HIGH VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR DEVICE
    1.
    发明申请
    HIGH VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR DEVICE 审中-公开
    高电压金属氧化物半导体晶体管器件

    公开(公告)号:US20130320445A1

    公开(公告)日:2013-12-05

    申请号:US13487268

    申请日:2012-06-04

    IPC分类号: H01L29/78

    摘要: A high voltage metal-oxide-semiconductor (HV MOS) device includes a substrate, a gate positioned on the substrate, a drain region formed in the substrate, a source region formed in the substrate, a first doped region formed in between the drain region and the source region, and a second doped region formed over a top of the first doped region or/and under a bottom of the first doped region. The drain region, the source region, and the second doped region include a first conductivity type, the first doped region includes a second conductivity type, and the first conductivity type and the second conductivity type are complementary.

    摘要翻译: 高压金属氧化物半导体(HV MOS)器件包括衬底,位于衬底上的栅极,形成在衬底中的漏极区,形成在衬底中的源极区,形成在漏极区之间的第一掺杂区 和源极区,以及形成在第一掺杂区的顶部或/或第一掺杂区的底部下方的第二掺杂区。 漏极区域,源极区域和第二掺杂区域包括第一导电类型,第一掺杂区域包括第二导电类型,并且第一导电类型和第二导电类型是互补的。

    HIGH-VOLTAGE SEMICONDUCTOR DEVICE
    2.
    发明申请
    HIGH-VOLTAGE SEMICONDUCTOR DEVICE 有权
    高压半导体器件

    公开(公告)号:US20120326266A1

    公开(公告)日:2012-12-27

    申请号:US13169008

    申请日:2011-06-26

    IPC分类号: H01L27/04

    摘要: A high-voltage semiconductor device is disclosed. The HV semiconductor device includes: a substrate; a well of first conductive type disposed in the substrate; a first doping region of second conductive type disposed in the p-well; a first isolation structure disposed in the well of first conductive type and surrounding the first doping region of second conductive type; and a first drift ring of second conductive type disposed between the first doping region of second conductive type and the first isolation structure.

    摘要翻译: 公开了一种高压半导体器件。 HV半导体装置包括:基板; 设置在基板中的第一导电类型的阱; 布置在p阱中的第二导电类型的第一掺杂区; 第一隔离结构,设置在第一导电类型的阱中,并且包围第二导电类型的第一掺杂区; 以及设置在第二导电类型的第一掺杂区域和第一隔离结构之间的第二导电类型的第一漂移环。

    High-voltage semiconductor device
    3.
    发明授权
    High-voltage semiconductor device 有权
    高压半导体器件

    公开(公告)号:US08592905B2

    公开(公告)日:2013-11-26

    申请号:US13169008

    申请日:2011-06-26

    IPC分类号: H01L29/66

    摘要: A high-voltage semiconductor device is disclosed. The HV semiconductor device includes: a substrate; a well of first conductive type disposed in the substrate; a first doping region of second conductive type disposed in the p-well; a first isolation structure disposed in the well of first conductive type and surrounding the first doping region of second conductive type; and a first drift ring of second conductive type disposed between the first doping region of second conductive type and the first isolation structure.

    摘要翻译: 公开了一种高压半导体器件。 HV半导体装置包括:基板; 设置在基板中的第一导电类型的阱; 布置在p阱中的第二导电类型的第一掺杂区; 第一隔离结构,设置在第一导电类型的阱中,并且包围第二导电类型的第一掺杂区; 以及设置在第二导电类型的第一掺杂区域和第一隔离结构之间的第二导电类型的第一漂移环。

    Method for increasing breaking down voltage of lateral diffused metal oxide semiconductor transistor
    4.
    发明授权
    Method for increasing breaking down voltage of lateral diffused metal oxide semiconductor transistor 有权
    增加横向扩散金属氧化物半导体晶体管分解电压的方法

    公开(公告)号:US07821082B1

    公开(公告)日:2010-10-26

    申请号:US12431571

    申请日:2009-04-28

    IPC分类号: H01L29/66

    摘要: A lateral diffused metal oxide semiconductor transistor is disclosed. A p-type bulk is disposed on a substrate. An n-type well region is disposed in the p-type bulk. A plurality of field oxide layers are disposed on the p-type bulk and the n-type well region. A gate structure is disposed on a portion of the p-type bulk and one of the plurality of field oxide layers. At least one deep trench isolation structure is disposed in the p-type bulk and adjacent to the n-type well region.

    摘要翻译: 公开了横向扩散的金属氧化物半导体晶体管。 p型块体设置在基板上。 n型阱区设置在p型体中。 在p型体和n型阱区上设置多个场氧化物层。 栅极结构设置在p型体的一部分和多个场氧化物层中的一个上。 至少一个深沟槽隔离结构设置在p型体中并与n型阱区相邻。