公开(公告)号：US07102876B2

公开(公告)日：2006-09-05

申请号：US11039924

申请日：2005-01-24

申请人： Min-Lin Lee ,  Chin-Sun Shyu ,  Shur-Fen Liu ,  Jing-Pin Pan ,  Jinn-Shing King

发明人： Min-Lin Lee ,  Chin-Sun Shyu ,  Shur-Fen Liu ,  Jing-Pin Pan ,  Jinn-Shing King

IPC分类号： H01G4/20

CPC分类号： H01G4/35 ,  H01G4/20 ,  H05K1/162 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0355

摘要： An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.

摘要翻译： 公开了一种用于按压式印刷电路板的交错条纹电容器基底结构。 为了满足现代电子系统的高频，高速和高密度要求，交错条纹电容器基板结构使用不同介电系数的几种介电材料制成介电层。 一个电介质层可以堆叠在另一个上以形成多层电容器基板，使得单个电容器基板可以提供去耦电容器所需的最高电容以抑制高频噪声信号，并且高电平基板所需的低介电系数基板， 速度信号传输。 这同时实现了降低高频传输时间并抑制高频噪声的效果。

公开(公告)号：US20050146840A1

公开(公告)日：2005-07-07

申请号：US11039924

申请日：2005-01-24

申请人： Min-Lin Lee ,  Chin-Sun Shyu ,  Shur-Fen Liu ,  Jing-Pin Pan ,  Jinn-Shing King

发明人： Min-Lin Lee ,  Chin-Sun Shyu ,  Shur-Fen Liu ,  Jing-Pin Pan ,  Jinn-Shing King

IPC分类号： H01G4/20 ,  H01G4/35 ,  H05K1/16

CPC分类号： H01G4/35 ,  H01G4/20 ,  H05K1/162 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0355

摘要： An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.

摘要翻译： 公开了一种用于按压式印刷电路板的交错条纹电容器基底结构。 为了满足现代电子系统的高频，高速和高密度要求，交错条纹电容器基板结构使用不同介电系数的几种介电材料制成介电层。 一个电介质层可以堆叠在另一个上以形成多层电容器基板，使得单个电容器基板可以提供去耦电容器所需的最高电容以抑制高频噪声信号，并且高电平基板所需的低介电系数基板， 速度信号传输。 这同时实现了降低高频传输时间并抑制高频噪声的效果。

公开(公告)号：US06780943B2

公开(公告)日：2004-08-24

申请号：US10162400

申请日：2002-06-05

申请人： Shur-Fen Liu ,  Meng-Huei Chen ,  Jinn-Shing King ,  Jing-Pin Pan

发明人： Shur-Fen Liu ,  Meng-Huei Chen ,  Jinn-Shing King ,  Jing-Pin Pan

IPC分类号： C08K336

CPC分类号： H05K1/0313 ,  C08F283/08 ,  C08K5/3415 ,  C08K5/3462 ,  C08L63/00 ,  C08L71/126 ,  C08F222/40 ,  C08L71/12 ,  C08L2666/22

摘要： A resin composition useful in the fabrication of circuit boards comprises (i) 1˜15 W % of bismaleimide modified by barbituric acid (BTA) and its derivatives; and (ii) 20˜50 wt % of polyphenylene ether (PPE) chain-broken in a phenol resin; wherein the phenol resin is terpene phenol resin or dicyclopentadiene phenol resin. Other additives, such as curing agent, catalyst or inorganic particle additive can be added as well, based on requirements. According to the invention, terpene novolac resin and initiator (peroxide) are added in polyphenylene ether so that molecules are rearranged to form a PPE resin having lower molecular weight and higher crosslinking density. Furthermore, BMI/epoxy resin/PPE are combined in different weight percentages. Semi-interpenetrating polymer network structures are thus formed. Consequently, Tg and resistances both to heat and solvent of the resin are increased.

