公开(公告)号：US20120146088A1

公开(公告)日：2012-06-14

申请号：US13390768

申请日：2011-06-22

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

IPC分类号： H01L33/56 ,  C08L83/07

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  C09K3/1018 ,  C08L83/00

摘要： The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity.The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

摘要翻译： 本发明提供了一种用于光学半导体器件的密封剂，其不太可能降低其亮度，并且即使在高温和高湿度的恶劣环境中的通电状态下使用也不太可能改变其颜色。 用于光学半导体器件的密封剂包括：不包含与硅原子结合的氢原子但含有与硅原子键合的烯基和与硅原子结合的芳基的第一有机聚硅氧烷，含有氢原子的第二有机聚硅氧烷 结合到硅原子和与硅原子结合的芳基，以及铂 - 烯基复合物。 铂 - 烯基络合物是通过使氯铂酸六水合物与不少于6当量的双官能或更多官能的烯基化合物反应而获得的反应产物。 与有机聚硅氧烷中的硅原子结合的烯基的数量与密封剂中的有机聚硅氧烷中与硅原子结合的氢原子数的比例为1.0以上2.5以下。

公开(公告)号：US08519429B2

公开(公告)日：2013-08-27

申请号：US13390768

申请日：2011-06-22

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  C09K3/1018 ,  C08L83/00

摘要： The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity.The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

摘要翻译： 本发明提供了一种用于光学半导体器件的密封剂，其不太可能降低其亮度，并且即使在高温和高湿度的恶劣环境中的通电状态下使用也不太可能改变其颜色。 用于光学半导体器件的密封剂包括：不包含与硅原子结合的氢原子但含有与硅原子键合的烯基和与硅原子结合的芳基的第一有机聚硅氧烷，含有氢原子的第二有机聚硅氧烷 结合到硅原子和与硅原子结合的芳基，以及铂 - 烯基复合物。 铂 - 烯基络合物是通过使氯铂酸六水合物与不少于6当量的双官能或更多官能的烯基化合物反应而获得的反应产物。 与有机聚硅氧烷中的硅原子结合的烯基的数量与密封剂中的有机聚硅氧烷中与硅原子结合的氢原子数的比例为1.0以上2.5以下。

公开(公告)号：US20120126282A1

公开(公告)日：2012-05-24

申请号：US13387725

申请日：2011-03-18

申请人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki ,  Yasuyuki Ieda ,  Chizuru Kimu ,  Yusuke Kobayashi

发明人： Mitsuru Tanikawa ,  Takashi Watanabe ,  Shintaro Moriguchi ,  Osamu Inui ,  Yoshitaka Kunihiro ,  Ryosuke Yamazaki ,  Ayuko Oki ,  Yasuyuki Ieda ,  Chizuru Kimu ,  Yusuke Kobayashi

IPC分类号： H01L33/52 ,  C09K11/02 ,  C08K9/06 ,  C08L83/04 ,  C08K3/36

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/52 ,  C08G77/80 ,  C08L83/04 ,  C08L83/14 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： The present invention provides a sealant for an optical semiconductor device which has high gas barrier property against corrosive gas, and is less likely to crack or is less likely to peel off even when used in harsh environments.The sealant for an optical semiconductor device includes: a first silicone resin component including at least one of a first silicone resin A represented by formula (1A) shown below and a first silicone resin B represented by formula (1B) shown below, the first silicone resin A not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group, the first silicone resin B not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group; a second silicone resin component including at least one of a second silicone resin A represented by formula (51A) shown below and a second silicone resin B represented by formula (51B) shown below, the second silicone resin A containing an aryl group and a hydrogen atom directly bound to a silicon atom, the second silicone resin B containing an aryl group and a hydrogen atom directly bound to a silicon atom; and a catalyst for hydrosilylation reaction.

摘要翻译： 本发明提供一种用于光学半导体器件的密封剂，其对腐蚀性气体具有高阻气性，并且即使在恶劣环境中使用也不太可能破裂或不太可能剥落。 用于光学半导体器件的密封剂包括：第一有机硅树脂组分，其包含以下所示的由式（1A）表示的第一有机硅树脂A和由下式（1B）表示的第一有机硅树脂B，第一硅氧烷 不含有与硅原子但含有芳基和烯基的氢原子的第一有机硅树脂B不含有与硅原子结合但含有芳基和烯基的氢原子; 第二有机硅树脂组分，其包含如下所示的由式（51A）表示的第二有机硅树脂A和由下式（51B）表示的第二有机硅树脂B中的至少一种，第二有机硅树脂A含有芳基和氢 直接与硅原子结合的原子，第二有机硅树脂B含有与硅原子直接结合的芳基和氢原子; 和氢化硅烷化反应的催化剂。

公开(公告)号：US20100222462A1

公开(公告)日：2010-09-02

申请号：US12733502

申请日：2008-09-05

申请人： Kenji Yamauchi ,  Hiroshi Hiraike ,  Hiroji Fukui ,  Shintaro Moriguchi ,  Hiroko Miyazaki

发明人： Kenji Yamauchi ,  Hiroshi Hiraike ,  Hiroji Fukui ,  Shintaro Moriguchi ,  Hiroko Miyazaki

IPC分类号： C08L1/08 ,  C08L33/04

CPC分类号： C09J133/14 ,  C08F220/14 ,  C08F220/18 ,  C08F2220/287 ,  C08L1/02 ,  C08L33/10 ,  C08L33/12 ,  C08L2666/26

摘要： It is an object of the present invention to provide a binder resin which, when used in an inorganic fine particle-dispersed paste composition, leaves little amount of residual carbon after sintering and can be degreased even under low temperature conditions. It is also an object of the present invention to provide a vehicle composition and an inorganic fine particle-dispersed paste composition, which are obtained by using the binder resin.The binder resin of the present invention is for use in an inorganic fine particle-dispersed paste composition containing inorganic fine particles. The binder resin contains from 5 to 55% by weight of a segment derived from methyl methacrylate, from 30 to 80% by weight of a segment derived from isobutyl methacrylate, and from 5 to 20% by weight of a segment derived from polyoxyalkylene ether monomethacrylate.

