COMPOSITION FOR FILM FORMATION, INSULATING FILM AND SEMICONDUCTOR DEVICE
    1.
    发明申请
    COMPOSITION FOR FILM FORMATION, INSULATING FILM AND SEMICONDUCTOR DEVICE 审中-公开
    用于膜形成的组合物,绝缘膜和半导体器件

    公开(公告)号:US20120142879A1

    公开(公告)日:2012-06-07

    申请号:US13386286

    申请日:2010-06-25

    IPC分类号: C08F238/00

    摘要: A composition for film formation according to the present invention includes polymerizable compounds each having at least one polymerizable functional group, and the polymerizable compound includes a partial structure containing an adamantane type cage structure and at least one polymerizable reactive group contributing to polymerization reaction in one molecule thereof. Further, the polymerizable reactive group contains an aromatic ring and at least one ethynyl or vinyl group directly bonded to the aromatic ring as the polymerizable functional group, and the number of carbon atoms derived from the aromatic ring is in the range of 15 to 38% with respect to the number of total carbon atoms of the polymerizable compound.

    摘要翻译: 根据本发明的用于成膜的组合物包括各自具有至少一个可聚合官能团的可聚合化合物,并且可聚合化合物包括含有金刚烷型笼结构的部分结构和在一个分子中有助于聚合反应的至少一个可聚合反应基 其中。 此外,可聚合反应性基团含有芳香环和至少一个与芳环直接键合的乙炔基或乙烯基作为可聚合官能团,并且来自芳环的碳原子数在15至38%的范围内, 相对于可聚合化合物的总碳原子数。

    ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE
    4.
    发明申请
    ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE 审中-公开
    有机绝缘材料,使用其的树脂膜的变化,树脂膜和半导体器件

    公开(公告)号:US20100004379A1

    公开(公告)日:2010-01-07

    申请号:US12557530

    申请日:2009-09-11

    IPC分类号: C08L55/00 C08F36/02 C08F38/02

    摘要: The invention provides useful organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as resin films and semiconductor devices employing them. The organic insulating materials of the invention comprise prepolymers of adamantane structure compounds having polymerizable unsaturated bond-containing groups. The prepolymers have number-average molecular weights of between 2,000 and 500,000 based on polystyrene, as measured by gel permeation chromatography. The polymerizable unsaturated bond-containing groups are preferably groups that contain carbon-carbon triple bonds. The resin films of the invention are obtained by crosslinking reaction of the organic insulating materials or varnishes for resin film containing them, by heating and/or active irradiation, and condensation reaction.

    摘要翻译: 本发明提供了显示低介电常数,高耐热性和高机械强度的有用的有机绝缘材料,以及使用它们的树脂膜和半导体器件。 本发明的有机绝缘材料包含具有可聚合不饱和键的基团的金刚烷结构化合物的预聚物。 通过凝胶渗透色谱法测定,预聚物的数均分子量基于聚苯乙烯为2,000至500,000。 含有可聚合不饱和键的基团优选为含有碳 - 碳三键的基团。 本发明的树脂膜通过有机绝缘材料或含有它们的树脂膜的清漆的交联反应,通过加热和/或主动照射和缩合反应而获得。