摘要翻译： 用于制造电路板的树脂组合物包含（i）1〜15％的由巴比妥酸（BTA）及其衍生物改性的双马来酰亚胺; 和（ii）在酚醛树脂中链断裂的20〜50重量％的聚苯醚（PPE）; 其中所述酚醛树脂是萜烯酚树脂或二环戊二烯酚树脂。 也可以根据要求加入其他添加剂，如固化剂，催化剂或无机颗粒添加剂。 根据本发明，将萜烯酚醛清漆树脂和引发剂（过氧化物）加入到聚苯醚中，使分子重新排列形成具有较低分子量和较高交联密度的PPE树脂。 此外，BMI /环氧树脂/ PPE以不同的重量百分比组合。 因此形成半互穿聚合物网络结构。 因此，提高了Tg和对树脂的热和溶剂的电阻。

公开(公告)号：US6117951A

公开(公告)日：2000-09-12

申请号：US253836

申请日：1999-02-19

申请人： Shur-Fen Liu ,  Jinn-Shing King ,  Jing-Pin Pan

发明人： Shur-Fen Liu ,  Jinn-Shing King ,  Jing-Pin Pan

IPC分类号： C09J179/08 ,  C08L79/08

CPC分类号： C09J179/08

摘要： An adhesive tape for lead-on-chip (LOC) IC applications containing a polyamide-based adhesive composition which is the reaction product from a reaction mixture of: (a) a pre-imidized polyamic acid; and (b) a bismaleimide that has been modified by a barbituric acid of a derivative of barbituric acid to become a barbituric acid modified bismaleimide. The pre-imidized polyamic acid is a reaction product from a reaction mixture that contains a polyamic acid and a cyclizing agent. The polyamide-based adhesive composition provides all the desirable heat resistance and other mechanical and dielectric characteristics. But, most significantly, its microscopic rheological properties are adjusted such that excellent contact is achieved between the resin molecules and the lead frame surface while eliminating or at least minimizing the extent of adhesive overflow, which can substantially reduce the reliability of the final IC product.

摘要翻译： 一种用于片上（LOC）IC应用的胶带，其包含聚酰胺基粘合剂组合物，其为来自以下反应混合物的反应产物：（a）预酰亚胺化的聚酰胺酸; 和（b）已经被巴比妥酸衍生物的巴比妥酸改性成为巴比妥酸改性双马来酰亚胺的双马来酰亚胺。 预酰亚胺化聚酰胺酸是含有聚酰胺酸和环化剂的反应混合物的反应产物。 聚酰胺基粘合剂组合物提供所有期望的耐热性和其它机械和介电特性。 但是，最显着的是，其微观流变特性被调节，使得在树脂分子和引线框架表面之间获得良好的接触，同时消除或至少最小化粘合剂溢出的程度，这可以显着降低最终IC产品的可靠性。

公开(公告)号：US5372891A

公开(公告)日：1994-12-13

申请号：US991287

申请日：1992-12-16

申请人： Tsai-An Yu ,  Jing-Pin Pan ,  Han-Lung Chen ,  Jinn-Shing King ,  Tsung-Hsiung Wang

发明人： Tsai-An Yu ,  Jing-Pin Pan ,  Han-Lung Chen ,  Jinn-Shing King ,  Tsung-Hsiung Wang

IPC分类号： C08G73/10 ,  C09J179/08 ,  H05K1/03 ,  B32B15/08

CPC分类号： C08G73/101 ,  C09J179/08 ,  C09J179/085 ,  H05K1/0346 ,  Y10T428/31681 ,  Y10T428/31721

摘要： An improved polyimide-based coating composition comprising a polyimide upper layer and a polyimide-modified bismaleimide lower layer for use as a coating on metal substrate, such as an electrolytic copper foil. The polyimide are prepared from reactions between diamines, such as p-phenylene diamine and 4-4'-diaminodiphenyl ether, and dianhydrides, such as 3,3',4,4'-benzophenone tetracarboxylic dianhydride and biphenyl-3,3',4,4'-tetracarboxylic dianhydride. The modified bismaleimide can be prepared from reacting an N,N',4,4'-diphenyl bismaleimide with a barbituric acid or its derivative. A double-layered extrusion coating technique having a double-layered extrusion die is utilized to apply the coating composition onto the metal substrate. The final laminated products show improved peel strength between the polyimide coating and the substrate, as well as improved dimensional stability and surface flatness thereof.

