摘要:
A method for providing a high-response and wide-viewing-angle liquid crystal panel capable of causing a transition of liquid crystal, called the OCB mode, into a bend configuration in a short time, by providing a period in which a potential difference higher than that in a normal image display period is continuously applied between gate lines and opposing electrodes or between pixel electrodes and the opposing electrodes of a liquid crystal panel.
摘要:
To provide a high-response and wide-viewing-angle liquid crystal panel capable of causing a transition of liquid crystal, which is called the OCB mode, into a bend configuration in a short time, there is provided a period in which a potential difference higher than that in a normal image display period is continuously applied between gate lines and opposing electrodes or between pixel electrodes and the opposing electrodes of the liquid crystal panel.Also, ingenuities are exercised on the period in which the potential difference is continuously applied between them and on the structure of picture elements.
摘要:
A four-mask process and a three-mask process proposal are constructed for a TN-type liquid crystal display device and an IPS-type liquid crystal device in which the formation of a passivation insulating layer is not required by streamlining the formation of a scan line and a pseudo-pixel element, both comprising a laminate made of a transparent conductive layer and a metal layer, at the same time and the formation of the transparent conductive pixel electrode by removing the metal layer on the pseudo-pixel electrode at the time of the formation of the opening in the gate insulating layer, by streamlining the treatment of the formation process of the contact and the formation process of the protective insulating layer using one photomask due to the introduction of half-tone exposure technology, and the formation of source-drain wires for etch-stop type insulating gate-type transistor using a photosensitive organic insulating layer and leaving the photosensitive organic insulating layer unchanged on source-drain wires or on the source wire (signal line), or by forming an anodized layer, which is an insulating layer, on source-drain wires.
摘要:
When the channel length is shortened in a conventional manufacturing method with a reduced numbers of processes, the manufacturing margin is decreased, causing a lower yield. A four-mask process and a three-mask process proposal are constructed for a TN type liquid crystal display device made by combining a novel technology for streamlining the signal wire formation process and pixel electrode formation process by adopting a half-tone exposure technology, a novel technology for streamlining the electrode terminal protective layer formation process by adopting a half-tone exposure technology in a publicly known source and drain wiring anodization process, and a novel technology for streamlining the scan line formation process and the semiconductor layer formation process, the scan line formation process and the etch stop layer formation process, and the scan line formation process and the contact formation process.
摘要:
A metal thin film by laser CVD, or an opaque film 30, by micro-jet application of an organic resin containing either one or both of black pigment and dye, is formed on the outer side of a substrate 200 or a substrate 900 at a position corresponding to a light point defect detected in image inspection after panel assembling step or after mounting step, to convert into a black point, and therefore by converting the light point defect into a black point, the yield is enhanced.
摘要:
A liquid crystal image display device is disclosed of a type comprising a first transparent insulating substrate having a plurality of scanning line, a plurality of signal lines and an insulated-gate transistor for each pixel and a pixel electrode for each pixel, a second transparent insulating substrate having a transparent electroconductive counterelectrode and positioned spaced a predetermined distance from the first substrate to define a chamber therebetween, and a liquid crystal material filled in the chamber. When a drain wiring connecting a drain of the insulated-gate transistor with the associated pixel electrode and each of said signal lines are formed, a connecting layer that connects between the drain wiring and the associated signal line is formed, followed by depositing a metallic layer, containing aluminum as a main component, over the connecting layer. Thereafter, the signal line and the drain wiring are selectively formed, followed by formation of a protective layer for protecting the connecting layer from anodization. After surfaces of the signal line and the drain wiring have been anodized to render them to be insulating, the protective layer is removed to disconnect the signal line from the drain wiring.
摘要:
Provided is an active matrix substrate manufacturing method, including the steps of: selectively forming a laminated structure pattern, by forming the laminated structure on a glass substrate (2), by forming a first photosensitive resin pattern (PR) on the laminated structure, and by selectively forming the laminated structure pattern using the first photosensitive resin pattern (PR), the laminated structure including a metal layer (a scanning signal line (11) material), a gate insulative layer (30), and a semiconductor layer (31, 33) (transistor material); fluorinating a surface of the first photosensitive resin pattern (PR) by dry-etching with fluorine gas; applying a coating-type transparent insulative resin (60) onto the glass substrate (2) to fill a space in the laminated structure pattern; and removing the fluorinated first photosensitive resin pattern (PR). This enables to form, in an active matrix substrate manufacturing process, a scanning signal line and a semiconductor layer with a single mask process.
摘要:
According to the insulated gate transistor, a gate electrode (11A) is provided on a main surface of a glass substrate (2); a first part of an insulating layer (gate insulating layer (30) and transparent inorganic insulating layer (60)) is thicker than a second part of the insulating layer (gate insulating layer (30)), the first part being between (i) the gate electrode (11A) and (ii) a source electrode (12) and a drain electrode (21) of the insulated gate transistor, and the second part being between (i) the gate electrode (11A) and (ii) a channel section (31A) of the insulated gate transistor. This makes it possible to reduce parasitic capacitor without deteriorating characteristics of the transistor.
摘要:
A four-mask process and a three-mask process proposal are constructed for a TN-type liquid crystal display device and an IPS-type liquid crystal device in which the formation of a passivation insulating layer is not required by streamlining the formation of a scan line and a pseudo-pixel element, both comprising a laminate made of a transparent conductive layer and a metal layer, at the same time and the formation of the transparent conductive pixel electrode by removing the metal layer on the pseudo-pixel electrode at the time of the formation of the opening in the gate insulating layer, by streamlining the treatment of the formation process of the contact and the formation process of the protective insulating layer using one photomask due to the introduction of half-tone exposure technology, and the formation of source-drain wires for etch-stop type insulating gate-type transistor using a photosensitive organic insulating layer and leaving the photosensitive organic insulating layer unchanged on source-drain wires or on the source wire (signal line), or by forming an anodized layer, which is an insulating layer, on source-drain wires.
摘要:
A four-mask process and a three-mask process proposal are constructed for a TN-type liquid crystal display device and an IPS-type liquid crystal device in which the formation of a passivation insulating layer is not required by streamlining the formation of a scan line and a pseudo-pixel element, both comprising a laminate made of a transparent conductive layer and a metal layer, at the same time and the formation of the transparent conductive pixel electrode by removing the metal layer on the pseudo-pixel electrode at the time of the formation of the opening in the gate insulating layer, by streamlining the treatment of the formation process of the contact and the formation process of the protective insulating layer using one photomask due to the introduction of half-tone exposure technology, and the formation of source-drain wires for etch-stop type insulating gate-type transistor using a photosensitive organic insulating layer and leaving the photosensitive organic insulating layer unchanged on source-drain wires or on the source wire (signal line), or by forming an anodized layer, which is an insulating layer, on source-drain wires.