公开(公告)号：US08801242B2

公开(公告)日：2014-08-12

申请号：US13445032

申请日：2012-04-12

申请人： Michael Hamm ,  Ernst-Olaf Rosenhahn ,  Emil P. Stefanov

发明人： Michael Hamm ,  Ernst-Olaf Rosenhahn ,  Emil P. Stefanov

IPC分类号： B60Q1/00

CPC分类号： B60Q1/1423 ,  B60Q2300/056 ,  F21S41/143 ,  F21S41/24 ,  F21S41/663 ,  G02B6/0008

摘要： A light module of a motor vehicle generates a spot distribution of a high-beam-light distribution formed by superimposition of the spot distribution and a base distribution generated by at least one other module. The light module comprises a plurality of separately controllable sub-modules that generate a plurality of stripe-shaped segments of the spot distribution that supplement it. Also, a headlight generates the high-beam-light distribution and comprises the light module. Furthermore, a headlight system comprises a pair of the headlights disposed in a front region toward sides of the vehicle and each of which generates the high-beam-light distribution. The headlights include corresponding light modules that generate stripe-shaped segments of left and right sides, respectively, of the spot distribution such that the stripe-shaped segments of the light modules of the headlights supplement the spot distribution or are at least partially superimposed thereon.

摘要翻译： 机动车辆的光模块产生由点分布的叠加和由至少一个其他模块生成的基本分布而形成的远光束分布的点分布。 光模块包括多个单独可控的子模块，其产生补充它的点分布的多个条形段。 而且，前照灯产生远光束分布并包括光模块。 此外，前照灯系统包括一对朝向车辆侧面的前部区域中的前灯，并且每个前灯产生远光分布。 头灯包括分别产生点分布的左侧和右侧的条形段的对应的光模块，使得前灯的光模块的条形段补充光点分布或者至少部分地叠加在其上。

公开(公告)号：US20120275173A1

公开(公告)日：2012-11-01

申请号：US13445032

申请日：2012-04-12

申请人： Michael Hamm ,  Ernst-Olaf Rosenhahn ,  Emil P. Stefanov

发明人： Michael Hamm ,  Ernst-Olaf Rosenhahn ,  Emil P. Stefanov

IPC分类号： B60Q1/04

CPC分类号： B60Q1/1423 ,  B60Q2300/056 ,  F21S41/143 ,  F21S41/24 ,  F21S41/663 ,  G02B6/0008

摘要： A light module of a motor vehicle generates a spot distribution of a high-beam-light distribution formed by superimposition of the spot distribution and a base distribution generated by at least one other module. The light module comprises a plurality of separately controllable sub-modules that generate a plurality of stripe-shaped segments of the spot distribution that supplement it. Also, a headlight generates the high-beam-light distribution and comprises the light module. Furthermore, a headlight system comprises a pair of the headlights disposed in a front region toward sides of the vehicle and each of which generates the high-beam-light distribution. The headlights include corresponding light modules that generate stripe-shaped segments of left and right sides, respectively, of the spot distribution such that the stripe-shaped segments of the light modules of the headlights supplement the spot distribution or are at least partially superimposed thereon.

摘要翻译： 机动车辆的光模块产生由点分布的叠加和由至少一个其他模块生成的基本分布而形成的远光束分布的点分布。 光模块包括多个单独可控的子模块，其产生补充它的点分布的多个条形段。 而且，前照灯产生远光束分布并包括光模块。 此外，前照灯系统包括一对朝向车辆侧面的前部区域中的前灯，并且每个前灯产生远光分布。 头灯包括分别产生点分布的左侧和右侧的条形段的对应的光模块，使得前灯的光模块的条形段补充光点分布或者至少部分地叠加在其上。

公开(公告)号：US07064356B2

公开(公告)日：2006-06-20

申请号：US10826980

申请日：2004-04-16

申请人： Emil P. Stefanov ,  Hari S. Venugopalan ,  Bryan S. Shelton ,  Ivan Eliashevich

发明人： Emil P. Stefanov ,  Hari S. Venugopalan ,  Bryan S. Shelton ,  Ivan Eliashevich

