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    Film-forming composition, insulating film and electronic device using the same
    2.
    发明申请
    Film-forming composition, insulating film and electronic device using the same 审中-公开
    成膜组合物，绝缘膜和使用其的电子器件

    公开(公告)号：US20070066782A1

    公开(公告)日：2007-03-22

    申请号：US11520614

    申请日：2006-09-14

    申请人： Hidetoshi Hiraoka

    发明人： Hidetoshi Hiraoka

    IPC分类号： C08F136/20

    CPC分类号： C08F281/00 ,  C09D4/00 ,  C08F212/36

    摘要： A film forming composition comprising: (A) a compound having at least two radical reactive functional groups; and (B) at least one of a radical crosslinking agent having a structure represented by formula (I) as defined in the specification and a radical crosslinking agent having a structure represented by formula (II) as defined in the specification, an insulating film obtained by using the composition and an electronic device having the insulating film.

    摘要翻译： 一种成膜组合物，其包含：（A）具有至少两个自由基反应性官能团的化合物; 和（B）具有本说明书中定义的由式（I）表示的结构的自由基交联剂和具有本说明书中定义的由式（II）表示的结构的自由基交联剂中的至少一种，获得的绝缘膜 通过使用该组合物和具有绝缘膜的电子器件。

    Phenylethynyl containing reactive additives
    3.
    发明授权
    Phenylethynyl containing reactive additives 失效

    公开(公告)号：US06441099B1

    公开(公告)日：2002-08-27

    申请号：US09726297

    申请日：2000-11-28

    申请人： John W. Connell ,  Joseph G. Smith, Jr. ,  Paul M. Hergenrother

    发明人： John W. Connell ,  Joseph G. Smith, Jr. ,  Paul M. Hergenrother

    IPC分类号： C08J300

    CPC分类号： C08G73/101 ,  C08F251/00 ,  C08F281/00 ,  C08F290/14 ,  C08G73/10

    摘要： Phenylethynyl containing reactive additives were prepared from aromatic diamines containing phenylethynyl groups and various ratios of phthalic anhydride and 4-phenylethynylphthalic anhydride in glacial acetic acid to form the imide in one step or in N-methyl-2-pyrrolidinone to form the amide acid intermediate. The reactive additives were mixed in various amounts (10% to 90%) with oligomers containing either terminal or pendent phenylethynyl groups (or both) to reduce the melt viscosity and thereby enhance processability. Upon thermal cure, the additives react and become chemically incorporated into the matrix and effect an increase in crosslink density relative to that of the host resin. This resultant increase in crosslink density has advantageous consequences on the cured resin properties such as higher glass transition temperature and higher modulus as compared to that of the host resin.

    Novel coating composition containing acetylene-conjugated diene random copolymers
    4.
    发明授权
    Novel coating composition containing acetylene-conjugated diene random copolymers 失效
    含有乙炔共轭二烯无规共聚物的新型涂料组合物

    公开(公告)号：US4006113A

    公开(公告)日：1977-02-01

    申请号：US504032

    申请日：1974-09-09

    申请人： Junji Furukawa ,  Eiichi Kobayashi ,  Takahiro Kawagoe

    发明人： Junji Furukawa ,  Eiichi Kobayashi ,  Takahiro Kawagoe

    IPC分类号： C08F236/04 ,  C08F279/02 ,  C08F281/00 ,  C09D121/00 ,  C09D191/00 ,  C08L91/00

    CPC分类号： C09D121/00 ,  C08F236/04 ,  C08F279/02 ,  C08F281/00 ,  C09D191/005

    摘要： A novel coating composition can be obtained by compounding 100 parts by weight of (A) acetylene-conjugated random copolymer having an acetylene unit content of 5-60 mol% and a block character P of 0.8-1.2 and 5-1,000 parts by weight of (B) carbon-carbon double bond-containing compound. The resulting coating composition shows a rapid curing velocity, which has never been seen, and provides an excellent coating film.When the above described composition is added with (C) a curing promoter or a radical initiator, the curing velocity is more increased and when the above described composition is added with (D) a filler or a pigment, excellent coating films suitable for various applications can be formed.

