Thermal bridge for LED luminaires
    4.
    发明授权
    Thermal bridge for LED luminaires 有权
    LED灯具热桥

    公开(公告)号:US09046253B2

    公开(公告)日:2015-06-02

    申请号:US13979870

    申请日:2012-01-27

    申请人: James T. Petroski

    发明人: James T. Petroski

    摘要: A luminaire includes two housing halves, movable relative to each other between an open and closed configuration. The bottom housing half includes disposed therein a substrate which itself carries at least one LED which transmits light through a window in the bottom housing half. A thermal bridge made of at least one layer of anisotropic thermally conductive graphite is in thermal contact with the substrate and the top housing half when the housing is in the closed configuration, but its disengaged from either the substrate or top housing half when the housing is in the open configuration.

    摘要翻译: 一个照明器包括两个半壳体,它们在打开和关闭构型之间可相对于彼此移动。 底部壳体半部包括设置在其中的基板,该基板本身承载至少一个LED,该LED透过底部壳体半部中的窗口透过光。 当壳体处于闭合构型时,由至少一层各向异性导热石墨制成的热桥与衬底和顶部壳体半部热接触,但是当壳体为壳体时,它与衬底或顶部壳体半部分脱离 在打开配置。

    Thermal Bridge for LED Luminaires
    5.
    发明申请
    Thermal Bridge for LED Luminaires 有权
    LED灯具热桥

    公开(公告)号:US20130294096A1

    公开(公告)日:2013-11-07

    申请号:US13979870

    申请日:2012-01-27

    申请人: James T. Petroski

    发明人: James T. Petroski

    IPC分类号: F21V29/00

    摘要: A luminaire includes two housing halves, movable relative to each other between an open and closed configuration. The bottom housing half includes disposed therein a substrate which itself carries at least one LED which transmits light through a window in the bottom housing half. A thermal bridge made of at least one layer of anisotropic thermally conductive graphite is in thermal contact with the substrate and the top housing half when the housing is in the closed configuration, but its disengaged from either the substrate or top housing half when the housing is in the open configuration.

    摘要翻译: 一个照明器包括两个半壳体,它们在打开和关闭构型之间可相对于彼此移动。 底部壳体半部包括设置在其中的基板,该基板本身承载至少一个LED,该LED透过底部壳体半部中的窗口透过光。 当壳体处于闭合构型时,由至少一层各向异性导热石墨制成的热桥与衬底和顶部壳体半部热接触,但是当壳体为壳体时,它与衬底或顶部壳体半部分脱离 在打开配置。

    Method of Making an Electronic Device
    10.
    发明申请
    Method of Making an Electronic Device 失效
    制作电子设备的方法

    公开(公告)号:US20120113595A1

    公开(公告)日:2012-05-10

    申请号:US13290382

    申请日:2011-11-07

    申请人: James T. Petroski

    发明人: James T. Petroski

    摘要: An electronic device includes an electronic component with a mating surface. A thermal interface sheet is attached to the mating surface. A substrate carries the electronic device and includes a face. The electronic component is secured to the substrate with the thermal interface sheet positioned between the mating surface and the face. The mating surface is relatively less flat than the face and the mating surface is relatively smoother than the face.

    摘要翻译: 电子设备包括具有配合表面的电子部件。 热界面片连接到配合表面。 基板承载电子设备并且包括面。 电子部件固定在基板上,热界面片位于配合表面和表面之间。 配合表面相对于表面相对较小,并且配合表面比面部相对平滑。