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公开(公告)号:US20110056623A1
公开(公告)日:2011-03-10
申请号:US12615456
申请日:2009-11-10
申请人: Min-Ho IM , Sung-Hwan Choi , Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jeon
发明人: Min-Ho IM , Sung-Hwan Choi , Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jeon
IPC分类号: B29C65/02
CPC分类号: C09J5/06 , B32B37/0015 , B32B37/06 , B32B2457/14 , C08G2650/56 , C08L31/06 , C08L75/14 , C08L2205/05 , C09J7/35 , C09J171/00 , C09J2433/00 , C09J2463/00 , H01L21/568 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/32245 , H01L2224/48175 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/30107 , H01L2924/3511 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要: This disclosure provides a method for laminating an adhesive tape and a lead frame, more specifically to reduce the warpage of a lead frame after heated lamination in which an adhesive tape for manufacturing semiconductor devices is attached to the lead frame, satisfying all the properties required for lamination, and avoiding adhesive residues from adhesive tapes and the leakage of a sealing resin. A method for laminating an adhesive tape and a lead frame comprises laminating an adhesive tape and a lead, wherein the lamination temperature of an adhesive tape surface and that of a lead frame surface are different from each other, for example, wherein the lamination temperature of the lead frame surface is lower than that of the adhesive tape surface by about 1 to about 200° C.
摘要翻译: 本公开内容提供了一种用于层压粘合带和引线框架的方法,更具体地说是为了减少加热层压之后的引线框架的翘曲,其中用于制造半导体器件的胶带粘附到引线框架上,满足所有的性能 层压,并避免胶带的粘合剂残留和密封树脂的泄漏。 粘合带和引线框架的层压方法包括层压粘合带和引线,其中粘合带表面和引线框架表面的层压温度彼此不同,例如其中层压温度为 引线框架表面比粘合带表面低约1至约200℃。
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公开(公告)号:US20110318580A1
公开(公告)日:2011-12-29
申请号:US13254939
申请日:2009-03-09
申请人: Sung-Hwan Choi , Ki-Jeong Moon , Hae-Sang Jeon , Chang-Hoon Sim
发明人: Sung-Hwan Choi , Ki-Jeong Moon , Hae-Sang Jeon , Chang-Hoon Sim
IPC分类号: B32B7/12
CPC分类号: C09J7/0242 , C08G2650/56 , C08L33/08 , C08L2312/06 , C08L2666/04 , C09J7/22 , C09J7/35 , C09J171/00 , C09J2463/00 , Y02P20/149 , Y10T428/2878
摘要: There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.
摘要翻译: 提供了一种用于制造电子部件的胶带,包括耐热基材和含有设置在耐热基材上的粘合剂组合物的粘合剂层,其中粘合剂组合物包含苯氧树脂,固化剂,能量射线固化丙烯酸 树脂和光引发剂,并且其中粘合剂层通过加热和能量射线固化。
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公开(公告)号:US09090800B2
公开(公告)日:2015-07-28
申请号:US13254939
申请日:2009-03-09
申请人: Sung-Hwan Choi , Ki-Jeong Moon , Hae-Sang Jeon , Chang-Hoon Sim
发明人: Sung-Hwan Choi , Ki-Jeong Moon , Hae-Sang Jeon , Chang-Hoon Sim
IPC分类号: C09J7/02 , C09J175/16 , C09J171/00 , C08L75/16 , C08L71/00 , C08L33/08
CPC分类号: C09J7/0242 , C08G2650/56 , C08L33/08 , C08L2312/06 , C08L2666/04 , C09J7/22 , C09J7/35 , C09J171/00 , C09J2463/00 , Y02P20/149 , Y10T428/2878
摘要: There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.
摘要翻译: 提供了一种用于制造电子部件的胶带,包括耐热基材和含有设置在耐热基材上的粘合剂组合物的粘合剂层,其中粘合剂组合物包含苯氧树脂,固化剂,能量射线固化丙烯酸 树脂和光引发剂,并且其中粘合剂层通过加热和能量射线固化。
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公开(公告)号:US20100330278A1
公开(公告)日:2010-12-30
申请号:US12862611
申请日:2010-08-24
申请人: Sung-Hwan Choi , Ki-Jeong Moon , Hae-Sang Jeon
发明人: Sung-Hwan Choi , Ki-Jeong Moon , Hae-Sang Jeon
IPC分类号: C23C16/30
摘要: There is provided a method for treating a surface of a substrate, comprising forming a layer, such as a mixed self-assembled monolayer (SAM), on the surface via chemical vapor deposition (CVD) with a CF3-functionalized organic silane and a CH3-functionalized organic silane, wherein the length of a carbon chain of the CH3-functional organic silane is shorter than a carbon chain of the CF3-functionalized organic silane.
摘要翻译: 提供了一种用于处理基材表面的方法,包括通过化学气相沉积(CVD)与CF 3官能化的有机硅烷和CH 3在表面上形成诸如混合的自组装单层(SAM)的层 官能化的有机硅烷,其中CH 3官能的有机硅烷的碳链的长度短于CF 3官能化的有机硅烷的碳链。
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