公开(公告)号：US20120060605A1

公开(公告)日：2012-03-15

申请号：US12951738

申请日：2010-11-22

申请人： Ming-Ching WU ,  Chih-Kung Huang ,  Jeff Biar ,  Kazuhiro Okada

发明人： Ming-Ching WU ,  Chih-Kung Huang ,  Jeff Biar ,  Kazuhiro Okada

IPC分类号： G01P15/00

CPC分类号： G01P15/125 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  G01L9/0045 ,  G01L9/0054 ,  G01L9/0073 ,  G01L19/0092 ,  G01P15/123 ,  G01P2015/084

摘要： A MEMS sensor capable of sensing acceleration and pressure includes a frame, a proof mass and flexible bridges connected between the frame and the proof mass in such a way that the proof mass is moveably suspended inside the frame. The proof mass is provided with a pressure sensing diaphragm and a sealed chamber corresponding to the diaphragm such that the proof mass is not only served as a moveable sensing element for acceleration measurement but also a pressure sensing element.

摘要翻译： 能够感测加速和压力的MEMS传感器包括框架，检测质量块和连接在框架和检验质量块之间的柔性桥梁，使得证明块可移动地悬挂在框架内。 检测质量体设有压力检测膜片和对应于隔膜的密封腔室，使得检测质量块不仅用作用于加速测量的可移动感测元件，而且还用作压力感测元件。

公开(公告)号：US20120056280A1

公开(公告)日：2012-03-08

申请号：US12910394

申请日：2010-10-22

申请人： Ming-Ching WU ,  Chih-Kung Huang

发明人： Ming-Ching WU ,  Chih-Kung Huang

IPC分类号： H01L29/84

CPC分类号： B81B7/0048 ,  B81B2201/0235 ,  B81C2203/032 ,  G01P15/123 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0842 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/00014

摘要： A MEMS sensor package includes a support and a MEMS sensor chip having a mounting side adhered on the support by a point-shaped adhesive or a linear-shaped adhesive in such a way that the MEMS sensor chip has a free side opposite to the mounting and suspended above the support. Because the MEMS sensor chip has the free side that is not restrained on the support, the stress due to deformation of the support will not affect the accuracy of the MEMS sensor chip.

摘要翻译： MEMS传感器封装包括支撑件和MEMS传感器芯片，其具有通过点状粘合剂或线状粘合剂粘附在支撑体上的安装侧，使得MEMS传感器芯片具有与安装相对的自由侧， 悬挂在支撑上方。 由于MEMS传感器芯片具有不受限于支撑件的自由侧，因此支撑件变形引起的应力不会影响MEMS传感器芯片的精度。

公开(公告)号：US20110269296A1

公开(公告)日：2011-11-03

申请号：US12838939

申请日：2010-07-19

申请人： Ming-Ching WU

发明人： Ming-Ching WU

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  H01L21/67092

摘要： A method for separating a semiconductor wafer into chips includes the steps of sandwiching a soluble spacer between a wafer and a substrate to form a laminate, etching the wafer into a plurality of chips attached on the spacer, positioning the laminate in a chamber of an apparatus in a way that the etched wafer faces a stage of the apparatus, and introducing a solvent into the chamber to dissolve the soluble spacer so as to facilitate the chips to be supported on the stage.

摘要翻译： 将半导体晶片分离成芯片的方法包括以下步骤：将可溶性间隔物夹在晶片和基板之间以形成层压体，将晶片蚀刻成附接在间隔物上的多个芯片，将层压体定位在设备的室中 以使得蚀刻的晶片面向设备的阶段，并且将溶剂引入室中以溶解可溶性间隔物，以便于将芯片支撑在载物台上。

公开(公告)号：US20100242602A1

公开(公告)日：2010-09-30

申请号：US12581358

申请日：2009-10-19

申请人： Ming-Ching WU

发明人： Ming-Ching WU

IPC分类号： G01P15/125 ,  H01L21/28

CPC分类号： G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/084

摘要： A process for fabricating a capacitance type tri-axial accelerometer comprises of preparing a wafer having an upper layer, an intermediate layer and a lower layer, etching the lower layer of the wafer to form an isolated proof mass having a core and four segments extending from the core, etching the upper layer of the wafer to form a suspension and four separating plates, etching away a portion of the intermediate layer located between the four segments of the proof mass and the plates of the upper layer, and disposing an electrical conducting means to pass through the intermediate layer from the suspension to the core of the proof mass.

摘要翻译： 用于制造电容式三轴加速度计的方法包括：制备具有上层，中间层和下层的晶片，蚀刻晶片的下层，以形成具有芯的隔离的隔离块，以及从 芯，蚀刻晶片的上层以形成悬浮液和四个分离板，蚀刻掉位于证明块的四个区段和上层的板之间的中间层的一部分，并且设置导电装置 将中间层从悬浮液中通过到检体的核心。