摘要:
An heat exchanger assembly includes a plurality of tubes defining a plurality of parallel refrigerant passages therein carrying a refrigerant longitudinally from an inlet header to an outlet header. Water flows from a reservoir through a distributor apparatus to provide even wetting between the ends of the tubes as the water flows laterally over the tubes between an entry edge and an exit edge. A screen is provided adjacent the exit edge to collect excess water to be deposited into a water tray provided beneath and spaced from the exit edge of the tubes. A pump is provided to move water from the water tray to the reservoir to preserve water. If excess water is lost, such as through evaporation, a supplemental water feed line provides supplemental water to the system.
摘要:
The invention provides an assembly for desalinating water comprising a cold air duct open to the dry channels of the evaporative cooler and extending around a humidification chamber disposed between the evaporative cooler and the condenser. The invention provides for a film valve including a flexible sheet intersecting the cold air duct for controlling air flow along the cold air duct to the condenser. The film valve allows for a fraction, or all of the cool air in the cold air duct to be utilized for comfort cooling.
摘要:
A refrigeration assembly includes a pair of refrigerated chambers defined within a working chamber. The refrigerated chambers include channel walls extending parallel to one another and spaced apart, and first and second panels extending channel walls to define a working channel for separating the working chamber into sub-chambers. Apertures defined in the panels allow airflow from the sub-chambers into the working channel, and a supply of water wets the panels and a first section of the refrigerated chambers. Air enters the sub-chambers and flows over the first sections of the refrigerated chambers for direct evaporative cooling. A portion of the air bleeds through the apertures and evaporates water from the panels prior to flowing over the second sections of the refrigerated chambers for indirect evaporative cooling.
摘要:
An evaporative heat exchanger for cooling a hot refrigerant having a core of alternatively stacked dry and wet plates. Each dry plate includes a dry side defining a plurality of dry channels in a first direction, a series of ports distributed along the dry channels, a wet side, and a refrigerant cooling section. Each wet plate includes a wet side adjacent to and cooperates with the wet side of the dry plate to define a plurality of wet channels in a second direction. The dry channels, ports, and wet channels define a labyrinth for the air flow, which evaporates the liquid contained in the wet channels resulting in a cooling of the refrigerant. The refrigerant cooling section is integral with the outboard of the dry plate and adjacent to an end section of the wet channels to provide enhanced refrigerant cooling.
摘要:
A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. A continuous sheet extends in v-shaped fins between and engaging said arcs of said chambers. The internal fins extend from a center axis of the tube to reverse bends defining the opposite ends of the tube. A continuous sheet extending in sinuous corrugations extends around the exterior of the endless loop between opposite sides of a heat transfer area, which receives the electronic element.
摘要:
A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).
摘要:
A hermetically sealed housing includes a plurality of inner walls extending radially from a central post to a circular outer wall, thereby defining a plurality of pie shaped chambers, each independently containing a refrigerant. At least one of the chambers is always in position to remove heat from an electronic device regardless of the orientation of the heat exchanger assembly. A plurality of side fins are disposed on the outer wall of the housing, and a plurality of top fins extend radially from a central axis (A) and are disposed on top of the housing. A wicking material is disposed on the interior of each chamber. A fan assembly is disposed on top of the top fins to blow air radially down into the fins.
摘要:
An indirect evaporative cooler assembly includes staggered wet and dry channels. An electric fan moves air through the assembly. Air passes through the wet channels where a material wicks moisture stored in a reservoir into the wet channels. As a result, the side walls of the wet channels are evaporatively cooled. Air moving through dry channels is cooled by the cooling of the walls of the wet channels, and by the presence of louvered convoluted fins in the dry channels that allow for air circulation and further heat dissipation. The wet channels are distinguished by the presence of an electrolyte saturating the material, and electrodes disposed on either side of the material combined to generate an electrical current. Pairs of electrodes are connected in series, and generate electricity to power the electric fan. An auxiliary power source is activated when the voltage from the electrodes drops below a pre-determined level.
摘要:
A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A heat block contacts the front face for transferring generated heat from the electronic component to the working fluid to vaporize the working fluid. A condenser is in fluid communication with the chamber and connected to the rear face for condensing the vaporized working fluid back to a liquid. The assembly further includes an acute angle between the front face and the peripheral wall such that the chamber extends upwardly at an angle from the front face to the rear face to ensure complete coverage of the heat block with the cooling fluid in any position between horizontal and vertical.
摘要:
An integrated liquid cooling unit comprising a liquid pump and a U-shaped flat tube. An adapter rigidly connects and establishes fluid communication between the pump and the tube creating an integrated unit for cooling an electronic chip via a closed loop. Heat is rejected from the coolant through cooling fins disposed between the legs of the U-shaped tube to passing air being propelled by a blower assembly.