IPC分类号： H01L33/00

CPC分类号： H01L33/38 ,  H01L33/08 ,  H01L33/20

摘要： A flip chip light emitting diode (12) includes a light-transmissive substrate (10) with a base semiconducting layer (40) disposed thereupon. A conductive mesh (18) is disposed on the base semiconducting layer (40) and is in electrically conductive contact therewith. Light-emitting micromesas (30) are disposed in openings (20) of the conductive mesh (18). Each light emitting micromesa (30) has a topmost layer (46) of a second conductivity type that is opposite the first conductivity type. A first conductivity type electrode (14) is disposed on the base semiconducting layer (40) and is in electrical communication with the electrically conductive mesh (18). An insulating layer (60) is disposed over the electrically conductive mesh (18). A second conductivity type electrode layer (24) is disposed over the insulating layer (60) and the light-emitting micromesas (30). the insulating layer (60) insulates the second conductivity type electrode layer (24) from the electrically conductive mesh (18).

摘要翻译： 倒装芯片发光二极管（12）包括具有设置在其上的基极半导体层（40）的透光衬底（10）。 导电网（18）设置在基底半导体层（40）上并与其导电接触。 发光微镜（30）设置在导电网（18）的开口（20）中。 每个发光微镜（30）具有与第一导电类型相反的第二导电类型的最上层（46）。 第一导电型电极（14）设置在基底半导体层（40）上并与导电网（18）电连通。 绝缘层（60）设置在导电网（18）之上。 第二导电型电极层（24）设置在绝缘层（60）和发光微孔（30）之上。 绝缘层（60）将第二导电型电极层（24）与导电网（18）绝缘。

公开(公告)号：US08799334B1

公开(公告)日：2014-08-05

申请号：US13339768

申请日：2011-12-29

申请人： Emil P. Stefanov ,  Marten Erik van Dijk ,  Alina M. Oprea ,  Ari Juels

发明人： Emil P. Stefanov ,  Marten Erik van Dijk ,  Alina M. Oprea ,  Ari Juels

IPC分类号： G06F17/30

CPC分类号： G06F21/577 ,  G06F2211/007 ,  G06F2221/2107

摘要： A client device or other processing device comprises a file processing module, with the file processing module being operative to provide a file to a file system for encoding, to receive from the file system a corresponding encoded file, and to verify that the file system stores at least a designated portion of an encapsulation of the encoded file. In an illustrative embodiment, the file processing module receives, in addition to or in place of the encoded file, a proof of correct encoding. The file system may comprise one or more servers associated with a cloud storage provider. Advantageously, one or more illustrative embodiments allow a client device to verify that its files are stored by a cloud storage provider in encrypted form or with other appropriate protections.

摘要翻译： 客户端设备或其他处理设备包括文件处理模块，文件处理模块可操作以向文件系统提供文件以进行编码，从文件系统接收对应的编码文件，并验证文件系统存储 至少编码文件的封装的指定部分。 在说明性实施例中，文件处理模块除了编码文件之外还是代替编码文件，接收正确编码的证明。 文件系统可以包括与云存储提供商相关联的一个或多个服务器。 有利地，一个或多个说明性实施例允许客户端设备验证其文件由加密形式的云存储提供商或其他适当的保护来存储。

公开(公告)号：US08706701B1

公开(公告)日：2014-04-22

申请号：US13174452

申请日：2011-06-30

申请人： Emil P. Stefanov ,  Marten E. Van Dijk ,  Alina M. Oprea ,  Ari Juels

发明人： Emil P. Stefanov ,  Marten E. Van Dijk ,  Alina M. Oprea ,  Ari Juels

IPC分类号： G06F7/00 ,  G06F17/00

CPC分类号： G06F17/30091 ,  G06F11/1088 ,  G06F17/30197 ,  G06F21/64

摘要： Example embodiments of the present invention provide authenticated file system that provides integrity and freshness of both data and metadata more efficiently than existing systems. The architecture of example embodiments of the present invention is natural to cloud settings involving a cloud service provider and enterprise-class tenants, thereby addressing key practical considerations, including garbage collection, multiple storage tiers, multi-layer caching, and checkpointing. Example embodiments of the present invention support a combination of strong integrity protection and practicality for large (e.g., petabyte-scale), high-throughput file systems. Further, example embodiments of the present invention support proofs of retrievability (PoRs) that let the cloud prove to the tenant efficiently at any time and for arbitrary workloads that the full file system (i.e., every bit) is intact, leveraging integrity-checking capabilities to achieve a property that previous PoRs lack, specifically efficiency in dynamic settings (i.e., for frequently changing data objects).

