Integrated Assemblies
    1.
    发明公开

    公开(公告)号:US20240161812A1

    公开(公告)日:2024-05-16

    申请号:US18415023

    申请日:2024-01-17

    CPC classification number: G11C11/4091 G11C11/4074 G11C11/4094 G11C11/4097

    Abstract: Some embodiments include an integrated assembly having a memory array over a base. First sense-amplifier-circuitry is associated with the base and includes sense amplifiers directly under the memory array. Vertically-extending digit lines are associated with the memory array and are coupled with the first sense-amplifier-circuitry. Second sense-amplifier-circuitry is associated with the base and is offset from the first sense-amplifier-circuitry. Control circuitry is configured to selectively couple the digit lines to either a voltage supply terminal or to the second sense-amplifier-circuitry.

    Multi-mode voltage pump and control

    公开(公告)号:US11824441B2

    公开(公告)日:2023-11-21

    申请号:US17840434

    申请日:2022-06-14

    CPC classification number: H02M3/07 G11C5/145 G11C17/18 H03K19/20 G11C11/4074

    Abstract: A multi-mode voltage pump may be configured to select an operational mode based on a temperature of a semiconductor device. The selected mode for a range of temperature values may be determined based on process variations and operational differences caused by temperature changes. The different selected modes of operation of the multi-mode voltage pump may provide pumped voltage having different voltage magnitudes. For example, the multi-mode voltage pump may operate in a first mode that uses two stages to provide a first VPP voltage, a second mode that uses a single stage to provide a second VPP voltage, or a third mode that uses a mixture of a single stage and two stages to provide a third VPP voltage. The third VPP voltage may be between the first and second VPP voltages, with the first VPP voltage having the greatest magnitude. Control signal timing of circuitry of the multi-mode voltage pump may be based on an oscillator signal.

    METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS

    公开(公告)号:US20230005932A1

    公开(公告)日:2023-01-05

    申请号:US17364281

    申请日:2021-06-30

    Abstract: A method of forming a microelectronic device comprises forming a first microelectronic device structure comprising a first semiconductor structure, a first isolation material over the first semiconductor structure, and first conductive routing structures over the first semiconductor structure and surrounded by the first isolation material. A second microelectronic device structure comprising a second semiconductor structure and a second isolation material over the second semiconductor structure is formed. The second isolation material is bonded to the first isolation material to attach the second microelectronic device structure to the first microelectronic device structure. Memory cells comprising portions of the second semiconductor structure are formed after attaching the second microelectronic device structure to the first microelectronic device structure. Control logic devices including transistors comprising portions of the first semiconductor structure are formed after forming the memory cells. Microelectronic devices, electronic systems, and additional methods are also described.

    MULTI-MODE VOLTAGE PUMP AND CONTROL

    公开(公告)号:US20210359598A1

    公开(公告)日:2021-11-18

    申请号:US16321769

    申请日:2018-12-04

    Abstract: A multi-mode voltage pump may be configured to select an operational mode based on a temperature of a semiconductor device. The selected mode for a range of temperature values may be determined based on process variations and operational differences caused by temperature changes. The different selected modes of operation of the multi-mode voltage pump may provide pumped voltage having different voltage magnitudes. For example, the multi-mode voltage pump may operate in a first mode that uses two stages to provide a first VPP voltage, a second mode that uses a single stage to provide a second VPP voltage, or a third mode that uses a mixture of a single stage and two stages to provide a third VPP voltage. The third VPP voltage may be between the first and second VPP voltages, with the first VPP voltage having the greatest magnitude. Control signal timing of circuitry of the multi-mode voltage pump may be based on an oscillator signal.

    MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS

    公开(公告)号:US20240290375A1

    公开(公告)日:2024-08-29

    申请号:US18409723

    申请日:2024-01-10

    CPC classification number: G11C11/4091 G11C5/063 G11C11/4085 G11C11/4097

    Abstract: A microelectronic device includes a memory array structure and a control circuitry structure vertically overlying and bonded to the memory array structure. The memory array structure includes array regions respectively including memory cells, digit lines, and word lines within horizontal areas thereof. The control circuitry structure includes control circuitry regions, sense amplifier (SA) sections including SA circuitry, and sub-word line driver (SWD) sections including SWD circuitry. The control circuitry regions horizontally overlap the array regions of the memory array structure. The SA sections respectively horizontally overlap each of two of the control circuitry regions horizontally neighboring one another in a first direction. The SWD sections are respectively interposed between two other of the control circuitry regions horizontally neighboring one another in a second direction orthogonal to the first direction. Additional microelectronic devices, memory devices, and electronic systems are also described.

    Integrated Assemblies
    6.
    发明申请

    公开(公告)号:US20220392515A1

    公开(公告)日:2022-12-08

    申请号:US17887226

    申请日:2022-08-12

    Abstract: Some embodiments include an integrated assembly having a memory array over a base. First sense-amplifier-circuitry is associated with the base and includes sense amplifiers directly under the memory array. Vertically-extending digit lines are associated with the memory array and are coupled with the first sense-amplifier-circuitry. Second sense-amplifier-circuitry is associated with the base and is offset from the first sense-amplifier-circuitry. Control circuitry is configured to selectively couple the digit lines to either a voltage supply terminal or to the second sense-amplifier-circuitry.

    Apparatuses and methods for dynamic timing of row pull down operations

    公开(公告)号:US10854274B1

    公开(公告)日:2020-12-01

    申请号:US16584746

    申请日:2019-09-26

    Abstract: Apparatuses, systems and methods for dynamic timing of row pull-down operations are described herein. When a word line is accessed, the row decoder may drive that word line to an active voltage, and then to an intermediate voltage. The row decoder may maintain that word line at the intermediate voltage until another word line in the same group of word lines as the accessed word line receives an access command, at which point the first word line is driven to an inactive voltage. For example, if the word lines are grouped by bank, then after an access to a first word line, the first word line may be maintained at the intermediate voltage until a second wordline in the same bank as the first word line is accessed. This may help to mitigate the effect on other nearby word lines of driving a word line to the inactive voltage.

    Integrated assemblies
    9.
    发明授权

    公开(公告)号:US11935583B2

    公开(公告)日:2024-03-19

    申请号:US17887226

    申请日:2022-08-12

    CPC classification number: G11C11/4091 G11C11/4074 G11C11/4094 G11C11/4097

    Abstract: Some embodiments include an integrated assembly having a memory array over a base. First sense-amplifier-circuitry is associated with the base and includes sense amplifiers directly under the memory array. Vertically-extending digit lines are associated with the memory array and are coupled with the first sense-amplifier-circuitry. Second sense-amplifier-circuitry is associated with the base and is offset from the first sense-amplifier-circuitry. Control circuitry is configured to selectively couple the digit lines to either a voltage supply terminal or to the second sense-amplifier-circuitry.

    Fuse logic to perform selectively enabled ECC decoding

    公开(公告)号:US11586495B2

    公开(公告)日:2023-02-21

    申请号:US16929253

    申请日:2020-07-15

    Inventor: Beau D. Barry

    Abstract: Fuse logic is configured to selectively enable certain group of fuses of a fuse array to support one of column (or row) redundancy in one application or error correction code (ECC) operations in another application. For example, the fuse logic may decode the group of fuses to enable a replacement column (or row) of memory cells in one mode or application, and decodes a subset of the group of fuses to retrieve ECC data corresponding to a second group of fuses are encoded to enable a different replacement column or row of memory cells in a second mode or application. The fuse logic includes an ECC decode logic circuit that is selectively enabled to detect and correct errors in data encoded in the second group of fuses based on the ECC data encoded in the subset of fuses of the first group of fuses.

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