摘要翻译： 一种改进的聚酰亚胺基涂料组合物，其包含聚酰亚胺上层和用作金属基底如电解铜箔上的涂层的聚酰亚胺改性双马来酰亚胺下层。 聚酰亚胺由二胺如对苯二胺和4-4'-二氨基二苯基醚之间的反应制备，二酐如3,3'，4,4'-二苯甲酮四羧酸二酐和联苯-3,3' 4,4'-四羧酸二酐。 改性双马来酰亚胺可以通过使N，N'，4,4'-二苯基双马来酰亚胺与巴比妥酸或其衍生物反应来制备。 使用具有双层挤出模头的双层挤出涂布技术将涂料组合物施加到金属基材上。 最终的层压产品显示出聚酰亚胺涂层和基材之间的改善的剥离强度，以及改进的尺寸稳定性和表面平整度。

公开(公告)号：US06432613B1

公开(公告)日：2002-08-13

申请号：US09866727

申请日：2001-05-30

申请人： Man-Lin Chen ,  Jing-Pin Pan ,  Hsien-Kuang Lin ,  Shur-Fen Liu

发明人： Man-Lin Chen ,  Jing-Pin Pan ,  Hsien-Kuang Lin ,  Shur-Fen Liu

IPC分类号： G03F7028

CPC分类号： G03F7/038

摘要： The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.

摘要翻译： 本发明公开了一种在制造印刷电路板中用作阻焊剂或用于绝缘层的感光材料的光敏组合物。 感光组合物包含含有羧基和不饱和乙烯基的预聚物; 光引发剂 不饱和光单体; 和双马来酰亚胺衍生物，巴比土酸衍生物和环氧化合物的反应加合物。 所得的感光性组合物对PI基材的粘合性高，另外可用碱性水显影。 本发明中得到的感光性组合物由于其高耐热性和耐焊性而在包装基材如P-BGA，T-BGA和F-CSP中非常有用。

公开(公告)号：US06359039B1

公开(公告)日：2002-03-19

申请号：US09628061

申请日：2000-07-25

申请人： Chih-Chiang Chen ,  Jing-Pin Pan ,  Shur-Fen Liu

发明人： Chih-Chiang Chen ,  Jing-Pin Pan ,  Shur-Fen Liu

IPC分类号： C08K507

CPC分类号： C09J163/00 ,  C08G59/4042 ,  C08L79/08 ,  C08L2666/08

摘要： An epoxy based adhesive composition contains: (i) a barbituric acid-modified bismaleimide; (ii) an epoxy resin selected from the group consisting of tetraglycidylmethylenedianiline, diglycidyl ortho-phthalate, diglycidyl ether of bisphenol A, polyglycidyl ether of novolac, and epoxy cresol novolac; (iii) an elastomer such as a carboxylated acrylontrile rubber containing between 19 and 41 wt % of acrylontrile; (v) a hardening agent and (vi) a catalyst.

摘要翻译： 环氧基粘合剂组合物包含：（i）巴比妥酸改性双马来酰亚胺; （ii）选自四缩水甘油亚甲基二苯胺，邻苯二甲酸二缩水甘油酯，双酚A的二缩水甘油醚，酚醛清漆的聚缩水甘油醚和环氧甲酚酚醛清漆的环氧树脂; （iii）弹性体，例如含有19至41重量％的丙烯腈的羧化丙烯腈橡胶; （v）硬化剂和（vi）催化剂。

公开(公告)号：US07750092B2

公开(公告)日：2010-07-06

申请号：US11964764

申请日：2007-12-27

申请人： Tsung-Hsiung Wang ,  Jing-Pin Pan ,  Shur-Fen Liu ,  Yueh-Wei Lin

发明人： Tsung-Hsiung Wang ,  Jing-Pin Pan ,  Shur-Fen Liu ,  Yueh-Wei Lin

IPC分类号： C08G73/10

CPC分类号： C08G73/12 ,  H01G9/028 ,  H01G9/2004 ,  Y02E10/542

摘要： A composition having a bismaleimide oligomer and preparation methods thereof are provided. The composition having a bismaleimide oligomer comprises a bismaleimide oligomer, wherein the bismaleimide oligomer is in an amount of more than 75 parts by weight, based on 100 parts by weight of the composition. Specifically, the bismaleimide oligomer is prepared by reacting bismaleimide monomers with batch-added barbituric acid.

