公开(公告)号：US20040251476A1

公开(公告)日：2004-12-16

申请号：US10821409

申请日：2004-04-09

Applicant: Maxwell Technologies, Inc.

Inventor： David J. Strobel ,  David R. Czajkowski

IPC: H01L023/34

CPC classification number: H01L25/0655 ,  H01L23/055 ,  H01L23/057 ,  H01L23/18 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose an integrated circuit die within, wherein the lid and the base are each constructed from a high Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high Z material disposed between the integrated circuit die and the base, in combination with a high Z material lid to substantially block incident radiation.