公开(公告)号：US20100202098A1

公开(公告)日：2010-08-12

申请号：US12686651

申请日：2010-01-13

申请人： Miyuki YANAGIDA ,  Taketo Sasaki ,  Satoshi Kurimoto ,  Masahiko Konno ,  Yuki Morita ,  Hisayuki Abe

发明人： Miyuki YANAGIDA ,  Taketo Sasaki ,  Satoshi Kurimoto ,  Masahiko Konno ,  Yuki Morita ,  Hisayuki Abe

IPC分类号： H01G4/008 ,  H01G4/12

CPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/2325

摘要： A ceramic electronic part 100 having a chip element 1 having internal electrodes embedded therein, and terminal electrodes 3 that cover the end faces 11 of the chip element 1 having an exposed internal electrode and parts of the side faces 13,15 orthogonal to the end faces 11, and that are electrically connected to the internal electrodes, wherein the terminal electrodes 3 include a first electrode layer and a second electrode layer with a lower glass component content than the first electrode layer, in that order from the chip element 1 side, the second electrode layer being formed covering part of the first electrode layer on the side faces 13,15.

摘要翻译： 具有嵌入有内部电极的芯片元件1的陶瓷电子部件100和覆盖具有暴露的内部电极的芯片元件1的端面11和与端面正交的部分侧面13,15的端子电极3 11，并且与内部电极电连接，其中端子电极3包括第一电极层和具有比第一电极层低的玻璃成分含量的第二电极层，从芯片元件1侧起依次为 第二电极层被形成为覆盖在侧面13,15上的第一电极层的一部分。

公开(公告)号：US08254083B2

公开(公告)日：2012-08-28

申请号：US12851106

申请日：2010-08-05

申请人： Takashi Sakurai ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

发明人： Takashi Sakurai ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

IPC分类号： H01G4/06

CPC分类号： H01G4/2325 ,  B23K1/0016 ,  H01G4/30

摘要： There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.

摘要翻译： 提供陶瓷电子部件和陶瓷电子部件的制造方法，其中接地电极层可以直接涂覆无铅焊料，而不降低可靠性。 端子电极3设置有通过烧制形成的Cu的接地电极层21，基于Sn-Ag-Cu-Ni-Ge的五个元素的无铅焊料形成的焊料层22和扩散层23 这是由于接地电极层21和焊料层22之间的Ni的扩散而形成的。由于在接地电极层21和焊料层22之间形成有Ni的扩散层23，所以作为 从接地电极层21抑制Cu的浸出.Ni的扩散层23也可以抑制Sn-Cu的易碎金属间化合物的生长。 因此，可以防止接地电极层21和焊料层22之间的接合强度的降低。

公开(公告)号：US20110051314A1

公开(公告)日：2011-03-03

申请号：US12851106

申请日：2010-08-05

申请人： Takashi SAKURAI ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

发明人： Takashi SAKURAI ,  Shinya Yoshihara ,  Ko Onodera ,  Hisayuki Abe ,  Masahiko Konno ,  Satoshi Kurimoto ,  Hiroshi Shindo ,  Akihiro Horita ,  Genichi Watanabe ,  Yoshikazu Ito

IPC分类号： H01G4/06 ,  H01C7/10 ,  H01F27/28 ,  B23K1/20

CPC分类号： H01G4/2325 ,  B23K1/0016 ,  H01G4/30

摘要： There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.

摘要翻译： 提供陶瓷电子部件和陶瓷电子部件的制造方法，其中接地电极层可以直接涂覆无铅焊料，而不降低可靠性。 端子电极3设置有通过烧制形成的Cu的接地电极层21，基于Sn-Ag-Cu-Ni-Ge的五个元素的无铅焊料形成的焊料层22和扩散层23 这是由于接地电极层21和焊料层22之间的Ni的扩散而形成的。由于在接地电极层21和焊料层22之间形成有Ni的扩散层23，所以作为 从接地电极层21抑制Cu的浸出.Ni的扩散层23也可以抑制Sn-Cu的易碎金属间化合物的生长。 因此，可以防止接地电极层21和焊料层22之间的接合强度的降低。

公开(公告)号：US08747263B2

公开(公告)日：2014-06-10

申请号：US13600994

申请日：2012-08-31

申请人： Masahiko Konno ,  Kaori Mori ,  Yuji Kurematsu

发明人： Masahiko Konno ,  Kaori Mori ,  Yuji Kurematsu

IPC分类号： F16H7/08

CPC分类号： F16H7/18 ,  F16H2007/0872

摘要： A transmission guide comprises a synthetic resin shoe and a more rigid synthetic resin base, integrally molded by two-member molding. The base is formed with a pair of spaced, opposed, side walls extending in the direction of elongation of the base along opposite edges of a shoe-supporting surface of the base. These side walls engage respective side edges of the shoe, and extend past the front surface of the shoe so that they can restrict lateral movement of a transmission chain sliding along the front surface of the shoe. Indentations in the side walls receive protrusions formed on the edges of the shoe. Edges of the openings of the indentations are chamfered or convexly curved to avoid interference with the movement of the chain along the guide.

