公开(公告)号：US11220735B2

公开(公告)日：2022-01-11

申请号：US15892172

申请日：2018-02-08

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Akhil Srinivasan ,  Yifei Wang

IPC: C23C14/00 ,  C23C14/02 ,  C23C14/06 ,  C23C14/14 ,  C23C14/18 ,  C23C14/20 ,  C23C14/30 ,  C23C14/34 ,  C23C14/54 ,  G01N27/327 ,  G01N27/411 ,  A61B5/145

Abstract: A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate.

公开(公告)号：US20220081752A1

公开(公告)日：2022-03-17

申请号：US17537035

申请日：2021-11-29

Applicant: Medtronic MiniMed, Inc.

Inventor： Akhil Srinivasan ,  Yifei Wang

IPC: C23C14/00 ,  C23C14/54 ,  C23C14/30 ,  C23C14/34 ,  C23C14/02 ,  C23C14/18 ,  A61B5/145 ,  C23C14/20 ,  G01N27/327 ,  G01N27/411 ,  C23C14/14 ,  C23C14/06

Abstract: A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate.

公开(公告)号：US20190242010A1

公开(公告)日：2019-08-08

申请号：US15892172

申请日：2018-02-08

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Akhil Srinivasan ,  Yifei Wang

IPC: C23C14/54 ,  C23C14/34 ,  C23C14/30

CPC classification number: C23C14/545 ,  A61B5/14532 ,  C23C14/0005 ,  C23C14/025 ,  C23C14/18 ,  C23C14/30 ,  C23C14/34

Abstract: A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate.