公开(公告)号：US20240332252A1

公开(公告)日：2024-10-03

申请号：US18417411

申请日：2024-01-19

申请人： Meta Platforms Technologies, LLC

发明人： Jaspreet Singh Gandhi ,  Jaesik Lee ,  Rajendra D Pendse

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L25/0652 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/4813 ,  H01L2224/48157 ,  H01L2224/73257 ,  H01L2924/1431 ,  H01L2924/1435 ,  H01L2924/15311

摘要： A multi-chiplet assembly may include a first logic chiplet. A multi-chiplet assembly may include a memory chiplet electrically coupled to the first logic chiplet. A multi-chiplet assembly may include a second logic chiplet. A multi-chiplet assembly may include a bridging chiplet electrically coupling the first logic chiplet to the second logic chiplet. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20240241231A1

公开(公告)日：2024-07-18

申请号：US18391655

申请日：2023-12-21

申请人： Meta Platforms Technologies, LLC

发明人： Jack Diepen Mumbo ,  Rajendra D. Pendse ,  Alexandra Gualdino ,  Jaspreet Singh Gandhi ,  Jeremiah Nyaribo ,  Harish Venkataraman ,  Gregory Cohoon

IPC分类号： G01S7/4865 ,  G01S7/481 ,  G01S17/10 ,  H01L23/00 ,  H01L31/107

CPC分类号： G01S7/4865 ,  G01S7/4811 ,  G01S17/10 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L31/107 ,  H01L2224/16225 ,  H01L2224/48225 ,  H01L2224/73207 ,  H01L2924/12041

摘要： A time-of-flight (ToF) module includes a light source, a driver module, and a light sensor. The driver module includes electrical circuitry configured to selectively drive the light source to emit pulsed illumination light. The light sensor is configured to sense returning light reflected from a target. At least one of the light source, driver module, and light sensor is stacked on another to reduce a footprint of the ToF module.