摘要翻译： 提供了具有双马来酰亚胺低聚物的组合物及其制备方法。 具有双马来酰亚胺低聚物的组合物包含双马来酰亚胺低聚物，其中基于100重量份组合物，双马来酰亚胺低聚物的量大于75重量份。 具体地，双马来酰亚胺低聚物通过使双马来酰亚胺单体与分批加入的巴比妥酸反应制备。

公开(公告)号：US20080157021A1

公开(公告)日：2008-07-03

申请号：US11964764

申请日：2007-12-27

申请人： Tsung-Hsiung Wang ,  Jing-Pin Pan ,  Shur-Fen Liu ,  Yueh-Wei Lin

发明人： Tsung-Hsiung Wang ,  Jing-Pin Pan ,  Shur-Fen Liu ,  Yueh-Wei Lin

IPC分类号： C08G73/00 ,  H01G9/022

CPC分类号： C08G73/12 ,  H01G9/028 ,  H01G9/2004 ,  Y02E10/542

摘要： A composition having a bismaleimide oligomer and preparation methods thereof are provided. The composition having a bismaleimide oligomer comprises a bismaleimide oligomer, wherein the bismaleimide oligomer is in an amount of more than 75 parts by weight, based on 100 parts by weight of the composition. Specifically, the bismaleimide oligomer is prepared by reacting bismaleimide monomers with batch-added barbituric acid.

摘要翻译： 提供了具有双马来酰亚胺低聚物的组合物及其制备方法。 具有双马来酰亚胺低聚物的组合物包含双马来酰亚胺低聚物，其中基于100重量份组合物，双马来酰亚胺低聚物的量大于75重量份。 具体地，双马来酰亚胺低聚物通过使双马来酰亚胺单体与分批加入的巴比妥酸反应制备。

公开(公告)号：US09136559B2

公开(公告)日：2015-09-15

申请号：US13339384

申请日：2011-12-29

申请人： Li-Duan Tsai ,  Yueh-Wei Lin ,  Chia-Chen Fang ,  Cheng-Liang Cheng ,  Jing-Pin Pan ,  Tsung-Hsiung Wang

发明人： Li-Duan Tsai ,  Yueh-Wei Lin ,  Chia-Chen Fang ,  Cheng-Liang Cheng ,  Jing-Pin Pan ,  Tsung-Hsiung Wang

IPC分类号： H01M10/0567 ,  H01M10/0525 ,  H01M4/58 ,  H01M10/42 ,  H01M4/40 ,  H01M4/587 ,  H01M4/62 ,  H01M10/0568 ,  H01M10/0569

CPC分类号： H01M10/0525 ,  H01M4/405 ,  H01M4/581 ,  H01M4/5815 ,  H01M4/587 ,  H01M4/621 ,  H01M4/625 ,  H01M4/626 ,  H01M10/0567 ,  H01M10/0568 ,  H01M10/0569 ,  H01M10/4235 ,  H01M2300/0025 ,  Y02E60/122

摘要： A non-aqueous electrolyte including a lithium salt, an organic solvent, and an electrolyte additive is provided. The electrolyte additive is a meta-stable state nitrogen-containing polymer formed by reacting Compound (A) and Compound (B). Compound (A) is a monomer having a reactive terminal functional group. Compound (B) is a heterocyclic amino aromatic derivative as an initiator. A molar ratio of Compound (A) to Compound (B) is from 10:1 to 1:10. A lithium secondary battery containing the non-aqueous electrolyte is further provided. The non-aqueous electrolyte of this disclosure has a higher decomposition voltage than a conventional non-aqueous electrolyte, such that the safety of the battery during overcharge or at high temperature caused by short-circuit current is improved.

摘要翻译： 提供了包含锂盐，有机溶剂和电解质添加剂的非水电解质。 电解质添加剂是通过使化合物（A）和化合物（B）反应而形成的间位稳定状态的含氮聚合物。 化合物（A）是具有反应性末端官能团的单体。 化合物（B）是作为引发剂的杂环氨基芳族衍生物。 化合物（A）与化合物（B）的摩尔比为10:1至1:10。 还提供含有非水电解质的锂二次电池。 本公开的非水电解质具有比常规的非水电解质更高的分解电压，从而提高了由于短路电流引起的过充电或高温下电池的安全性。