    摘要翻译： 可以通过将100重量份乙炔单元含量为5-60摩尔％的乙炔共轭无规共聚物和0.8-1.2的嵌段特征P和5-1,000重量份的 （B）含碳 - 碳双键的化合物。 所得到的涂料组合物显示出快速的固化速度，从未见过，并且提供了优异的涂膜。

    ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE
    6.
    发明申请
    ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE 审中-公开
    有机绝缘材料，使用其的树脂膜的变化，树脂膜和半导体器件

    公开(公告)号：US20100004379A1

    公开(公告)日：2010-01-07

    申请号：US12557530

    申请日：2009-09-11

    申请人： Yohko Sano ,  Mihoko Matsutani ,  Kazuyoshi Fujita

    发明人： Yohko Sano ,  Mihoko Matsutani ,  Kazuyoshi Fujita

    IPC分类号： C08L55/00 ,  C08F36/02 ,  C08F38/02

    CPC分类号： H01L21/02118 ,  C08F281/00 ,  C08F290/00 ,  C08F290/04 ,  C08F290/06 ,  C08F290/14 ,  C08F299/00 ,  C09D4/00 ,  G03F7/025 ,  H01L21/02282 ,  H01L21/02345 ,  H01L21/312

    摘要： The invention provides useful organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as resin films and semiconductor devices employing them. The organic insulating materials of the invention comprise prepolymers of adamantane structure compounds having polymerizable unsaturated bond-containing groups. The prepolymers have number-average molecular weights of between 2,000 and 500,000 based on polystyrene, as measured by gel permeation chromatography. The polymerizable unsaturated bond-containing groups are preferably groups that contain carbon-carbon triple bonds. The resin films of the invention are obtained by crosslinking reaction of the organic insulating materials or varnishes for resin film containing them, by heating and/or active irradiation, and condensation reaction.

    摘要翻译： 本发明提供了显示低介电常数，高耐热性和高机械强度的有用的有机绝缘材料，以及使用它们的树脂膜和半导体器件。 本发明的有机绝缘材料包含具有可聚合不饱和键的基团的金刚烷结构化合物的预聚物。 通过凝胶渗透色谱法测定，预聚物的数均分子量基于聚苯乙烯为2,000至500,000。 含有可聚合不饱和键的基团优选为含有碳 - 碳三键的基团。 本发明的树脂膜通过有机绝缘材料或含有它们的树脂膜的清漆的交联反应，通过加热和/或主动照射和缩合反应而获得。

    Derivatized carbon monoxide copolymers
    7.
    发明授权
    Derivatized carbon monoxide copolymers 失效
    衍生一氧化碳共聚物

    公开(公告)号：US06306979B1

    公开(公告)日：2001-10-23

    申请号：US09623711

    申请日：2000-09-07

    申请人： Joachim Queisser ,  Michael Geprägs ,  Bernhard Rieger ,  Roland Wursche

    发明人： Joachim Queisser ,  Michael Geprägs ,  Bernhard Rieger ,  Roland Wursche

    IPC分类号： C08F28300

    CPC分类号： C09D151/00 ,  C08F255/00 ,  C08F257/02 ,  C08F281/00 ,  C08F290/06 ,  C08F291/00 ,  C08G18/64 ,  C08G18/71 ,  C08G67/02

    摘要： In a process for the preparation of derivatized carbon monoxide copolymers, functionalized linear, strictly alternating carbon monoxide copolymers of carbon monoxide, at least one 1-alkene (A), where (A) is an aryl compound substituted by at least one terminal allyl or homoallyl moiety and by at least one hydroxyl or amino group, or an a-olefinically unsaturated aliphatic alcohol, and, if desired, at least one C2-C20-1-alkene (B) are reacted with an organic compound (C) having at least one electrophilic group in an aprotic organic solvent.