摘要翻译： 本发明的示例性实施例提供经认证的文件系统，其比现有系统更有效地提供数据和元数据的完整性和新鲜度。 本发明的示例性实施例的架构对于涉及云服务提供商和企业级租户的云设置是自然的，由此解决关键的实际考虑，包括垃圾收集，多个存储层，多层缓存和检查点。 本发明的示例性实施例支持强大的完整性保护和大型（例如，PB级）高吞吐量文件系统的实用性的组合。 此外，本发明的示例实施例支持使得云在任何时候有效地向租户提供证明的可检索证据（PoR），以及完整文件系统（即，每一位）完整的任意工作负载，利用完整性检查能力 实现以前的PoR缺少的属性，特别是动态设置的效率（即，频繁更改数据对象）。

公开(公告)号：US08346742B1

公开(公告)日：2013-01-01

申请号：US13075848

申请日：2011-03-30

申请人： Ari Juels ,  Marten Erik van Dijk ,  Alina Oprea ,  Ronald L. Rivest ,  Emil P. Stefanov

发明人： Ari Juels ,  Marten Erik van Dijk ,  Alina Oprea ,  Ronald L. Rivest ,  Emil P. Stefanov

IPC分类号： G06F17/00

CPC分类号： G06F21/577

摘要： A client device or other processing device comprises a file processing module, with the file processing module being operative to request proof from a file system that a file having a first format is stored by the file system in a second format different than the first format, to receive the proof from the file system, and to verify that the file is stored in the second format using the proof provided by the file system responsive to the request. The proof is based at least in part on application of a function to the file in the second format, and the function imposes a minimum resource requirement on generation of the proof. The file system may comprise one or more servers associated with a cloud storage provider. Advantageously, one or more illustrative embodiments allow a client device to verify that its files are stored by a cloud storage provider in encrypted form or with other appropriate protections.

摘要翻译： 客户端设备或其他处理设备包括文件处理模块，文件处理模块可操作以从文件系统请求证明文件系统以不同于第一格式的第二格式存储具有第一格式的文件， 从文件系统接收证明，并使用响应于该请求的文件系统提供的证明来验证文件是否以第二格式存储。 该证明至少部分地基于第二格式的文件的应用功能，并且该功能对生成证明施加了最低资源要求。 文件系统可以包括与云存储提供商相关联的一个或多个服务器。 有利地，一个或多个说明性实施例允许客户端设备验证其文件由加密形式的云存储提供商或其他适当的保护来存储。

公开(公告)号：US07456035B2

公开(公告)日：2008-11-25

申请号：US10899864

申请日：2004-07-27

申请人： Ivan Eliashevich ,  Boris Kolodin ,  Emil P. Stefanov

发明人： Ivan Eliashevich ,  Boris Kolodin ,  Emil P. Stefanov

IPC分类号： H01L21/00

CPC分类号： H01L25/0753 ,  H01L33/0079 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In a method for fabricating a flip-chip light emitting diode device, epitaxial layers (14, 114) are deposited on a growth substrate (16, 116) to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die (10, 110). The device die (10, 110) is flip chip bonded to a mount (12, 112). The flip chip bonding includes securing the device die (10, 110) to the mount (12, 112) by bonding at least one electrode (20, 22, 120) of the device die (10, 110) to at least one bonding pad (26, 28, 126) of the mount (12, 112). Subsequent to the flip chip bonding, a thickness of the growth substrate (16, 116) of the device die (10, 110) is reduced.

摘要翻译： 在制造倒装芯片发光二极管器件的方法中，外延层（14,114）沉积在生长衬底（16,116）上以产生外延晶片。 在外延晶片上制造多个发光二极管器件。 切割外延晶片以产生器件管芯（10,110）。 器件管芯（10,110）被倒装芯片结合到安装件（12,112）上。 倒装芯片接合包括通过将器件管芯（10,110）的至少一个电极（20,22，120）粘合到至少一个焊盘（10,110）上来将器件管芯（10,110）固定到安装座（12,112） （12,112）的底部（26,28,126）。 在倒装芯片接合之后，器件管芯（10,110）的生长衬底（16,116）的厚度减小。