摘要翻译： 传动引导件包括合成树脂鞋和更坚硬的合成树脂基底，通过两件式成型一体模制。 基部形成有一对间隔开的相对的侧壁，其沿着基部的鞋支撑表面的相对边缘在基部的伸长方向上延伸。 这些侧壁与鞋的相应的侧边缘接合，并且延伸穿过鞋的前表面，使得它们可以限制沿鞋的前表面滑动的传动链的横向移动。 侧壁上的凹痕接收形成在鞋的边缘上的突起。 凹口的开口的边缘被倒角或凸起弯曲，以避免与链条沿着引导件的运动的干涉。

公开(公告)号：US08454462B2

公开(公告)日：2013-06-04

申请号：US12915226

申请日：2010-10-29

申请人： Masahiko Konno ,  Kaori Mori ,  Yuji Kurematsu ,  Akira Kobara ,  Manabu Hirayama

发明人： Masahiko Konno ,  Kaori Mori ,  Yuji Kurematsu ,  Akira Kobara ,  Manabu Hirayama

IPC分类号： F16H7/18 ,  F16H7/08

CPC分类号： F16H7/08 ,  F16H2007/0874 ,  F16H2007/0893

摘要： In a chain guide mechanism, fixed and movable guides are attached to a guide bridge by cooperation of bosses on the guides with boss-receiving holes formed in spaced-apart elements of arms of the bridge. A fixed guide is held against rotation by cooperation of a projection on its mounting boss with a notch in a boss-receiving hole in a guide bridge arm element. A base, extending from an intermediate location at which the arms come together has a pressing structure that engages bosses on a driving sprocket, and a groove for receiving teeth of the driving sprocket.

摘要翻译： 在链条引导机构中，固定和可移动的导向件通过凸台在引导件上的配合被附接到导向桥上，凸台接收孔形成在桥的间隔开的元件中。 通过其安装凸台上的突起与导向桥臂元件中的凸台接收孔中的凹口的配合来固定固定引导件。 从臂的中间位置延伸的基部具有接合驱动链轮上的凸起的按压结构和用于接收主动链轮的齿的凹槽。

公开(公告)号：US08300778B2

公开(公告)日：2012-10-30

申请号：US12392709

申请日：2009-02-25

申请人： Kei Shibuya ,  Kiyotoshi Hariu ,  Takeshi Kojima ,  Rikiya Maeda ,  Masahiko Konno ,  Hayato Sasaki ,  Ken Sato ,  Tomoki Iwabuchi

发明人： Kei Shibuya ,  Kiyotoshi Hariu ,  Takeshi Kojima ,  Rikiya Maeda ,  Masahiko Konno ,  Hayato Sasaki ,  Ken Sato ,  Tomoki Iwabuchi

IPC分类号： H04M1/64 ,  H04W4/00 ,  G08B13/14

CPC分类号： H04M1/72552 ,  H04L51/24 ,  H04M1/22 ,  H04M1/72544 ,  H04M19/04

摘要： An information processing terminal device includes a state monitoring unit that monitors whether or not there exits an unread e-mail or a missed call, a light order control unit that makes an emitting unit emit a color corresponding to each sender in a given order when the unread e-mail or the missed call is detected, where a light order control unit determines a light order of the colors according to a receiving order of the unread e-mail or an incoming order of the missed call.

