摘要:
A thyristor having a pnpn semiconductor body comprising MISFET structures 9 and 12 through 16 which serve as controllable emitter base shorts formed at the edge side relative to one of the emitter layers and each of the structures is composed of a semiconductor region 9 inserted into the emitter layer which is contacted by an electrode 6 for the emitter layer 1 and also includes a subregion 12 of the adjacent base layer 2 and of an intervening channel region 13 which is formed of an edge zone of the emitter layer 1 and is also composed of a gate covering the channel region in an insulated manner. The gate also convers the subregion 12 of the base layer 2 and forms a MIS capacitor C1. A voltage generator 23 drives the gate 15 with a voltage which alternates between first and second values. At the change from the first voltage value which lies below the threshold value of the channel region 13 to the second voltage level which is close to the threshold voltage of the subregion 12 of the base layer, the thyristor ignites due to the shift in current of the MIS capacitor C1 which serves as the ignition current and, thus, when the change from the second to the first voltage occurs, the thyristor is quenched.
摘要:
A power thyristor with internal current amplification has an auxilary emitter region which is contacted by an auxiliary emitter electrode. Disconnectible current paths designed as MIS structures are provided between the auxiliary emitter electrode and the base layer adjacent to the auxiliary emitter region. The current paths, which effect a stabilization in their switched-on state, are switched off for the duration of the ignition operation in order to increase the trigger sensitivity. Each MIS structure exhibits a short-circuit region inserted into the adjacent base layer spaced from the auxiliary emitter region, said short-circuit region being connected to the adjacent base layer over a conductive coating.
摘要:
Component having a blocking pn junction having an edge termination structure which is formed by a further, more weakly doped region (5) and a trench (8) formed therein, said trench being filled with a dielectric. The dielectric material in the trench (8) diverts the equipotential areas from the horizontal in a very confined space in the vertical direction, with the result that the electric field can emerge from the component within a small region of the chip surface.
摘要:
A thyristor has a semiconductor member with a pnpn-layer sequence, a plurality of n(p)-emitter parts, and switching transistors arranged at the edges of the n(p)-emitter parts. The switching transistors respectively include a p(n) semiconductor zone inserted in one of the n(p)-emitter parts, a partial zone of the p(n)-base, and an intermediately disposed channel zone covered by an insulated gate. Rapid and effective reduction of the electron-hole plasma flooding the p-base and n-base during quenching of the thyristor is achieved by a current source connected between electrodes for the p(n) semiconductor zones and a cathode (anode) feed line, the current source delivering an extraction current pulse.
摘要:
Described is a method for adjusting an operating temperature of MOS power components composed of a plurality of identical individual cells and a component for carrying out the method. As a characteristic feature, the gate electrode network (4) of the active chip region is subdivided into several gate electrode network sectors (B1, B2, B3) which are electrically isolated from one another by means of isolating points and to each of which a different gate voltage is fed via corresponding contacts.
摘要:
For achieving an enhanced combination of a low on-resistance at a high break-through voltage a lateral high-voltage MOS transistor comprises a plurality of doped RESURF regions of the first conductivity type within the drift region, wherein the doped RESURF regions are separated from each other by drift region sections in a first lateral direction (y), which is parallel to a substrate surface and is orthogonal to a connecting line from the source region to the drain region, and also in a depth direction, which is orthogonal to the substrate surface, such that in each of said two directions an alternating arrangement of regions of the first and second conductivity types is provided.
摘要:
In an integrated circuit arrangement having at least one power component and low-voltage components, the at least one power component is realized in a semiconductor substrate. At least one contact of the power component is arranged on a principal surface of the substrate. The contact is covered with an insulation layer at a surface of which at least one thin-film component, particularly a thin-film transistor, is provided above the contact.
摘要:
Described is a method for adjusting an operating temperature of MOS power components composed of a plurality of identical individual cells and a component for carrying out the method. As a characteristic feature, the gate electrode network (4) of the active chip region is subdivided into several gate electrode network sectors (B1, B2, B3) which are electrically isolated from one another by means of isolating points and to each of which a different gate voltage is fed via corresponding contacts.
摘要:
Methods of forming, on a substrate, a first lateral high-voltage MOS transistor and a second lateral high-voltage MOS transistor complementary to said first one are disclosed. According to one embodiment, the method includes (1) providing a substrate of a first conductivity type including a first active region for said first lateral high-voltage MOS transistor and a second active region for said second lateral high-voltage MOS transistor and (2) forming at least one first doped region of the first conductivity type in the first active region and forming in the second active region a drain extension region of the second conductivity type extending from a substrate surface to an interior of the substrate, including a concurrent implantation of dopants through openings of one and the same mask into the first and second active regions. Forming of the at least one first doped region may be a sub step of a superior step of forming a double RESURF structure in the first lateral high-voltage MOS transistor, and forming the double RESURF structure may include forming doped RESURF regions as two first doped regions, one thereof above and one thereof below the drift region of the first lateral high-voltage MOS transistor, and as two further doped regions, one thereof above and one thereof below the drain extension regions of the second lateral high-voltage MOS transistor, wherein the first doped RESURF regions have an inverse conductivity type with respect to the drift region and the further doped regions have inverse conductivity type as compared to the drain extension region.
摘要:
The invention is intended to specify an electrical measuring method for an operating temperature and a modified component for carrying out the method which improves the monitoring of the component. Measured temperature values are intended to be delivered without any time delay and without requiring additional surfaces for temperature sensors. Location-related temperature values need to be able to be measured. The invention proposes a method for said location-related electrical measurement of the operating temperature of a likewise proposed MOS power component with a gate electrode network comprising a material whose temperature coefficient of the electrical resistance is known. The gate electrode network is divided into a plurality of measuring sections with contact point pairs which are respectively connected to contacts (71.1, 72.1; 71.2, 72.2; 71.3, 7; 72.3, 7). The contact points in each contact point pair are at a certain distance from one another, and each of the measuring sections situated between the contact point pairs is respectively electrically insulated from the other measuring sections, so that there is no electrical influencing between the measuring sections. The electrical resistances of the measuring sections are measured directly on the gate electrode network during the operation of the semiconductor power component when gate voltages are applied between the contact points of the gate electrode (4) using measuring voltages (u1, u2, u3) superimposed on the gate voltages. The electrical resistances of the measuring sections are used to determine the temperatures of the MOS semiconductor power component on the measuring sections.