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    Device configuration-based thermal management control
    2.
    发明授权
    Device configuration-based thermal management control 有权

    公开(公告)号：US11474577B2

    公开(公告)日：2022-10-18

    申请号：US16905717

    申请日：2020-06-18

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Chau Van Ho ,  Bo Dan ,  Brandon Earl Gary ,  Gary Russell McClary

    IPC: G06F11/30 ,  G06F1/20 ,  G06F1/16 ,  G06F1/28 ,  H04M1/02 ,  G06F1/30

    Abstract: Cooling of an electronic device that includes a first portion and a second portion is provided. The first portion and the second portion are rotatable relative to each other. A first sensor measures a first temperature at a first location within or on the electronic device continuously or intermittently. A second sensor measures a second temperature at a second location within or on the electronic device continuously or intermittently. A processor identifies a first state of the electronic device or a second state of the electronic device. The processor controls operation of the electronic device based on the first measured temperature and the second measured temperature when the electronic device is in the identified first state and controls the operation of the electronic device based on the first measured temperatures but not based on the second measured temperatures when the electronic device is in the identified second state.

    Adaptive cooling techniques in electronic devices
    3.
    发明授权
    Adaptive cooling techniques in electronic devices 有权

    公开(公告)号：US10754398B2

    公开(公告)日：2020-08-25

    申请号：US15160893

    申请日：2016-05-20

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Chau Van Ho ,  Bo Dan ,  Spencer B. Eggert

    IPC: G06F1/20 ,  G05B19/406

    Abstract: Cooling of a computing device is described herein. The computing device includes a plurality of fans, a plurality of sensors, and a processor in communication with the plurality of fans and the plurality of sensors. Each sensor of the plurality of sensors is associated with at least one fan of the plurality of fans and is operable to determine a temperature. The processor is configured to determine, for each sensor of the plurality of sensors, a difference between the determined temperature and a predetermined temperature corresponding to the sensor. The processor is also configured to compared the determined differences. The processor is configured to increase a speed of at least a first fan of the plurality of fans based on the comparison, and determine which fan of the plurality of fans to decrease fan speed based on the increased speed of the first fan.

    Ventilated shield can
    7.
    发明授权
    Ventilated shield can 有权

    公开(公告)号：US11089712B2

    公开(公告)日：2021-08-10

    申请号：US16358187

    申请日：2019-03-19

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Tianyu Zhao ,  Eugene Lee ,  Bo Dan

    IPC: H05K7/20 ,  H05K1/02 ,  H05K9/00 ,  G06F1/20

    Abstract: A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.

    SELF-ADAPTIVE VENTS
    8.
    发明申请
    SELF-ADAPTIVE VENTS 审中-公开

    公开(公告)号：US20180217644A1

    公开(公告)日：2018-08-02

    申请号：US15422180

    申请日：2017-02-01

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Bo Dan ,  James David Wahl ,  Chau Van Ho

    IPC: G06F1/20 ,  H05K7/20

    Abstract: Thermal management devices and systems, and corresponding methods of cooling an electronic device are described herein. A method for cooling an electronic device that includes a housing and a vent in the housing includes monitoring, by a sensor, an operating condition of the electronic device. The vent is opened or closed based on the monitored condition of the electronic device.

    SHARED COOLING FOR THERMALLY CONNECTED COMPONENTS IN ELECTRONIC DEVICES
    9.
    发明申请
    SHARED COOLING FOR THERMALLY CONNECTED COMPONENTS IN ELECTRONIC DEVICES 审中-公开

    公开(公告)号：US20170364130A1

    公开(公告)日：2017-12-21

    申请号：US15186423

    申请日：2016-06-17

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Chau Van Ho ,  Bo Dan ,  Spencer Eggert ,  Greg Nielsen ,  Matthew Gen

    IPC: G06F1/20 ,  G06F1/32 ,  H05K7/20

    CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3243 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/16

    Abstract: Cooling of at least two heat generating electronic components of a computing device is described herein. The computing device includes the at least two heat generating electronic components. The at least two heat generating electronic components includes a first heat generating electronic component and a second heat generating electronic component. The first heat generating electronic component and the second heat generating electronic component are in thermal communication. The computing device also includes a first sensor operable to measure a first temperature. The first temperature is associated with the first heat generating electronic component. The first heat generating electronic component, the second heat generating electronic component, another heat generating electronic component of the at least two heating generating electronic components, or any combination thereof is configured to compare the first measured temperature to a predetermined temperature, and decrease a power for the second heat generating electronic component based on the comparison.

    ADAPTIVE COOLING TECHNIQUES IN ELECTRONIC DEVICES
    10.
    发明申请
    ADAPTIVE COOLING TECHNIQUES IN ELECTRONIC DEVICES 审中-公开

    公开(公告)号：US20170336839A1

    公开(公告)日：2017-11-23

    申请号：US15160893

    申请日：2016-05-20

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Chau Van Ho ,  Bo Dan ,  Spencer B. Eggert

    IPC: G06F1/20 ,  G05B19/406

    CPC classification number: G06F1/206 ,  G05B19/406 ,  G05B2219/49216 ,  G06F1/20

    Abstract: Cooling of a computing device is described herein. The computing device includes a plurality of fans, a plurality of sensors, and a processor in communication with the plurality of fans and the plurality of sensors. Each sensor of the plurality of sensors is associated with at least one fan of the plurality of fans and is operable to determine a temperature. The processor is configured to determine, for each sensor of the plurality of sensors, a difference between the determined temperature and a predetermined temperature corresponding to the sensor. The processor is also configured to compared the determined differences. The processor is configured to increase a speed of at least a first fan of the plurality of fans based on the comparison, and determine which fan of the plurality of fans to decrease fan speed based on the increased speed of the first fan.

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