    摘要翻译： 在制备衍生的一氧化碳共聚物的过程中，一氧化碳，至少一种1-烯烃（A）的功能化的线性，严格交替的一氧化碳共聚物，其中（A）是被至少一个末端烯丙基或 高度烯丙基部分和至少一个羟基或氨基或α-烯属不饱和脂族醇，并且如果需要，至少一种C 2 -C 20 -1-烯烃（B）与有机化合物（C）反应， 在非质子有机溶剂中至少有一个亲电子基团。

    Poly(arylacetylene) molding compositions
    8.
    发明授权
    Poly(arylacetylene) molding compositions 失效
    聚（芳基乙炔）成型组合物

    公开(公告)号：US4070333A

    公开(公告)日：1978-01-24

    申请号：US430101

    申请日：1974-01-02

    申请人： Harold Jabloner

    发明人： Harold Jabloner

    IPC分类号： C08F38/00 ,  C08F281/00 ,  C08K7/14

    CPC分类号： C08F38/00 ,  C08F281/00

    摘要： The invention relates to poly(arylacetylene) molding compositions and thermoset resins prepared therefrom. The molding compositions comprise blends of a polyacetylenically unsaturated prepolymer and from about 2 to about 70%, by weight of the prepolymer, of a monomeric acetylenically unsaturated aromatic compound having a melting point below about 185.degree. C. and a boiling point above about 250.degree. C. The polyacetylenically unsaturated prepolymer is a polymer of at least one polyacetylenically substituted aromatic compound, such as a diethynylbenzene, which prepolymer has a number average molecular weight of about 900 to 12,000 and contains about 5 to 20% by weight of acetylenic groups. Typical monomeric acetylenic aromatic compounds which are blended with the prepolymer are diphenylacetylene and diphenylbutadiyne.

    摘要翻译： 本发明涉及聚（芳基乙炔）成型组合物和由其制备的热固性树脂。 模塑组合物包含聚乙烯不饱和预聚物和约2-约70％（重量）的预聚物，熔点低于约185℃，沸点高于约250℃的单体炔属不饱和芳族化合物的共混物 C.聚乙烯基不饱和预聚物是至少一种聚乙炔基取代的芳族化合物如二乙炔基苯的聚合物，该预聚物的数均分子量为约900至12,000，并含有约5至20重量％的炔属基团。 与预聚物共混的典型单体炔属芳族化合物是二苯基乙炔和二苯基丁二炔。

    Coating liquid for forming insulating film and method for producing insulating film
    10.
    发明申请
    Coating liquid for forming insulating film and method for producing insulating film 审中-公开
    用于形成绝缘膜的涂布液和用于制造绝缘膜的方法

    公开(公告)号：US20040197484A1

    公开(公告)日：2004-10-07

    申请号：US10806279

    申请日：2004-03-23

    申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Yuji Yoshida

    IPC分类号： B05D003/02

    CPC分类号： C08F277/00 ,  C08F281/00 ,  C08F290/04 ,  C08F290/14 ,  C09D151/003

    摘要： A coating liquid for forming insulating film which can form insulating film having high adhesion to semiconductor substrate is provided. The coating liquid for forming insulating film comprising following (A) and (B), wherein a water content in the coating liquid is not more than 1% by weight: (A): a heat-reactive nonpolar compound or polymer thereof wherein the heat-reactive nonpolar compound is selected from the group consisting of a compound having not less than two CnullC double bonds, a compound having not less than two CnullC triple bonds and a compound having at least one CnullC double bond and at least one CnullC triple bond, (B): at least one compound selected from the group consisting of silane compounds represented by following formulae (1) to (3).

    摘要翻译： 提供一种用于形成能够形成与半导体衬底具有高粘附性的绝缘膜的绝缘膜的涂布液。 用于形成绝缘膜的涂布液包括以下（A）和（B），其中涂布液中的水分含量不超过1重量％：（A）：热反应性非极性化合物或其聚合物，其中热 反应性非极性化合物选自不少于两个CC双键的化合物，具有不少于两个CC三键的化合物和具有至少一个CC双键和至少一个CC三键的化合物， （B）：选自由下式（1）〜（3）表示的硅烷化合物的至少一种化合物。