公开(公告)号：US08591289B2

公开(公告)日：2013-11-26

申请号：US13605363

申请日：2012-09-06

申请人： Michael A. Cobb ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Dennis G. Manzer

发明人： Michael A. Cobb ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Dennis G. Manzer

IPC分类号： B24B1/00

CPC分类号： B24B37/30 ,  B24B27/0069 ,  B24B27/0076 ,  B24B37/105 ,  B24B37/245 ,  B24B37/345 ,  B24B41/047

摘要： An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

公开(公告)号：US20130072092A1

公开(公告)日：2013-03-21

申请号：US13605363

申请日：2012-09-06

申请人： Michael F. Lofaro ,  Mahadevaiyer Krishnan ,  Michael A. Cobb ,  Dennis G. Manzer

发明人： Michael F. Lofaro ,  Mahadevaiyer Krishnan ,  Michael A. Cobb ,  Dennis G. Manzer

IPC分类号： B24B1/00

CPC分类号： B24B37/30 ,  B24B27/0069 ,  B24B27/0076 ,  B24B37/105 ,  B24B37/245 ,  B24B37/345 ,  B24B41/047

摘要： An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

公开(公告)号：US07955160B2

公开(公告)日：2011-06-07

申请号：US12135315

申请日：2008-06-09

申请人： Michael A. Cobb ,  Dinesh R. Koli ,  Michael F. Lofaro ,  Dennis G. Manzer ,  Paraneetha Poloju ,  James A. Tornello

发明人： Michael A. Cobb ,  Dinesh R. Koli ,  Michael F. Lofaro ,  Dennis G. Manzer ,  Paraneetha Poloju ,  James A. Tornello

IPC分类号： B24B1/00

CPC分类号： B24B37/042 ,  B24B37/11

摘要： A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

摘要翻译： 玻璃模具抛光结构及方法。 该方法包括提供一种抛光工具，该抛光工具包括安装板，卡盘板，并且机械地连接到安装板上，以及衬垫结构，并且在机械上附接到卡盘板上。 保持结构安装在卡盘板上。 包括多个空腔的玻璃模具被放置在垫结构上并且在由保持结构形成的周边内。 真空装置安装在卡板上。 激活真空装置，使得形成真空并将玻璃模具机械地附接到衬垫结构。 包括机械地附接到垫结构的玻璃模具的抛光工具放置在抛光垫上并与抛光垫接触。 包括玻璃模具的抛光工具旋转。 玻璃模具由于旋转而被抛光。

公开(公告)号：US07704815B2

公开(公告)日：2010-04-27

申请号：US12140600

申请日：2008-06-17

申请人： Jack O. Chu ,  Michael A. Cobb ,  Philip A. Saunders ,  Leathen Shi

发明人： Jack O. Chu ,  Michael A. Cobb ,  Philip A. Saunders ,  Leathen Shi

IPC分类号： H01L21/336

CPC分类号： H01L21/76254 ,  H01L21/0245 ,  H01L21/0251 ,  H01L29/1054

摘要： A method for achieving a substantially defect free SGOI substrate which includes a SiGe layer that has a high Ge content of greater than about 25 atomic % using a low temperature wafer bonding technique is described. The wafer bonding process described in the present application includes an initial prebonding annealing step that is capable of forming a bonding interface comprising elements of Si, Ge and O, i.e., interfacial SiGeO layer, between a SiGe layer and a low temperature oxide layer. The present invention also provides the SGOI substrate and structure that contains the same.

摘要翻译： 描述了使用低温晶片接合技术来实现包括具有大于约25原子％的高Ge含量的SiGe层的基本上无缺陷的SGOI衬底的方法。 本申请中描述的晶片接合方法包括初始预结合退火步骤，其能够形成包含SiGe层和低温氧化物层之间的Si，Ge和O元素即界面SiGeO层的键合界面。 本发明还提供了包含其的SGOI衬底和结构。

公开(公告)号：US07235812B2

公开(公告)日：2007-06-26

申请号：US10939736

申请日：2004-09-13

申请人： Jack O. Chu ,  Michael A. Cobb ,  Philip A. Saunders ,  Leathen Shi

发明人： Jack O. Chu ,  Michael A. Cobb ,  Philip A. Saunders ,  Leathen Shi

IPC分类号： H01L29/00

CPC分类号： H01L21/76254 ,  H01L21/0245 ,  H01L21/0251 ,  H01L29/1054

摘要： A method for achieving a substantially defect free SGOI substrate which includes a SiGe layer that has a high Ge content of greater than about 25 atomic % using a low temperature wafer bonding technique is described. The wafer bonding process described in the present application includes an initial prebonding annealing step that is capable of forming a bonding interface comprising elements of Si, Ge and O, i.e., interfacial SiGeO layer, between a SiGe layer and a low temperature oxide layer. The present invention also provides the SGOI substrate and structure that contains the same.

