公开(公告)号：US20110172351A1

公开(公告)日：2011-07-14

申请号：US13050943

申请日：2011-03-18

申请人： Yohko Sano ,  Mihoko Matsutani ,  Kazuyoshi Fujita

发明人： Yohko Sano ,  Mihoko Matsutani ,  Kazuyoshi Fujita

IPC分类号： C08L49/00 ,  C08F38/00 ,  C08F2/46

CPC分类号： H01L21/02118 ,  C08F281/00 ,  C08F290/00 ,  C08F290/04 ,  C08F290/06 ,  C08F290/14 ,  C08F299/00 ,  C09D4/00 ,  G03F7/025 ,  H01L21/02282 ,  H01L21/02345 ,  H01L21/312

摘要： An organic insulating material includes a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit. The prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography. The prepolymer includes unsaturated bonds produced by reaction between the polymerizable unsaturated bonds and the unreacted polymerizable unsaturated bonds. The prepolymer has a residue rate of unreacted polymerizable unsaturated bonds of between 20% and 80%.

摘要翻译： 有机绝缘材料包括具有可聚合不饱和键的基团的笼结构化合物和金刚烷结构作为最小单元的笼结构的预聚物。 预聚物的数均分子量基于聚苯乙烯为2,000至500,000，并通过凝胶渗透色谱法测量。 预聚物包括由可聚合不饱和键和未反应的可聚合不饱和键之间的反应产生的不饱和键。 预聚物的未反应的可聚合不饱和键的残留率为20％至80％。

公开(公告)号：US08524847B2

公开(公告)日：2013-09-03

申请号：US13050943

申请日：2011-03-18

申请人： Yohko Sano ,  Mihoko Matsutani ,  Kazuyoshi Fujita

发明人： Yohko Sano ,  Mihoko Matsutani ,  Kazuyoshi Fujita

IPC分类号： C08L55/00 ,  C08F38/02 ,  C08F36/02

CPC分类号： H01L21/02118 ,  C08F281/00 ,  C08F290/00 ,  C08F290/04 ,  C08F290/06 ,  C08F290/14 ,  C08F299/00 ,  C09D4/00 ,  G03F7/025 ,  H01L21/02282 ,  H01L21/02345 ,  H01L21/312

摘要： An organic insulating material includes a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit. The prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography. The prepolymer includes unsaturated bonds produced by reaction between the polymerizable unsaturated bonds and the unreacted polymerizable unsaturated bonds. The prepolymer has a residue rate of unreacted polymerizable unsaturated bonds of between 20% and 80%.

摘要翻译： 有机绝缘材料包括具有可聚合不饱和键的基团的笼结构化合物和金刚烷结构作为最小单元的笼结构的预聚物。 预聚物的数均分子量基于聚苯乙烯为2,000至500,000，并通过凝胶渗透色谱法测量。 预聚物包括由可聚合不饱和键和未反应的可聚合不饱和键之间的反应产生的不饱和键。 预聚物的未反应的可聚合不饱和键的残留率为20％至80％。

公开(公告)号：US20120142879A1

公开(公告)日：2012-06-07

申请号：US13386286

申请日：2010-06-25

申请人： Michio Nakajima ,  Hidenori Saito ,  Takahiro Harada ,  Mihoko Matsutani ,  Masahiro Tada ,  Koji Nakatani

发明人： Michio Nakajima ,  Hidenori Saito ,  Takahiro Harada ,  Mihoko Matsutani ,  Masahiro Tada ,  Koji Nakatani

IPC分类号： C08F238/00

CPC分类号： H01L23/5329 ,  H01L21/02118 ,  H01L21/02282 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A composition for film formation according to the present invention includes polymerizable compounds each having at least one polymerizable functional group, and the polymerizable compound includes a partial structure containing an adamantane type cage structure and at least one polymerizable reactive group contributing to polymerization reaction in one molecule thereof. Further, the polymerizable reactive group contains an aromatic ring and at least one ethynyl or vinyl group directly bonded to the aromatic ring as the polymerizable functional group, and the number of carbon atoms derived from the aromatic ring is in the range of 15 to 38% with respect to the number of total carbon atoms of the polymerizable compound.

