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公开(公告)号：US09607916B2
公开(公告)日：2017-03-28
申请号：US14390992
申请日：2013-04-05
IPC分类号： H01L21/00 , H01L23/29 , C09D163/04 , H01L21/56 , H01L23/00
CPC分类号： H01L23/293 , C09D163/04 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/2929 , H01L2224/29387 , H01L2224/2939 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/81815 , H01L2224/83102 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H01L2924/0665 , H01L2924/05432 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00014
摘要： The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.
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公开(公告)号：US09064820B2
公开(公告)日：2015-06-23
申请号：US14390982
申请日：2013-04-05
CPC分类号： H01L23/3142 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/17151 , H01L2224/2929 , H01L2224/29386 , H01L2224/29393 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81048 , H01L2224/81095 , H01L2224/81097 , H01L2224/81191 , H01L2224/81815 , H01L2224/83102 , H01L2224/83192 , H01L2224/83855 , H01L2224/92125 , H01L2924/05432 , H01L2924/0665 , H01L2924/20105 , H01L2924/20106 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A method of forming an assembly of a substrate and a flip-chip having solder balls thereon, the method having steps of: placing the flip chip with the solder balls in contact with the substrate to form a first interim assembly at a first predetermined temperature; providing an encapsulant to the first interim assembly to form a second interim assembly at a second predetermined temperature that is lower than a melting temperature of the solder balls and higher than the first predetermined temperature; and subjecting the second interim assembly to an environment of a third predetermined temperature that is sufficient to melt the solder balls. An encapsulant for use in forming an assembly of a substrate and a flip-chip having solder balls thereon, the encapsulant consisting essentially of: an epoxy resin; an anhydride curing agent; a fluxing agent having a hydroxyl (—OH) group; and an inorganic filler.
摘要翻译： 一种在其上形成衬底和具有焊球的倒装芯片的组件的方法，所述方法具有以下步骤：将具有焊球的所述倒装芯片与所述衬底接触以在第一预定温度下形成第一临时组件; 向所述第一临时组件提供密封剂以在低于所述焊球的熔化温度并高于所述第一预定温度的第二预定温度下形成第二临时组件; 以及使所述第二临时组件经受足以熔化所述焊球的第三预定温度的环境。 一种用于形成衬底的组件和其上具有焊球的倒装芯片的密封剂，所述密封剂基本上由以下组成：环氧树脂; 酸酐固化剂; 具有羟基（-OH）基团的助熔剂; 和无机填料。
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公开(公告)号：US20150056756A1
公开(公告)日：2015-02-26
申请号：US14390992
申请日：2013-04-05
CPC分类号： H01L23/293 , C09D163/04 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/2929 , H01L2224/29387 , H01L2224/2939 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/81815 , H01L2224/83102 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H01L2924/0665 , H01L2924/05432 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00014
摘要： The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.
摘要翻译： 本公开一般涉及密封剂材料，其制备方法及其用于维持电子器件和基底之间的焊料连接的电气和机械完整性的用途。 更具体地，本公开涉及具有助熔性质的回流密封材料及其制造方法。 本公开还涉及使用本公开的回流封装材料制造倒装芯片组件的方法，其中仅使用一个加热循环。
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公开(公告)号：US20150054154A1
公开(公告)日：2015-02-26
申请号：US14390982
申请日：2013-04-05
CPC分类号： H01L23/3142 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/17151 , H01L2224/2929 , H01L2224/29386 , H01L2224/29393 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81048 , H01L2224/81095 , H01L2224/81097 , H01L2224/81191 , H01L2224/81815 , H01L2224/83102 , H01L2224/83192 , H01L2224/83855 , H01L2224/92125 , H01L2924/05432 , H01L2924/0665 , H01L2924/20105 , H01L2924/20106 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A method of forming an assembly of a substrate and a flip-chip having solder balls thereon, the method having steps of: placing the flip chip with the solder balls in contact with the substrate to form a first interim assembly at a first predetermined temperature; providing an encapsulant to the first interim assembly to form a second interim assembly at a second predetermined temperature that is lower than a melting temperature of the solder balls and higher than the first predetermined temperature; and subjecting the second interim assembly to an environment of a third predetermined temperature that is sufficient to melt the solder balls. An encapsulant for use in forming an assembly of a substrate and a flip-chip having solder balls thereon, the encapsulant consisting essentially of: an epoxy resin; an anhydride curing agent; a fluxing agent having a hydroxyl (—OH) group; and an inorganic filler.
摘要翻译： 一种在其上形成衬底和具有焊球的倒装芯片的组件的方法，所述方法具有以下步骤：将具有焊球的所述倒装芯片与所述衬底接触以在第一预定温度下形成第一临时组件; 向所述第一临时组件提供密封剂以在低于所述焊球的熔化温度并高于所述第一预定温度的第二预定温度下形成第二临时组件; 以及使所述第二临时组件经受足以熔化所述焊球的第三预定温度的环境。 一种用于形成衬底的组件和其上具有焊球的倒装芯片的密封剂，所述密封剂基本上由以下组成：环氧树脂; 酸酐固化剂; 具有羟基（-OH）基团的助熔剂; 和无机填料。
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