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    Fabricating method of semiconductor package and heat-dissipating structure applicable thereto
    2.
    发明申请
    Fabricating method of semiconductor package and heat-dissipating structure applicable thereto 审中-公开
    适用于其的半导体封装和散热结构的制造方法

    公开(公告)号：US20080251910A1

    公开(公告)日：2008-10-16

    申请号：US12082718

    申请日：2008-04-11

    申请人： Chih-Wei Chang ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chun-Ming Liao ,  Cheng-Hsu Hsiao

    发明人： Chih-Wei Chang ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chun-Ming Liao ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/36 ,  H01L21/56

    CPC分类号： H01L21/56 ,  H01L23/4334 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01079

    摘要： A method for fabricating semiconductor packages is disclosed, including mounting and electrically connecting a semiconductor chip onto a chip carrier; mounting a heat-dissipating structure on the semiconductor chip; placing the heat-dissipating structure into a mold cavity for filling therein a packaging material to form an encapsulant, wherein the heat-dissipating structure has a heat spreader having a size larger than that of the predetermined size of the semiconductor package, a covering layer formed on the, and a plurality of protrusions formed on edges of the covering layer that are free from being corresponding in position to the semiconductor chip, such that the protrusions can abut against a top surface of the mold cavity to prevent the heat spreader from being warped; and finally performing a singulation process according to the predetermined size and removing the encapsulant formed on the covering layer to form the desired semiconductor package. Also, this invention discloses a heat-dissipating structure applicable to the method described above.

    摘要翻译： 公开了一种用于制造半导体封装的方法，包括将半导体芯片安装并电连接到芯片载体上; 在半导体芯片上安装散热结构; 将散热结构放置在模腔中，用于在其中填充包装材料以形成密封剂，其中散热结构具有尺寸大于半导体封装的预定尺寸的散热器，形成覆盖层 以及在覆盖层的边缘上形成的多个突起，其不与半导体芯片的位置相对应，使得突起可抵靠模腔的顶表面以防止散热器翘曲 ; 最后按照规定的尺寸进行分割处理，除去覆盖层上形成的密封剂，形成所需的半导体封装。 此外，本发明公开了一种适用于上述方法的散热结构。

    Heat dissipation semiconductor package
    3.
    发明授权
    Heat dissipation semiconductor package 有权
    散热半导体封装

    公开(公告)号：US07608915B2

    公开(公告)日：2009-10-27

    申请号：US12151902

    申请日：2008-05-08

    申请人： Chun-Ming Liao ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    发明人： Chun-Ming Liao ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/495 ,  H01J23/10

    CPC分类号： H01L23/4334 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

    摘要： A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is flip-chip mounted on the chip carrier and defined with a heat conductive adhesive mounting area. Periphery of the heat adhesive mounting area is spaced apart from edge of the semiconductor chip. The heat dissipation member is mounted on the heat conductive adhesive formed in the heat conductive adhesive mounting area. The encapsulant formed between the chip carrier and the heat dissipation member encapsulates the semiconductor chip and the heat conductive adhesive, and embeds edges of the active surface and non-active surface and side edge of the semiconductor chip, thereby increasing bonding area between the encapsulant and the semiconductor chip. The side edges of the heat conductive adhesive and the semiconductor chip are not flush with each other, thereby preventing propagation of delamination.

    摘要翻译： 散热半导体封装包括芯片载体，半导体芯片，导热粘合剂，散热构件和密封剂。 半导体芯片倒装芯片安装在芯片载体上，并用导热粘合剂安装区域限定。 热粘合剂安装区域的周边与半导体芯片的边缘间隔开。 散热构件安装在形成在导热粘合剂安装区域中的导热粘合剂上。 形成在芯片载体和散热构件之间的密封剂封装半导体芯片和导热粘合剂，并且嵌入半导体芯片的有源表面和非有源表面和侧边缘的边缘，从而增加密封剂和 半导体芯片。 导热粘合剂和半导体芯片的侧边缘彼此不齐平，从而防止分层的蔓延。

    Heat dissipation semiconductor package
    4.
    发明申请
    Heat dissipation semiconductor package 有权
    散热半导体封装

    公开(公告)号：US20080277777A1

    公开(公告)日：2008-11-13

    申请号：US12151902

    申请日：2008-05-08

    申请人： Chun-Ming Liao ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    发明人： Chun-Ming Liao ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/36

    CPC分类号： H01L23/4334 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

    摘要： A heat dissipation semiconductor package includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is flip-chip mounted on the chip carrier and defined with a heat conductive adhesive mounting area. Periphery of the heat adhesive mounting area is spaced apart from edge of the semiconductor chip. The heat dissipation member is mounted on the heat conductive adhesive formed in the heat conductive adhesive mounting area. The encapsulant formed between the chip carrier and the heat dissipation member encapsulates the semiconductor chip and the heat conductive adhesive, and embeds edges of the active surface and non-active surface and side edge of the semiconductor chip, thereby increasing bonding area between the encapsulant and the semiconductor chip. The side edges of the heat conductive adhesive and the semiconductor chip are not flush with each other, thereby preventing propagation of delamination.

    摘要翻译： 散热半导体封装包括芯片载体，半导体芯片，导热粘合剂，散热构件和密封剂。 半导体芯片倒装芯片安装在芯片载体上，并用导热粘合剂安装区域限定。 热粘合剂安装区域的周边与半导体芯片的边缘间隔开。 散热构件安装在形成在导热粘合剂安装区域中的导热粘合剂上。 形成在芯片载体和散热构件之间的密封剂封装半导体芯片和导热粘合剂，并且嵌入半导体芯片的有源表面和非有源表面和侧边缘的边缘，从而增加密封剂和 半导体芯片。 导热粘合剂和半导体芯片的侧边缘彼此不齐平，从而防止分层的蔓延。