公开(公告)号：US08904632B2

公开(公告)日：2014-12-09

申请号：US13242155

申请日：2011-09-23

申请人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Casey P. Rodriguez

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Casey P. Rodriguez

IPC分类号： H01K3/10 ,  H05K3/46 ,  H05K3/42

CPC分类号： H05K1/0298 ,  H05K1/09 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0141 ,  H05K2201/09545 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.

摘要翻译： 一种用于从电路板层制造多层电路板的方法，每个电路板包括介电层和其上包括第一金属的导电迹线。 该方法包括在第一电路板层中形成通孔，将通孔与第一金属电镀，并将第二金属涂覆在第一电路板层的第一金属上，镀通孔和第一金属 金属。 该方法还包括将第一和第二电路板层对准在一起，使得第一电路板层的电镀通孔与第二电路板层上的特征相邻，并且加热并压紧对准的第一和第二电路板层 以将电介质层层叠在一起，并将相邻的金属部分结合在一起的第一和第二金属的金属间化合物。

公开(公告)号：US20130075137A1

公开(公告)日：2013-03-28

申请号：US13242155

申请日：2011-09-23

申请人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Casey P. Rodriguez

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Casey P. Rodriguez

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K3/36 ,  H05K1/11

CPC分类号： H05K1/0298 ,  H05K1/09 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0141 ,  H05K2201/09545 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.

摘要翻译： 一种用于从电路板层制造多层电路板的方法，每个电路板包括介电层和其上包括第一金属的导电迹线。 该方法包括在第一电路板层中形成通孔，将通孔与第一金属电镀，并将第二金属涂覆在第一电路板层的第一金属上，镀通孔和第一金属 金属。 该方法还包括将第一和第二电路板层对准在一起，使得第一电路板层的电镀通孔与第二电路板层上的特征相邻，并且加热并压紧对准的第一和第二电路板层 以将电介质层层叠在一起，并将相邻的金属部分结合在一起的第一和第二金属的金属间化合物。