Liquid-ejection head and method for manufacturing liquid-ejection head substrate
    2.
    发明授权
    Liquid-ejection head and method for manufacturing liquid-ejection head substrate 有权
    液体喷射头和液体喷射头基板的制造方法

    公开(公告)号:US08366950B2

    公开(公告)日:2013-02-05

    申请号:US12204802

    申请日:2008-09-05

    IPC分类号: G01D15/00

    摘要: A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.

    摘要翻译: 提供一种制造包括具有用于供应液体的供给口的硅基板的液体喷射头基板的方法。 该方法包括:在硅衬底的表面上形成蚀刻掩模层,该蚀刻掩模层在与供给口对应的部分中具有开口; 通过在蚀刻掩模层中的开口各向异性蚀刻硅衬底,在硅衬底的表面中形成第一凹槽; 形成在所述硅衬底的所述第一凹部的表面中朝向所述硅衬底的另一表面延伸的第二凹部; 以及通过从设置有所述第二凹部的表面各向异性地蚀刻所述硅衬底而形成所述供给口。

    LIQUID-EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID-EJECTION HEAD SUBSTRATE
    3.
    发明申请
    LIQUID-EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID-EJECTION HEAD SUBSTRATE 有权
    液体喷射头及其制造方法

    公开(公告)号:US20090065474A1

    公开(公告)日:2009-03-12

    申请号:US12204802

    申请日:2008-09-05

    IPC分类号: B41J2/16

    摘要: A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.

    摘要翻译: 提供一种制造包括具有用于供应液体的供给口的硅基板的液体喷射头基板的方法。 该方法包括:在硅衬底的表面上形成蚀刻掩模层,该蚀刻掩模层在与供给口对应的部分中具有开口; 通过在蚀刻掩模层中的开口各向异性蚀刻硅衬底,在硅衬底的表面中形成第一凹槽; 形成在所述硅衬底的所述第一凹部的表面中朝向所述硅衬底的另一表面延伸的第二凹部; 以及通过从设置有所述第二凹部的表面各向异性地蚀刻所述硅衬底而形成所述供给口。

    Process of producing liquid discharge head
    5.
    发明授权
    Process of producing liquid discharge head 有权
    生产液体排放头的工艺

    公开(公告)号:US08163187B2

    公开(公告)日:2012-04-24

    申请号:US12478602

    申请日:2009-06-04

    IPC分类号: B41J2/05

    摘要: Provided is a process of producing a liquid discharge head having a substrate, a passage-forming member, and a patterned layer. The process includes providing a resin layer on a substrate; providing a resist pattern on the resin layer for patterning the resin layer; forming a patterned layer by patterning the resin layer using the resist pattern as a mask; providing a layer for forming a passage pattern having a shape of passage on the resist pattern lying on the patterned layer; forming a passage pattern by patterning the layer for forming a passage pattern; removing the resist pattern; providing a passage-forming member so as to cover the passage pattern and the patterned layer; and removing the passage pattern to give the passage.

    摘要翻译: 提供了一种制造具有基板,通道形成部件和图案化层的排液头的方法。 该方法包括在基底上提供树脂层; 在树脂层上提供抗蚀剂图案,用于图案化树脂层; 通过使用抗蚀剂图案作为掩模对树脂层进行图案化来形成图案层; 提供用于在位于图案化层上的抗蚀剂图案上形成具有通道形状的通道图案的层; 通过图案化形成通道图案的层来形成通道图案; 去除抗蚀剂图案; 提供通道形成构件以覆盖通道图案和图案层; 并且去除通道图案以给出通道。

    PROCESS OF PRODUCING LIQUID DISCHARGE HEAD
    6.
    发明申请
    PROCESS OF PRODUCING LIQUID DISCHARGE HEAD 有权
    生产液体排放头的过程

    公开(公告)号:US20090302502A1

    公开(公告)日:2009-12-10

    申请号:US12478602

    申请日:2009-06-04

    IPC分类号: B29C67/00

    摘要: Provided is a process of producing a liquid discharge head having a substrate, a passage-forming member, and a patterned layer. The process includes providing a resin layer on a substrate; providing a resist pattern on the resin layer for patterning the resin layer; forming a patterned layer by patterning the resin layer using the resist pattern as a mask; providing a layer for forming a passage pattern having a shape of passage on the resist pattern lying on the patterned layer; forming a passage pattern by patterning the layer for forming a passage pattern; removing the resist pattern; providing a passage-forming member so as to cover the passage pattern and the patterned layer; and removing the passage pattern to give the passage.

    摘要翻译: 提供了一种制造具有基板,通道形成部件和图案化层的排液头的方法。 该方法包括在基底上提供树脂层; 在树脂层上提供抗蚀剂图案,用于图案化树脂层; 通过使用抗蚀剂图案作为掩模对树脂层进行图案化来形成图案层; 提供用于在位于图案化层上的抗蚀剂图案上形成具有通道形状的通道图案的层; 通过图案化形成通道图案的层来形成通道图案; 去除抗蚀剂图案; 提供通道形成构件以覆盖通道图案和图案层; 并且去除通道图案以给出通道。

    METHOD FOR PROCESSING SILICON SUBSTRATE AND METHOD FOR PRODUCING SUBSTRATE FOR LIQUID EJECTING HEAD
    7.
    发明申请
    METHOD FOR PROCESSING SILICON SUBSTRATE AND METHOD FOR PRODUCING SUBSTRATE FOR LIQUID EJECTING HEAD 审中-公开
    加工硅基板的方法和用于生产用于液体喷射头的基板的方法

    公开(公告)号:US20110020966A1

    公开(公告)日:2011-01-27

    申请号:US12839301

    申请日:2010-07-19

    IPC分类号: H01L21/306

    摘要: A method for processing a silicon substrate includes preparing a first silicon substrate including an etching mask layer including first and second opening portions; forming a first recess in a portion of the silicon substrate corresponding to a region in the first opening portion; etching the silicon substrate by crystal anisotropic etching through the etching mask layer with an etching apparatus and an etchant, the etching proceeding in the first and second opening portions to form a through hole in a position corresponding to the first opening portion and to form a second recess in a position corresponding to the second opening portion; calculating an etching rate of the silicon substrate in terms of the etchant by using the second recess; and determining, by using the calculated etching rate, an etching condition for etching another silicon substrate with the etching apparatus after the etching of the first silicon substrate.