摘要翻译： 信息处理终端装置包括：状态监视单元，其监视是否退出未读电子邮件或未接来电;照明单元，其使发光单元以给定顺序发射与每个发送者对应的颜色，当 检测到未读电子邮件或未接来电，其中光订单控制单元根据未读电子邮件的接收顺序或未接来电的输入顺序来确定颜色的光顺序。

公开(公告)号：US20110105258A1

公开(公告)日：2011-05-05

申请号：US12915226

申请日：2010-10-29

申请人： Masahiko Konno ,  Kaori Mori ,  Yuji Kurematsu ,  Akira Kobara ,  Manabu Hirayama

发明人： Masahiko Konno ,  Kaori Mori ,  Yuji Kurematsu ,  Akira Kobara ,  Manabu Hirayama

IPC分类号： F16H7/18 ,  F16H7/08

CPC分类号： F16H7/08 ,  F16H2007/0874 ,  F16H2007/0893

摘要： In a chain guide mechanism, fixed and movable guides are attached to a guide bridge by cooperation of bosses on the guides with boss-receiving holes formed in spaced-apart elements of arms of the bridge. A fixed guide is held against rotation by cooperation of a projection on its mounting boss with a notch in a boss-receiving hole in a guide bridge arm element. A base, extending from an intermediate location at which the arms come together has a pressing structure that engages bosses on a driving sprocket, and a groove for receiving teeth of the driving sprocket.

摘要翻译： 在链条引导机构中，固定和可移动的导向件通过凸台在引导件上的配合被附接到导向桥上，凸台接收孔形成在桥的间隔开的元件中。 通过其安装凸台上的突起与导向桥臂元件中的凸台接收孔中的凹口的配合来固定固定引导件。 从臂的中间位置延伸的基部具有接合驱动链轮上的凸起的按压结构和用于接收主动链轮的齿的凹槽。

公开(公告)号：US20080032836A1

公开(公告)日：2008-02-07

申请号：US11631484

申请日：2005-07-01

申请人： Masahiko Konno ,  Sadahiko Yamaguchi ,  Tatsumi Murohoshi

发明人： Masahiko Konno ,  Sadahiko Yamaguchi ,  Tatsumi Murohoshi

IPC分类号： F16H7/18

CPC分类号： F16H7/18 ,  F16H2007/0812 ,  F16H2007/0872

摘要： A sandwich-molded part for a transmission device comprising a slide rail 11 on which a chain slides and a rail support 12, wherein a first resin forming a surface layer is formed of a material having nylon 66 as the principal component, and the melt viscosity of the first resin at 300° C. is 500 Pa·s or more and 2000 Pa·s or less at a shear rate of 1000s-1; a second resin forming a core layer has a bending strength higher than that of the first resin; and the surface layer on a sliding part 11a of the slide rail 11 has a thickness of 1.0 mm or more. Thus, the sandwich-molded part for a transmission device capable of effectively preventing endurance from lowering in practical use can be provided.

摘要翻译： 一种用于传动装置的夹层模制部件，包括链条滑动的滑轨11和轨道支撑件12，其中形成表面层的第一树脂由具有尼龙66作为主要成分的材料形成，并且熔体粘度 的第一树脂在1000℃-1的剪切速率下为500Pa.s以上且2000Pa.s以下; 形成芯层的第二树脂的弯曲强度高于第一树脂的弯曲强度; 并且滑轨11的滑动部11a上的表面层的厚度为1.0mm以上。 因此，可以提供能够有效地防止实际使用中的耐久性降低的传动装置用夹层成型部。

公开(公告)号：US20060199689A1

公开(公告)日：2006-09-07

申请号：US11343044

申请日：2006-01-30

申请人： Shintarou Yoshimoto ,  Masahiko Konno

发明人： Shintarou Yoshimoto ,  Masahiko Konno

IPC分类号： F16H7/08 ,  F16H7/18

CPC分类号： F16H7/18 ,  F16H2007/0872

摘要： In a sliding contact chain guide of the kind used in the timing transmission of an internal combustion engine, the guide body is formed by injection molding of a synthetic resin. The guide body includes reinforcing ribs of substantially uniform width, forming a Y-shaped truss structure.

摘要翻译： 在内燃机的定时传动中使用的滑动接触链导轨中，引导体通过合成树脂的注射成型而形成。 引导体包括基本均匀宽度的加强肋，形成Y形桁架结构。

公开(公告)号：US20060172835A1

公开(公告)日：2006-08-03

申请号：US11303697

申请日：2005-12-16

申请人： Masahiko Konno

发明人： Masahiko Konno

IPC分类号： F16H7/08 ,  F16H7/18

CPC分类号： F16H7/18 ,  F16H2007/0872

摘要： A guide for an engine timing chain comprises a metal supporting base and a resin shoe, the shoe having integrally formed hooks for attachment to the supporting base, and integrally formed side walls for limiting lateral movement of the chain on the sliding contact surface of the shoe. A central portion of the shoe has a sandwich injection molded structure and comprises a high strength core of glass fiber-reinforced polyamide resin, and a polyamide skin layer. The side walls and the hooks are formed entirely of the skin layer material.