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1.发明申请公开(公告)号：US20080157346A1
公开(公告)日：2008-07-03
申请号：US11796320
申请日：2007-04-26
申请人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Chun-Ming Liao , Cheng-Hsu Hsiao
发明人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Chun-Ming Liao , Cheng-Hsu Hsiao
CPC分类号： H01L21/565 , H01L23/4334 , H01L24/16 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating a heat-dissipating package and a heat-dissipating structure applicable thereto are disclosed. The method includes: mounting and electrically connecting to a chip carrier a semiconductor chip mounted with a heat-dissipating structure; disposing on the heat-dissipating structure a covering layer protrudingly formed with an abutting portion surrounding the covering layer, wherein the size of the heat-dissipating structure is greater than the predetermined one of the package to position the chip carrier in a cavity of a mold and encapsulate the heat-dissipating structure and semiconductor chip by encapsulant, and the protruding portion abuts against a top surface of the cavity and prevent the heat-dissipating structure from warping; and singulating the package and removing the encapsulant from the covering layer thereunder according to the predetermined size of the package.
摘要翻译： 公开了一种制造散热封装的方法和可应用的散热结构。 该方法包括：将安装有散热结构的半导体芯片安装并电连接到芯片载体; 在所述散热结构上设置突出地形成有围绕所述覆盖层的邻接部分的覆盖层，其中所述散热结构的尺寸大于所述封装中的预定的尺寸，以将所述芯片载体定位在模具的空腔中 并且通过密封剂封装散热结构和半导体芯片，并且突出部分抵靠空腔的顶表面并防止散热结构翘曲; 并且根据包装的预定尺寸对包装进行分离并从其下面的覆盖层去除密封剂。
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2.发明申请公开(公告)号：US20080213942A1
公开(公告)日：2008-09-04
申请号：US12074321
申请日：2008-03-03
CPC分类号： H01L23/3128 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L24/16 , H01L2224/13099 , H01L2224/16 , H01L2224/73203 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00 , H01L2224/0401
摘要： This invention provides a method for fabricating a semiconductor device and a carrier applied therein. The method includes the steps of: disposing a chip-mounted substrate in an opening of a carrier; forming at least a storage aperture and at least an inspection aperture in the carrier; infusing an adhesive into the storage aperture to fill a gap between the substrate and carrier with the adhesive by capillarity; determining whether the inspection aperture is filled with the adhesive to ascertain whether the gap is completely filled with the adhesive; in response to a positive result, performing a molding process to form a molding compound for encapsulating the chip; and performing implantation of solder ball and a singulation process to form a semiconductor device with desirable dimensions. The inspection aperture is inspected with a naked eye to determine whether the gap is completely filled with the adhesive, thereby reducing inspection costs and increasing yields of products with no additional packaging costs.
摘要翻译： 本发明提供一种用于制造应用于其中的半导体器件和载体的方法。 该方法包括以下步骤：将芯片安装的基板设置在载体的开口中; 在所述载体中至少形成存储孔径和至少一个检查孔; 将粘合剂注入到存储孔中，以通过毛细管力用粘合剂填充基底和载体之间的间隙; 确定检查孔是否填充有粘合剂以确定间隙是否完全被粘合剂填充; 响应于积极的结果，进行成型处理以形成用于封装芯片的模塑料; 并且执行焊球的注入和单一化处理以形成具有所需尺寸的半导体器件。 检查孔径用肉眼检查以确定间隙是否完全充满粘合剂，从而降低检查成本并提高产品的产量，而不需要额外的包装成本。
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公开(公告)号：US20110287587A1
公开(公告)日：2011-11-24
申请号：US13195617
申请日：2011-08-01
申请人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
发明人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
IPC分类号： H01L21/52
CPC分类号： H01L23/4334 , H01L21/565 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L24/48 , H01L2224/16225 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2224/0401 , H01L2224/45099
摘要： A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.