摘要翻译： 本发明的目的是提供一种粘合剂树脂，其用于无机细颗粒分散糊组合物中，在烧结后留下少量残留碳，即使在低温条件下也可脱脂。 本发明的另一个目的是提供通过使用粘合剂树脂获得的载体组合物和无机细颗粒分散糊组合物。 本发明的粘合剂树脂用于含有无机细颗粒的无机细粒分散糊组合物中。 粘合剂树脂含有5至55重量％的衍生自甲基丙烯酸甲酯的链段，30至80重量％的源自甲基丙烯酸异丁酯的链段和5至20重量％衍生自聚氧亚烷基醚单甲基丙烯酸酯的链段 。

公开(公告)号：US08680189B2

公开(公告)日：2014-03-25

申请号：US12733502

申请日：2008-09-05

申请人： Kenji Yamauchi ,  Hiroshi Hiraike ,  Hiroji Fukui ,  Shintaro Moriguchi ,  Hiroko Miyazaki

发明人： Kenji Yamauchi ,  Hiroshi Hiraike ,  Hiroji Fukui ,  Shintaro Moriguchi ,  Hiroko Miyazaki

IPC分类号： C08K5/00

CPC分类号： C09J133/14 ,  C08F220/14 ,  C08F220/18 ,  C08F2220/287 ,  C08L1/02 ,  C08L33/10 ,  C08L33/12 ,  C08L2666/26

摘要： It is an object of the present invention to provide a binder resin which, when used in an inorganic fine particle-dispersed paste composition, leaves little amount of residual carbon after sintering and can be degreased even under low temperature conditions. It is also an object of the present invention to provide a vehicle composition and an inorganic fine particle-dispersed paste composition, which are obtained by using the binder resin.The binder resin of the present invention is for use in an inorganic fine particle-dispersed paste composition containing inorganic fine particles. The binder resin contains from 5 to 55% by weight of a segment derived from methyl methacrylate, from 30 to 80% by weight of a segment derived from isobutyl methacrylate, and from 5 to 20% by weight of a segment derived from polyoxyalkylene ether monomethacrylate.

摘要翻译： 本发明的目的是提供一种粘合剂树脂，其用于无机细颗粒分散糊组合物中，在烧结后留下少量残留碳，即使在低温条件下也可脱脂。 本发明的另一个目的是提供通过使用粘合剂树脂获得的载体组合物和无机细颗粒分散糊组合物。 本发明的粘合剂树脂用于含有无机细颗粒的无机细粒分散糊组合物中。 粘合剂树脂含有5至55重量％的衍生自甲基丙烯酸甲酯的链段，30至80重量％的源自甲基丙烯酸异丁酯的链段和5至20重量％衍生自聚氧亚烷基醚单甲基丙烯酸酯的链段 。

公开(公告)号：US20120037223A1

公开(公告)日：2012-02-16

申请号：US13254914

申请日：2010-06-25

申请人： Isao Yamanaka ,  Shintaro Moriguchi ,  Kenji Yamauchi ,  Hiroshi Hiraike ,  Kazuhiro Omori ,  Daihei Sugita

发明人： Isao Yamanaka ,  Shintaro Moriguchi ,  Kenji Yamauchi ,  Hiroshi Hiraike ,  Kazuhiro Omori ,  Daihei Sugita

IPC分类号： H01L31/0224 ,  H01B1/20 ,  H01B1/22 ,  C08F30/02

CPC分类号： H01L31/022433 ,  C08F220/14 ,  C08F220/18 ,  C08F230/02 ,  H01B1/22 ,  Y02E10/50

摘要： An object of the present invention is to provide a binder resin for a conductive paste, which can be used to obtain a conductive paste having a high conductive powder dispersibility, an ability to form high-aspect-ratio lines, and a low residual carbon content after firing. Further objects of the invention are to provide a conductive paste and a solar cell element produced using such a binder resin for a conductive paste.The invention provides a binder resin for a conductive paste, which includes a polymer having a main chain composed of a segment derived from a (meth)acrylate monomer and having also a phosphoric acid-based component represented by general formula (1) below at an ω position thereon. In general formula (1), X is an oxygen atom or a sulfur atom, and R1 and R2 are each a hydrogen atom, a hydrocarbon group having 1 to 13 carbon atoms, a hydroxyl group-containing group having 1 to 13 carbon atoms or an ester bond-containing group having 1 to 13 carbon atoms.

摘要翻译： 本发明的目的是提供一种用于导电浆料的粘合剂树脂，其可用于获得具有高导电粉末分散性，形成高纵横比线的能力和低残留碳含量的导电浆料 射击后 本发明的另外的目的是提供使用这种用于导电浆料的粘合剂树脂制备的导电浆料和太阳能电池元件。 本发明提供了一种用于导电浆料的粘合剂树脂，其包括具有由（甲基）丙烯酸酯单体衍生的链段的主链的聚合物，并且还具有以下通式（1）表示的磷酸基组分： ω位置。 在通式（1）中，X是氧原子或硫原子，R 1和R 2各自为氢原子，碳原子数1〜13的烃基，碳原子数1〜13的含羟基的基团， 含有1〜13个碳原子的含有酯键的基团。