摘要翻译： 描述了使用低温晶片接合技术来实现包括具有大于约25原子％的高Ge含量的SiGe层的基本上无缺陷的SGOI衬底的方法。 本申请中描述的晶片接合方法包括初始预结合退火步骤，其能够形成包含SiGe层和低温氧化物层之间的Si，Ge和O元素即界面SiGeO层的键合界面。 本发明还提供了包含其的SGOI衬底和结构。

公开(公告)号：US09404697B2

公开(公告)日：2016-08-02

申请号：US14879047

申请日：2015-10-08

申请人： Michael A. Cobb

发明人： Michael A. Cobb

IPC分类号： F41A9/83

CPC分类号： F41A9/83

摘要： A bullet loader method and apparatus that enables a user to easily load bullets into a gun magazine. The gun magazine is inserted into the apparatus magazine opening. Bullets are individually loaded into the bullet loader with a grooved cam, so that the individual bullets rest in the groove. The cam is rotated so that the bullet travels within the groove(s) of the cam and pushed with a cog attached to the end of the groove into the magazine. The bullet is pushed into the magazine with both a downward and inward force to overcome the spring resistance of the magazine.

摘要翻译： 一种子弹装载机方法和装置，其使得用户能够容易地将子弹装载到枪匣中。 枪箱插入设备盒的开口。 子弹被单独装载到带有凹槽凸轮的子弹装载机中，使得各个子弹停留在凹槽中。 凸轮旋转，使得子弹在凸轮的凹槽内移动，并且用连接到凹槽的端部的齿轮推入到料仓中。 子弹被向下和向内的力推入刀库以克服刀库的弹簧阻力。

公开(公告)号：US20160102932A1

公开(公告)日：2016-04-14

申请号：US14879047

申请日：2015-10-08

申请人： Michael A. Cobb

发明人： Michael A. Cobb

IPC分类号： F41A9/83

CPC分类号： F41A9/83

摘要： A bullet loader method and apparatus that enables a user to easily load bullets into a gun magazine. The gun magazine is inserted into the apparatus magazine opening. Bullets are individually loaded into the bullet loader with a grooved cam, so that the individual bullets rest in the groove. The cam is rotated so that the bullet travels within the groove(s) of the cam and pushed with a cog attached to the end of the groove into the magazine. The bullet is pushed into the magazine with both a downward and inward force to overcome the spring resistance of the magazine.

摘要翻译： 一种子弹装载机方法和装置，其使得用户能够容易地将子弹装载到枪匣中。 枪箱插入设备盒的开口。 子弹被单独装载到带有凹槽凸轮的子弹装载机中，使得各个子弹停留在凹槽中。 凸轮旋转，使得子弹在凸轮的凹槽内移动，并且用连接到凹槽的端部的齿轮推入到料仓中。 子弹被向下和向内的力推入刀库以克服刀库的弹簧阻力。

公开(公告)号：US08535118B2

公开(公告)日：2013-09-17

申请号：US13237374

申请日：2011-09-20

申请人： Michael A. Cobb ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Dennis G. Manzer

发明人： Michael A. Cobb ,  Mahadevaiyer Krishnan ,  Michael F. Lofaro ,  Dennis G. Manzer

IPC分类号： B24B1/00

CPC分类号： B24B37/30 ,  B24B27/0069 ,  B24B27/0076 ,  B24B37/105 ,  B24B37/245 ,  B24B37/345 ,  B24B41/047

摘要： An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

摘要翻译： 用于化学机械平面化的装置包括主轴组件结构和至少一个基板载体，其在主轴组件结构中的多个圆柱形主轴的磨削表面接触并相对于彼此相对地相互线性地横向移动，并且至少旋转 一个衬底安装在所述至少一个衬底载体上。 线性横向移动的方向在切向接触多个圆柱形主轴的平面内，并且可以与多个圆柱形主轴的旋转轴线正交。

公开(公告)号：US20090305616A1

公开(公告)日：2009-12-10

申请号：US12135315

申请日：2008-06-09

申请人： Michael A. Cobb ,  Dinesh R. Koli ,  Michael F. Lofaro ,  Dennis G. Manzer ,  Praneetha Poloju ,  James A. Tornello

发明人： Michael A. Cobb ,  Dinesh R. Koli ,  Michael F. Lofaro ,  Dennis G. Manzer ,  Praneetha Poloju ,  James A. Tornello

IPC分类号： B24B7/10

CPC分类号： B24B37/042 ,  B24B37/11

摘要： A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

摘要翻译： 玻璃模具抛光结构及方法。 该方法包括提供一种抛光工具，该抛光工具包括安装板，卡盘板，并且机械地连接到安装板上，以及衬垫结构，并且在机械上附接到卡盘板上。 保持结构安装在卡盘板上。 包括多个空腔的玻璃模具被放置在垫结构上并且在由保持结构形成的周边内。 真空装置安装在卡板上。 激活真空装置，使得形成真空并将玻璃模具机械地附接到衬垫结构。 包括机械地附接到垫结构的玻璃模具的抛光工具放置在抛光垫上并与抛光垫接触。 包括玻璃模具的抛光工具旋转。 玻璃模具由于旋转而被抛光。

公开(公告)号：US20130072089A1

公开(公告)日：2013-03-21

申请号：US13237374

申请日：2011-09-20

申请人： Michael F. Lofaro ,  Mahadevaiyer Krishnan ,  Michael A. Cobb ,  Dennis G. Manzer

发明人： Michael F. Lofaro ,  Mahadevaiyer Krishnan ,  Michael A. Cobb ,  Dennis G. Manzer

IPC分类号： B24B29/00 ,  B24B1/00 ,  B24B37/04

CPC分类号： B24B37/30 ,  B24B27/0069 ,  B24B27/0076 ,  B24B37/105 ,  B24B37/245 ,  B24B37/345 ,  B24B41/047

摘要： An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.