摘要翻译： 公开了一种散热封装结构及其制造方法，其包括通过其有源表面安装和电连接半导体芯片到芯片载体; 将具有散热部和支撑部的散热部件安装在所述芯片载体上，使得所述半导体芯片能够容纳在由所述散热部和所述支撑部形成的空间中，其中，所述散热部具有对应的开口 到半导体芯片; 形成密封剂以封装半导体芯片和散热构件; 并且使所述密封剂变薄以除去形成在所述半导体芯片上的所述密封剂，以从所述密封剂暴露所述半导体芯片的无效表面和所述散热部分的顶表面。 因此，通过以低成本的简化的制造步骤制造散热封装结构，并且克服了在现有技术的封装成型工艺中芯片容易损坏的问题。
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公开(公告)号：US08361843B2
公开(公告)日：2013-01-29
申请号：US13195617
申请日：2011-08-01
申请人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
发明人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
IPC分类号： H01L23/34
CPC分类号： H01L23/4334 , H01L21/565 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L24/48 , H01L2224/16225 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2224/0401 , H01L2224/45099
摘要： A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.
摘要翻译： 公开了一种散热封装结构及其制造方法，其包括通过其有源表面安装和电连接半导体芯片到芯片载体; 将具有散热部和支撑部的散热部件安装在所述芯片载体上，使得所述半导体芯片能够容纳在由所述散热部和所述支撑部形成的空间中，其中，所述散热部具有相应形成的开口 到半导体芯片; 形成密封剂以封装半导体芯片和散热构件; 并且使所述密封剂变薄以除去形成在所述半导体芯片上的所述密封剂，以从所述密封剂暴露所述半导体芯片的无效表面和所述散热部分的顶表面。 因此，通过以低成本的简化的制造步骤制造散热封装结构，并且克服了在现有技术的封装成型工艺中芯片容易损坏的问题。
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公开(公告)号：US20080308926A1
公开(公告)日：2008-12-18
申请号：US12157831
申请日：2008-06-13
申请人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
发明人： Min-Shun Hung , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
CPC分类号： H01L23/4334 , H01L21/565 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L24/48 , H01L2224/16225 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2224/0401 , H01L2224/45099
摘要： A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.
摘要翻译： 公开了一种散热封装结构及其制造方法，其包括通过其有源表面安装和电连接半导体芯片到芯片载体; 将具有散热部和支撑部的散热部件安装在所述芯片载体上，使得所述半导体芯片能够容纳在由所述散热部和所述支撑部形成的空间中，其中，所述散热部具有相应形成的开口 到半导体芯片; 形成密封剂以封装半导体芯片和散热构件; 并且使所述密封剂变薄以除去形成在所述半导体芯片上的所述密封剂，以从所述密封剂暴露所述半导体芯片的无效表面和所述散热部分的顶表面。 因此，通过以低成本的简化的制造步骤制造散热封装结构，并且克服了在现有技术的封装成型工艺中芯片容易损坏的问题。
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公开(公告)号：US08013436B2
公开(公告)日：2011-09-06
申请号：US12157831
申请日：2008-06-13
申请人： Min-Shun Hung , Yo-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
发明人： Min-Shun Hung , Yo-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
IPC分类号： H01L23/34
CPC分类号： H01L23/4334 , H01L21/565 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L24/48 , H01L2224/16225 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2224/0401 , H01L2224/45099
摘要： A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.
摘要翻译： 公开了一种散热封装结构及其制造方法，其包括通过其有源表面安装和电连接半导体芯片到芯片载体; 将具有散热部和支撑部的散热部件安装在所述芯片载体上，使得所述半导体芯片能够容纳在由所述散热部和所述支撑部形成的空间中，其中，所述散热部具有相应形成的开口 到半导体芯片; 形成密封剂以封装半导体芯片和散热构件; 并且使所述密封剂变薄以除去形成在所述半导体芯片上的所述密封剂，以从所述密封剂暴露所述半导体芯片的无效表面和所述散热部分的顶表面。 因此，通过以低成本的简化的制造步骤制造散热封装结构，并且克服了在现有技术的封装成型工艺中芯片容易损坏的问题。
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