请号：US14958552

申请日：2015-12-03

申请人： Maxim Integrated Products, Inc.

发明人： Arvin Emadi ,  Nicole D. Kerness ,  Arkadii V. Samoilov ,  Abhishek Sahasrabudhe

IPC分类号： H01L35/02 ,  H01L35/20 ,  H01L35/14

CPC分类号： H01L35/02 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/12 ,  H01L27/14649 ,  H01L35/14 ,  H01L35/20

摘要： A device and techniques for fabricating the device are described for forming a wafer-level thermal sensor package using microelectromechanical system (MEMS) processes. In one or more implementations, a wafer level thermal sensor package includes a thermopile stack, which includes a substrate, a dielectric membrane, a first thermoelectric layer, a first interlayer dielectric, a second thermoelectric layer, a second interlayer dielectric, a metal connection assembly, a passivation layer, where the passivation layer includes at least one of a trench or a hole, and where the substrate includes a cavity adjacent to the at least one trench or hole, and a bond pad disposed on the passivation layer and electrically coupled to the metal connection assembly; and a cap wafer assembly coupled to the thermopile stack, the cap wafer assembly including a wafer having a cavity formed on a side of the wafer configured to be adjacent to the thermopile stack.

摘要翻译： 描述了用于制造该器件的器件和技术，用于使用微机电系统（MEMS）工艺形成晶片级热传感器封装。 在一个或多个实施方案中，晶片级热传感器封装包括热电堆，其包括基板，介电膜，第一热电层，第一层间电介质，第二热电层，第二层间电介质，金属连接组件 钝化层，其中所述钝化层包括沟槽或孔中的至少一个，并且其中所述衬底包括与所述至少一个沟槽或孔相邻的空腔，以及设置在所述钝化层上并且电耦合到 金属连接组件; 以及联接到所述热电堆叠的盖晶片组件，所述盖晶片组件包括晶片，所述晶片具有形成在所述晶片的一侧上的空腔，所述晶片被配置为与所述热堆叠相邻。

公开(公告)号：US20160131525A1

公开(公告)日：2016-05-12

申请号：US14671063

申请日：2015-03-27

申请人： Maxim Integrated Products, Inc.

发明人： Christopher F. Edwards ,  Dan G. Allen ,  Cheng-Wei Pei ,  Timothy K. McGuire ,  Joy T. Jones ,  Nicole D. Kerness

IPC分类号： G01J3/28 ,  G01J3/36

CPC分类号： G01J3/2803 ,  G01J1/0488 ,  G01J1/4228 ,  G01J1/429 ,  G01J3/36 ,  G01J2001/4266 ,  G01J2003/2806

摘要： The present disclosure describes an ultraviolet (UV) sensor configured to detect a target UV spectrum (e.g., UVB spectrum). The UV sensor includes a first photodiode with a first UV spectral response and a second photodiode with a second UV spectral response. A filter layer having a graded spectral response is formed over the second photodiode, and the second UV spectral response is affected by a controlled parameter (e.g., thickness) of the filter layer. The UV sensor further includes a subtraction circuit coupled with the first photodiode and the second photodiode. The subtraction circuit is configured to provide a differential response based on a difference between the first UV spectral response and the second UV spectral response. The controlled parameter of the filter layer can be selected such that the differential response provides a detected spectral response of the target spectrum.

摘要翻译： 本公开描述了配置成检测目标UV光谱（例如UVB光谱）的紫外（UV）传感器。 UV传感器包括具有第一UV光谱响应的第一光电二极管和具有第二UV光谱响应的第二光电二极管。 在第二光电二极管上形成具有梯度光谱响应的滤光层，并且第二UV光谱响应受过滤层的受控参数（例如，厚度）的影响。 UV传感器还包括与第一光电二极管和第二光电二极管耦合的减法电路。 减法电路被配置为基于第一UV光谱响应和第二UV光谱响应之间的差异提供差分响应。 可以选择滤波层的受控参数，使得差分响应提供检测到的目标光谱的光谱响应。

公开(公告)号：US20150338273A1

公开(公告)日：2015-11-26

申请号：US14580406

申请日：2014-12-23

申请人： Maxim Integrated Products, Inc.

