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公开(公告)号：US20150054154A1
公开(公告)日：2015-02-26
申请号：US14390982
申请日：2013-04-05
CPC分类号： H01L23/3142 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/17151 , H01L2224/2929 , H01L2224/29386 , H01L2224/29393 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81048 , H01L2224/81095 , H01L2224/81097 , H01L2224/81191 , H01L2224/81815 , H01L2224/83102 , H01L2224/83192 , H01L2224/83855 , H01L2224/92125 , H01L2924/05432 , H01L2924/0665 , H01L2924/20105 , H01L2924/20106 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A method of forming an assembly of a substrate and a flip-chip having solder balls thereon, the method having steps of: placing the flip chip with the solder balls in contact with the substrate to form a first interim assembly at a first predetermined temperature; providing an encapsulant to the first interim assembly to form a second interim assembly at a second predetermined temperature that is lower than a melting temperature of the solder balls and higher than the first predetermined temperature; and subjecting the second interim assembly to an environment of a third predetermined temperature that is sufficient to melt the solder balls. An encapsulant for use in forming an assembly of a substrate and a flip-chip having solder balls thereon, the encapsulant consisting essentially of: an epoxy resin; an anhydride curing agent; a fluxing agent having a hydroxyl (—OH) group; and an inorganic filler.
摘要翻译： 一种在其上形成衬底和具有焊球的倒装芯片的组件的方法，所述方法具有以下步骤：将具有焊球的所述倒装芯片与所述衬底接触以在第一预定温度下形成第一临时组件; 向所述第一临时组件提供密封剂以在低于所述焊球的熔化温度并高于所述第一预定温度的第二预定温度下形成第二临时组件; 以及使所述第二临时组件经受足以熔化所述焊球的第三预定温度的环境。 一种用于形成衬底的组件和其上具有焊球的倒装芯片的密封剂，所述密封剂基本上由以下组成：环氧树脂; 酸酐固化剂; 具有羟基（-OH）基团的助熔剂; 和无机填料。
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公开(公告)号：US20080265437A1
公开(公告)日：2008-10-30
申请号：US11884613
申请日：2006-03-08
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H05K3/3436 , H01L21/563 , H01L23/49838 , H01L24/11 , H01L24/16 , H01L24/17 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/17132 , H01L2224/17136 , H01L2224/17151 , H01L2224/17155 , H01L2224/17177 , H01L2224/17515 , H01L2224/29111 , H01L2224/2919 , H01L2224/32052 , H01L2224/32225 , H01L2224/73204 , H01L2224/83007 , H01L2224/83097 , H01L2224/83192 , H01L2224/83801 , H01L2224/83887 , H01L2224/83888 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15747 , H01L2924/30105 , H01L2924/3025 , H05K3/323 , H05K3/3484 , H05K2201/09781 , H05K2201/10977 , H05K2203/046 , Y02P70/613 , H01L2224/1713 , H01L2224/1715 , H01L2924/00 , H01L2924/01083 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).
摘要翻译： 具有半导体芯片的高可靠性，高生产率的封装及其制造方法。 在包括半导体芯片（10）和安装基板（30）的封装（100）中，在与安装基板侧相对的半导体芯片（10）的表面（10a）上形成多个电极端子（12） 分别对应于多个电极端子（12）的连接端子（32）形成在安装基板（30）上，安装基板（30）和电极端子（12）之间的连接端子（32）是电气 在自组装中形成的焊料凸点（17）共同连接，在芯片表面（10a）或表面（10a）上形成未与电极端子（12）和连接端子（32）连接的电极图案（20） 35）对应于芯片表面（10a），并且焊料（19）积聚在电极图案（20）上。
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公开(公告)号：US09064820B2
公开(公告)日：2015-06-23
申请号：US14390982
申请日：2013-04-05
CPC分类号： H01L23/3142 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/17151 , H01L2224/2929 , H01L2224/29386 , H01L2224/29393 , H01L2224/32225 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/81048 , H01L2224/81095 , H01L2224/81097 , H01L2224/81191 , H01L2224/81815 , H01L2224/83102 , H01L2224/83192 , H01L2224/83855 , H01L2224/92125 , H01L2924/05432 , H01L2924/0665 , H01L2924/20105 , H01L2924/20106 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A method of forming an assembly of a substrate and a flip-chip having solder balls thereon, the method having steps of: placing the flip chip with the solder balls in contact with the substrate to form a first interim assembly at a first predetermined temperature; providing an encapsulant to the first interim assembly to form a second interim assembly at a second predetermined temperature that is lower than a melting temperature of the solder balls and higher than the first predetermined temperature; and subjecting the second interim assembly to an environment of a third predetermined temperature that is sufficient to melt the solder balls. An encapsulant for use in forming an assembly of a substrate and a flip-chip having solder balls thereon, the encapsulant consisting essentially of: an epoxy resin; an anhydride curing agent; a fluxing agent having a hydroxyl (—OH) group; and an inorganic filler.
摘要翻译： 一种在其上形成衬底和具有焊球的倒装芯片的组件的方法，所述方法具有以下步骤：将具有焊球的所述倒装芯片与所述衬底接触以在第一预定温度下形成第一临时组件; 向所述第一临时组件提供密封剂以在低于所述焊球的熔化温度并高于所述第一预定温度的第二预定温度下形成第二临时组件; 以及使所述第二临时组件经受足以熔化所述焊球的第三预定温度的环境。 一种用于形成衬底的组件和其上具有焊球的倒装芯片的密封剂，所述密封剂基本上由以下组成：环氧树脂; 酸酐固化剂; 具有羟基（-OH）基团的助熔剂; 和无机填料。
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公开(公告)号：US07649267B2
公开(公告)日：2010-01-19
申请号：US11884613
申请日：2006-03-08
CPC分类号： H05K3/3436 , H01L21/563 , H01L23/49838 , H01L24/11 , H01L24/16 , H01L24/17 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/17132 , H01L2224/17136 , H01L2224/17151 , H01L2224/17155 , H01L2224/17177 , H01L2224/17515 , H01L2224/29111 , H01L2224/2919 , H01L2224/32052 , H01L2224/32225 , H01L2224/73204 , H01L2224/83007 , H01L2224/83097 , H01L2224/83192 , H01L2224/83801 , H01L2224/83887 , H01L2224/83888 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15747 , H01L2924/30105 , H01L2924/3025 , H05K3/323 , H05K3/3484 , H05K2201/09781 , H05K2201/10977 , H05K2203/046 , Y02P70/613 , H01L2224/1713 , H01L2224/1715 , H01L2924/00 , H01L2924/01083 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).
摘要翻译： 具有半导体芯片的高可靠性，高生产率的封装及其制造方法。 在包括半导体芯片（10）和安装基板（30）的封装（100）中，在与安装基板侧相对的半导体芯片（10）的表面（10a）上形成有多个电极端子（12） 分别对应于多个电极端子（12）的连接端子（32）形成在安装基板（30）上，安装基板（30）上的连接端子（32）和电极端子（12）电连接 集体地通过自组装形成的焊料凸点（17），在芯片表面（10a）或表面（35）上形成未与电极端子（12）和连接端子（32）连接的电极图案（20） 对应于芯片表面（10a）的安装基板（30），并且焊料（19）积聚在电极图案（20）上。
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