    摘要翻译: 一种处理硅衬底的方法包括:制备包含第一和第二开口部分的蚀刻掩模层的第一硅衬底; 在所述硅衬底的与所述第一开口部分中的区域相对应的部分中形成第一凹部; 通过蚀刻装置和蚀刻剂通过蚀刻掩模层通过晶体各向异性蚀刻来蚀刻硅衬底,蚀刻在第一和第二开口部分中进行,以在对应于第一开口部分的位置形成通孔,并形成第二 在与第二开口部相对应的位置处凹陷; 通过使用第二凹槽计算蚀刻剂方面的硅衬底的蚀刻速率; 以及通过使用所计算的蚀刻速率,在蚀刻所述第一硅衬底之后,使用所述蚀刻装置来确定用于蚀刻另一硅衬底的蚀刻条件。

    LIQUID EJECTION HEAD AND PROCESS FOR PRODUCING THE SAME
    8.
    发明申请
    LIQUID EJECTION HEAD AND PROCESS FOR PRODUCING THE SAME 有权
    液体喷射头及其制造方法

    公开(公告)号:US20120218350A1

    公开(公告)日:2012-08-30

    申请号:US13359249

    申请日:2012-01-26

    IPC分类号: B41J2/145 H01L21/02 B41J2/14

    摘要: Provided is a process for producing a liquid ejection head including an ejection orifice member having a plurality of ejection orifices for ejecting liquid provided along an arrangement direction, the process including preparing a substrate provided with a resin layer which contains a photocurable resin;carrying out a first exposure treatment and a second exposure treatment which are each of an exposure treatment of subjecting the resin layer to exposure; and forming the ejection orifices of the resin layer subjected to the first exposure treatment and the second exposure treatment. An inclination angle of a side wall of the ejection orifices formed by the first exposure treatment with respect to the substrate differs from an inclination angle of a side wall of the ejection orifices formed by the second exposure treatment with respect to the substrate.

    摘要翻译: 本发明提供了一种液体喷射头的制造方法,该喷液头包括具有多个用于喷射沿着排列方向设置的液体的喷射口的喷射口部件,该喷射头部件准备具有含有可光固化树脂的树脂层的基板; 第一曝光处理和第二曝光处理,每个曝光处理使树脂层曝光; 以及形成经受第一曝光处理和第二曝光处理的树脂层的喷射孔。 通过第一曝光处理相对于基板形成的喷射孔的侧壁的倾斜角度与由第二曝光处理相对于基板形成的喷射孔的侧壁的倾斜角不同。

    LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME 有权
    液体喷射头及其制造方法

    公开(公告)号:US20120013682A1

    公开(公告)日:2012-01-19

    申请号:US13170695

    申请日:2011-06-28

    IPC分类号: B41J2/14 H01L41/22

    摘要: Provided is a liquid ejection head, including: a flow path forming member including: an ejection orifice for ejecting liquid therefrom; and a liquid flow path communicated with the ejection orifice; a silicon substrate including a supply port for supplying the liquid to the liquid flow path; and a protective film which is formed on a wall surface of the supply port and which is formed of an organic resin which is the same as a material of a member forming the flow path forming member.

    摘要翻译: 提供一种液体喷射头,包括:流路形成构件,包括:用于从其喷射液体的喷射孔; 以及与所述喷射孔连通的液体流路; 硅基板,包括用于将液体供给到液体流路的供给口; 以及保护膜,其形成在供给口的壁面上,并且由与构成流路形成部件的部件的材料相同的有机树脂形成。

    Liquid ejection head and process for producing the same
    10.
    发明授权
    Liquid ejection head and process for producing the same 有权
    液体喷射头及其制造方法

    公开(公告)号:US08652767B2

    公开(公告)日:2014-02-18

    申请号:US13359249

    申请日:2012-01-26

    IPC分类号: G03F1/00

    摘要: Provided is a process for producing a liquid ejection head including an ejection orifice member having a plurality of ejection orifices for ejecting liquid provided along an arrangement direction, the process including preparing a substrate provided with a resin layer which contains a photocurable resin; carrying out a first exposure treatment and a second exposure treatment which are each of an exposure treatment of subjecting the resin layer to exposure; and forming the ejection orifices of the resin layer subjected to the first exposure treatment and the second exposure treatment. An inclination angle of a side wall of the ejection orifices formed by the first exposure treatment with respect to the substrate differs from an inclination angle of a side wall of the ejection orifices formed by the second exposure treatment with respect to the substrate.

    摘要翻译: 本发明提供一种液体喷射头的制造方法,该喷液头包括具有多个用于喷射沿着排列方向设置的液体的喷射孔的喷射口部件,该喷射口部件准备具有含有光固化树脂的树脂层的基板; 进行第一曝光处理和第二曝光处理,其中每个曝光处理使树脂层曝光; 以及形成经受第一曝光处理和第二曝光处理的树脂层的喷射孔。 通过第一曝光处理相对于基板形成的喷射孔的侧壁的倾斜角度与由第二曝光处理相对于基板形成的喷射孔的侧壁的倾斜角不同。