发明人： Arvin Emadi ,  Nicole D. Kerness ,  Cheng-Wei Pei ,  Joy T. Jones ,  Arkadii V. Samoilov ,  Ke-Cai Zeng

IPC分类号： G01J1/42 ,  G01J1/04 ,  G01J3/02

CPC分类号： G01J1/429 ,  G01J1/0488 ,  H01L31/02162 ,  H01L31/101

摘要： Techniques are provided to furnish a light sensor that includes a filter positioned over a photodetector to filter visible and infrared wavelengths to permit the sensing of ultraviolet (UV) wavelengths. In one or more implementations, the light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. A photodetector (e.g., photodiode, phototransistor, etc.) is formed in the substrate proximate to the surface of the substrate. In one or more implementations, the substrate comprises a silicon on insulator substrate (SOI). A filter (e.g., absorption filter, interference filter, flat pass filter, McKinlay-Diffey Erythema Action Spectrum-based filter, UVA/UVB filter, and so forth) is disposed over the photodetector. The filter is configured to filter infrared light and visible light from light received by the light sensor to at least substantially block infrared light and visible light from reaching the photodetector. The thickness of the SOI substrate can be tailored to modify received UV/visible wavelength ratios.

摘要翻译： 提供技术来提供光传感器，其包括位于光电检测器上方的过滤器，以过滤可见光和红外波长以允许感测紫外（UV）波长。 在一个或多个实施方式中，光传感器包括包括衬底的半导体器件（例如裸片）。 光电探测器（例如，光电二极管，光电晶体管等）形成在靠近衬底表面的衬底中。 在一个或多个实施方案中，衬底包括绝缘体上硅衬底（SOI）。 滤光器（例如，吸收滤光器，干涉滤光器，平通滤光片，McKinlay-Diffey Erythema Action Spectrum滤光片，UVA / UVB滤光片等）设置在光电探测器上。 过滤器被配置为从由光传感器接收的光中过滤红外光和可见光，以至少基本上阻挡红外光和可见光到达光电检测器。 可以调整SOI衬底的厚度以修改接收的UV /可见波长比。

公开(公告)号：US20140035012A1

公开(公告)日：2014-02-06

申请号：US14044284

申请日：2013-10-02

申请人： Maxim Integrated Products, Inc.

发明人： Zhihai Wang ,  Nicole D. Kerness ,  Stanley Barnett

IPC分类号： H01L31/0232 ,  H01L27/146

CPC分类号： H01L27/14621 ,  G02B5/285 ,  H01L27/14618 ,  H01L27/14645 ,  H01L27/14685 ,  H01L31/02162 ,  H01L31/02325 ,  H01L2924/0002 ,  H01L2924/00

摘要： Techniques are described to furnish a light sensor that includes a patterned IR interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR interference filter configured to block infrared light is disposed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors.

摘要翻译： 描述了技术来提供光传感器，其包括与图案化彩色滤光器集成的图案化IR干涉滤光器。 在一个或多个实施方案中，光传感器包括具有表面的基板。 构造成阻挡红外光的IR干涉滤光器设置在基板的表面上。 光传感器还包括放置在IR干涉滤光片上方或下方的一个或多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。

公开(公告)号：US10439118B2

公开(公告)日：2019-10-08

申请号：US14958552

申请日：2015-12-03

申请人： Maxim Integrated Products, Inc.

发明人： Arvin Emadi ,  Nicole D. Kerness ,  Arkadii V. Samoilov ,  Abhishek Sahasrabudhe

IPC分类号： G01J5/12 ,  H01L35/02 ,  H01L35/14 ,  H01L35/20 ,  G01J5/02 ,  H01L27/146

摘要： A device and techniques for fabricating the device are described for forming a wafer-level thermal sensor package using microelectromechanical system (MEMS) processes. In one or more implementations, a wafer level thermal sensor package includes a thermopile stack, which includes a substrate, a dielectric membrane, a first thermoelectric layer, a first interlayer dielectric, a second thermoelectric layer, a second interlayer dielectric, a metal connection assembly, a passivation layer, where the passivation layer includes at least one of a trench or a hole, and where the substrate includes a cavity adjacent to the at least one trench or hole, and a bond pad disposed on the passivation layer and electrically coupled to the metal connection assembly; and a cap wafer assembly coupled to the thermopile stack, the cap wafer assembly including a wafer having a cavity formed on a side of the wafer configured to be adjacent to the thermopile stack.

公开(公告)号：US09472696B1

公开(公告)日：2016-10-18

申请号：US14455981

申请日：2014-08-11

申请人： Maxim Integrated Products, Inc.

发明人： Nicole D. Kerness ,  Arkadii V. Samoilov ,  Zhihai Wang ,  Joy T. Jones

IPC分类号： H01L31/0232 ,  G01S17/58 ,  H01L31/112 ,  H01L31/102 ,  H01L31/18

CPC分类号： H01L31/02327 ,  G01S17/58 ,  H01L27/1446 ,  H01L31/102 ,  H01L31/112 ,  H01L31/167 ,  H01L31/18

摘要： Techniques are described to furnish an IR suppression filter, or any other interference based filter, that is formed on a transparent substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate. The photodetectors are configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a transparent substrate. The light sensor may also include a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer.

