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    Low inductance capacitor
    1.
    发明申请
    Low inductance capacitor 有权
    低电感电容

    公开(公告)号：US20070165360A1

    公开(公告)日：2007-07-19

    申请号：US11334271

    申请日：2006-01-18

    申请人： Michael Randall ,  John Prymak ,  Azizuddin Tajuddin

    发明人： Michael Randall ,  John Prymak ,  Azizuddin Tajuddin

    IPC分类号： H01G4/228

    CPC分类号： H01G4/232 ,  H01G4/30

    摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.

    摘要翻译： 低电感多层电容器。 电容器包括交错并联的内部电极板，其间具有电介质。 每个内部电极板包括两个引出片，并且通常为T形。 第一外部电极端子电连接到偶数内部电极板的引出接线片，第二外部电极端子电连接到奇数内部电极板的引出接线片。 外部电极端子位于电容器的公共第一外表面和公共相对的第二外表面上。

    Low inductance capacitor
    2.
    发明授权
    Low inductance capacitor 有权
    低电感电容

    公开(公告)号：US07292429B2

    公开(公告)日：2007-11-06

    申请号：US11334271

    申请日：2006-01-18

    申请人： Michael S. Randall ,  John Prymak ,  Azizuddin Tajuddin

    发明人： Michael S. Randall ,  John Prymak ,  Azizuddin Tajuddin

    IPC分类号： H01G4/005 ,  H01G4/06

    CPC分类号： H01G4/232 ,  H01G4/30

    摘要： A low inductance multi-layer capacitor. The capacitor includes interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate includes two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.

    摘要翻译： 低电感多层电容器。 电容器包括其间具有电介质的交错并联内部电极板。 每个内部电极板包括两个引出片，并且通常为T形。 第一外部电极端子电连接到偶数内部电极板的引出接线片，第二外部电极端子电连接到奇数内部电极板的引出接线片。 外部电极端子位于电容器的公共第一外表面和公共相对的第二外表面上。

    Thermal dissipating capacitor and electrical component comprising same
    4.
    发明申请
    Thermal dissipating capacitor and electrical component comprising same 失效
    散热电容器和包含它的电气部件

    公开(公告)号：US20050231890A1

    公开(公告)日：2005-10-20

    申请号：US10826605

    申请日：2004-04-16

    申请人： John Prymak

    发明人： John Prymak

    IPC分类号： C03B29/00 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01L23/50 ,  H05K1/02

    CPC分类号： H01G4/232 ,  H01G2/065 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0231 ,  H05K2201/10545 ,  H01L2924/00

    摘要： An electrical component with a printed circuit board. The printed circuit board has an upper face and a lower face. A microprocessor is mounted to the upper face. A capacitor is mounted to the lower face. The capacitor has a first face parallel to the printed circuit board and a second face opposite to the first face. First plates and second plates are in alternating planar relationship with a dielectric therebetween and arranged in a plane perpendicular to the plane created by the circuit board. Each first plate has a first coupling tab and a power tab on opposing edges wherein the first coupling tab terminates at the first face and the power tab terminates at the second face. Each second plate of the second plates comprises a second coupling tab and a ground tab on opposing edges wherein the second coupling tab terminates at the first face and the ground tab terminates at the second face. The first coupling tab and the second coupling tab are in electrical contact with the microprocessor.

    摘要翻译： 具有印刷电路板的电气部件。 印刷电路板具有上表面和下表面。 微处理器安装在上面。 电容器安装在下表面。 电容器具有平行于印刷电路板的第一面和与第一面相对的第二面。 第一板和第二板与它们之间的电介质处于交替的平面关系，并且布置在与由电路板产生的平面垂直的平面中。 每个第一板具有在相对边缘上的第一联接接头和电源接头，其中第一连接接头在第一面处终止，并且电源接头在第二面处终止。 第二板的每个第二板包括在相对边缘上的第二联接片和接地片，其中第二连接片在第一面终止并且接地片终止于第二面。 第一耦合片和第二耦合片与微处理器电接触。

    Thermal dissipating capacitor and electrical component comprising same
    8.
    发明申请
    Thermal dissipating capacitor and electrical component comprising same 有权

    公开(公告)号：US20050230030A1

    公开(公告)日：2005-10-20

    申请号：US11033578

    申请日：2005-01-12

    申请人： John Prymak

    发明人： John Prymak

    IPC分类号： C03B29/00 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01L23/50 ,  H05K1/02

    CPC分类号： H01G4/232 ,  H01G2/065 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0231 ,  H05K2201/10545 ,  H01L2924/00

    摘要： An electrical component with a printed circuit board. The printed circuit board has an upper face and a lower face. A microprocessor is mounted to the upper face. A capacitor is mounted to the lower face. The capacitor has a first face parallel to the printed circuit board and a second face opposite to the first face. First plates and second plates are in alternating planar relationship with a dielectric therebetween and arranged in a plane perpendicular to the plane created by the circuit board. Each first plate has a first coupling tab and a power tab on opposing edges wherein the first coupling tab terminates at the first face and the power tab terminates at the second face. Each second plate of the second plates comprises a second coupling tab and a ground tab on opposing edges wherein the second coupling tab terminates at the first face and the ground tab terminates at the second face. The first coupling tab and the second coupling tab are in electrical contact with the microprocessor.