摘要翻译： 根据本发明的用于成膜的组合物包括各自具有至少一个可聚合官能团的可聚合化合物，并且可聚合化合物包括含有金刚烷型笼结构的部分结构和在一个分子中有助于聚合反应的至少一个可聚合反应基 其中。 此外，可聚合反应性基团含有芳香环和至少一个与芳环直接键合的乙炔基或乙烯基作为可聚合官能团，并且来自芳环的碳原子数在15至38％的范围内， 相对于可聚合化合物的总碳原子数。

公开(公告)号：US20100004379A1

公开(公告)日：2010-01-07

申请号：US12557530

申请日：2009-09-11

申请人： Yohko Sano ,  Mihoko Matsutani ,  Kazuyoshi Fujita

发明人： Yohko Sano ,  Mihoko Matsutani ,  Kazuyoshi Fujita

IPC分类号： C08L55/00 ,  C08F36/02 ,  C08F38/02

CPC分类号： H01L21/02118 ,  C08F281/00 ,  C08F290/00 ,  C08F290/04 ,  C08F290/06 ,  C08F290/14 ,  C08F299/00 ,  C09D4/00 ,  G03F7/025 ,  H01L21/02282 ,  H01L21/02345 ,  H01L21/312

摘要： The invention provides useful organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as resin films and semiconductor devices employing them. The organic insulating materials of the invention comprise prepolymers of adamantane structure compounds having polymerizable unsaturated bond-containing groups. The prepolymers have number-average molecular weights of between 2,000 and 500,000 based on polystyrene, as measured by gel permeation chromatography. The polymerizable unsaturated bond-containing groups are preferably groups that contain carbon-carbon triple bonds. The resin films of the invention are obtained by crosslinking reaction of the organic insulating materials or varnishes for resin film containing them, by heating and/or active irradiation, and condensation reaction.

摘要翻译： 本发明提供了显示低介电常数，高耐热性和高机械强度的有用的有机绝缘材料，以及使用它们的树脂膜和半导体器件。 本发明的有机绝缘材料包含具有可聚合不饱和键的基团的金刚烷结构化合物的预聚物。 通过凝胶渗透色谱法测定，预聚物的数均分子量基于聚苯乙烯为2,000至500,000。 含有可聚合不饱和键的基团优选为含有碳 - 碳三键的基团。 本发明的树脂膜通过有机绝缘材料或含有它们的树脂膜的清漆的交联反应，通过加热和/或主动照射和缩合反应而获得。

公开(公告)号：US20090318610A1

公开(公告)日：2009-12-24

申请号：US12546632

申请日：2009-08-24

申请人： Mihoko MATSUTANI ,  Atsushi Izumi ,  Yohko Sano ,  Kazuyoshi Fujita

发明人： Mihoko MATSUTANI ,  Atsushi Izumi ,  Yohko Sano ,  Kazuyoshi Fujita

IPC分类号： C08L55/00 ,  C08G65/34 ,  C08G65/38 ,  C08G61/00 ,  C08F10/14 ,  C08L71/10 ,  C08L71/00

CPC分类号： H01L21/02118 ,  C07C13/615 ,  C07C13/64 ,  C07C2603/74 ,  C07C2603/90 ,  C08G61/04 ,  C08G2261/3328 ,  H01B3/30 ,  H01L21/02282 ,  H01L21/312

摘要： There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer. X-VWnY  (1) (In formula (1), X and Y each independently represent one or more groups with polymerizable functional groups. V and W each represent a group having an adamantane or polyamantane structure, and they may be the same or different. The letter n represents an integer of 0 or greater).

摘要翻译： 提供具有低介电常数，高耐热性和高机械强度的有机绝缘材料，以及具有低介电常数，高耐热性和高机械强度的有机绝缘膜，以及包含上述的半导体器件。 包含由通式（1）表示的化合物或由通式（1）表示的化合物聚合而得到的聚合物或由通式（1）表示的化合物与聚合物的混合物的有机绝缘材料。 （1）（式（1）中，X和Y各自独立地表示一个以上具有聚合性官能团的基团，V和W各自表示具有金刚烷或聚金刚烷结构的基团，它们可以相同 或不同，字母n表示0以上的整数）。