摘要翻译： 描述了将技术描述为在光传感器的透明基板上形成的IR抑制滤波器或任何其它基于干涉的滤波器。 在一个或多个实施方式中，光传感器包括具有表面的基板。 在衬底中形成一个或多个光电检测器。 光电检测器被配置为检测光并响应于此提供信号。 构造成阻挡红外光到达表面的IR抑制滤光器形成在透明基板上。 光传感器还可以包括布置在表面上的多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。 缓冲层设置在表面上并且被配置为封装多个彩色通过滤光片和粘附层。

公开(公告)号：US09472586B1

公开(公告)日：2016-10-18

申请号：US14341883

申请日：2014-07-28

申请人： Maxim Integrated Products, Inc.

发明人： Nicole D. Kerness ,  Arkadii V. Samoilov ,  Zhihai Wang ,  Joy T. Jones

IPC分类号： H01L27/146

CPC分类号： H01L27/14621 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02165 ,  H01L31/02327 ,  H01L31/18 ,  H01L2224/13

摘要： Techniques are described to furnish an IR suppression filter that is formed on a glass substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate and configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a glass substrate. The light sensor also includes a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. The light sensor further includes through-silicon vias to provide electrical interconnections between different conductive layers.

摘要翻译： 描述了技术来提供在玻璃基板上形成到光传感器的IR抑制滤光器。 在一个或多个实施方式中，光传感器包括具有表面的基板。 在衬底中形成一个或多个光电检测器，并配置成检测光并响应于此提供信号。 配置为阻挡红外光到达表面的IR抑制滤光器形成在玻璃基板上。 光传感器还包括布置在表面上的多个彩色滤光片。 彩色通过滤光器被配置为过滤可见光以将有限的波长光中的光传递到一个或多个光电检测器。 缓冲层设置在表面上并且被配置为封装多个彩色通过滤光片和粘附层。 光传感器还包括穿硅通孔，以提供不同导电层之间的电互连。

公开(公告)号：US09354111B2

公开(公告)日：2016-05-31

申请号：US14277263

申请日：2014-05-14

申请人： Maxim Integrated Products, Inc.

发明人： Nicole D. Kerness ,  Arkadii V. Samoilov ,  Jerome C. Bhat ,  Anand Chamakura ,  Kumar Nagarajan ,  Christopher F. Edwards

IPC分类号： F21V14/00 ,  G01J1/04 ,  G01J1/02 ,  G01J1/08 ,  G01J1/42

CPC分类号： G01J1/0411 ,  G01J1/0271 ,  G01J1/08 ,  G01J1/4204

摘要： A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment.

摘要翻译： 描述了晶片级光学器件，系统和方法，其包括衬底，设置在衬底上的电子器件，设置在电子器件上的照明源，设置在衬底上的外壳，其中外壳包括至少一个光学表面 并且覆盖电子设备和照明源，以及设置在远离电子设备的基板侧的至少一个焊球。 在实现中，使用采用本公开技术的晶片级光学器件和透镜集成封装系统的方法包括接收衬底，将电子器件放置在衬底上，将照明源放置在电子器件上，以及放置 基板上的外壳，其中外壳覆盖电子设备和照明源，并且外壳和壁结构形成第一隔间和第二隔间。

公开(公告)号：US09322901B2

公开(公告)日：2016-04-26

申请号：US14141611

申请日：2013-12-27

申请人： Maxim Integrated Products, Inc.

发明人： Nicole D. Kerness ,  Joy T. Jones ,  Christopher F. Edwards ,  Arkadii V. Samoilov ,  Phillip J. Benzel ,  Richard I. Olsen ,  Peter R. Harper

IPC分类号： G01S17/00 ,  G01S7/481 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/173 ,  G01S17/02 ,  G01S17/58

CPC分类号： G01S7/4813 ,  G01S17/026 ,  G01S17/58 ,  H01L31/02162 ,  H01L31/02325 ,  H01L31/173 ,  H01L2224/16225

摘要： Optical devices are described that integrate multiple heterogeneous components in a single, compact package. In one or more implementations, the optical devices include a carrier substrate having a surface that includes two or more cavities formed therein. One or more optical component devices are disposed within the respective cavities in a predetermined arrangement. A cover is disposed on the surface of the carrier substrate so that the cover at least substantially encloses the optical component devices within their respective cavities. The cover, which may be glass, is configured to transmit light within the predetermined spectrum of wavelengths.

摘要翻译： 描述了在单个紧凑型封装中集成多个异构组件的光学器件。 在一个或多个实施方式中，光学装置包括具有包括形成在其中的两个或更多个腔的表面的载体衬底。 一个或多个光学部件装置以预定布置设置在相应的空腔内。 盖子设置在载体基板的表面上，使得盖子至少基本上将光学部件装置封闭在它们各自的空腔内。 可以是玻璃的盖被配置成透射预定的波长范围内的光。