Method for forming and tailoring the electrical characteristics of
semiconductor devices
    1.
    发明授权
    Method for forming and tailoring the electrical characteristics of semiconductor devices 失效
    用于形成和定制半导体器件的电特性的方法

    公开(公告)号:US5405788A

    公开(公告)日:1995-04-11

    申请号:US66835

    申请日:1993-05-24

    摘要: A method for forming semiconductor devices includes a low energy implant for tailoring the electrical characteristics of the semiconductor devices. Using the low energy implant, narrow width devices such as access transistors in an SRAM cell, can be fabricated with a low threshold voltage (Vt). The low energy implant is performed on the active areas of a silicon substrate following field isolation and field implant. For an n-conductivity access transistor, the low energy dopant can be an n-type dopant such as phosphorus, arsenic or antimony.

    摘要翻译: 用于形成半导体器件的方法包括用于调整半导体器件的电特性的低能量注入。 使用低能量注入,可以以低阈值电压(Vt)制造诸如SRAM单元中的存取晶体管的窄宽度器件。 在场隔离和场植入之后,在硅衬底的有源区域上执行低能量注入。 对于n导电性存取晶体管,低能掺杂剂可以是n型掺杂剂,例如磷,砷或锑。

    Method for forming and tailoring the electrical characteristics of
semiconductor devices
    2.
    发明授权
    Method for forming and tailoring the electrical characteristics of semiconductor devices 失效
    用于形成和定制半导体器件的电特性的方法

    公开(公告)号:US5661045A

    公开(公告)日:1997-08-26

    申请号:US763848

    申请日:1996-12-09

    摘要: A method for forming semiconductor devices includes a low energy implant for tailoring the electrical characteristics of the semiconductor devices. Using the low energy implant, narrow width devices such as access transistors in an SRAM cell, can be fabricated with a low threshold voltage (Vt). The low energy implant is performed on the active areas of a silicon substrate following field isolation and field implant. For an n-conductivity access transistor, the low energy dopant can be an n-type dopant such as phosphorus, arsenic or antimony.

    摘要翻译: 用于形成半导体器件的方法包括用于调整半导体器件的电特性的低能量注入。 使用低能量注入,可以以低阈值电压(Vt)制造诸如SRAM单元中的存取晶体管的窄宽度器件。 在场隔离和场植入之后,在硅衬底的有源区域上执行低能量注入。 对于n导电性存取晶体管,低能掺杂剂可以是n型掺杂剂,例如磷,砷或锑。

    Forming phase change memories
    3.
    发明申请
    Forming phase change memories 有权
    形成相变记忆

    公开(公告)号:US20070138467A1

    公开(公告)日:2007-06-21

    申请号:US11706000

    申请日:2007-02-13

    IPC分类号: H01L31/00

    摘要: Phase change memories may exhibit improved properties and lower cost in some cases by forming the phase change material layers in a planar configuration. A heater may be provided below the phase change material layers to appropriately heat the material to induce the phase changes. The heater may be coupled to an appropriate conductor.

    摘要翻译: 在一些情况下,通过将相变材料层形成为平面构型,相变存储器可以表现出改善的性能和较低的成本。 可以在相变材料层的下方设置加热器,以适当地加热材料以引起相变。 加热器可以耦合到适当的导体。

    Multilevel variable resistance memory cell utilizing crystalline programming states
    6.
    发明授权
    Multilevel variable resistance memory cell utilizing crystalline programming states 有权
    利用晶体编程状态的多电平可变电阻存储单元

    公开(公告)号:US08363446B2

    公开(公告)日:2013-01-29

    申请号:US12578638

    申请日:2009-10-14

    IPC分类号: G11C11/00

    摘要: A method of programming an electrical variable resistance memory device. When applied to variable resistance memory devices that incorporate a phase-change material as the active material, the method utilizes a plurality of crystalline programming states. The crystalline programming states are distinguishable on the basis of resistance, where the resistance values of the different states are stable with time and exhibit little or no drift. As a result, the programming scheme is particularly suited to multilevel memory applications. The crystalline programming states may be achieved by stabilizing crystalline phases that adopt different crystallographic structures or by stabilizing crystalline phases that include mixtures of two or more distinct crystallographic structures that vary in the relative proportions of the different crystallographic structures. The programming scheme incorporates at least two crystalline programming states and further includes at least a third programming state that may be a crystalline, amorphous or mixed crystalline-amorphous state.

    摘要翻译: 一种编程电可变电阻存储器件的方法。 当应用于包含相变材料作为活性材料的可变电阻存储器件时,该方法利用多个晶体编程状态。 结晶编程状态可以根据电阻进行区分,其中不同状态的电阻值随时间稳定并且表现出很小的或没有漂移。 因此,编程方案特别适用于多层存储器应用。 晶体编程状态可以通过稳定采用不同晶体结构的结晶相或通过稳定结晶相来实现,所述结晶相包括两种或更多种不同结晶学结构的混合物,其在不同结晶学结构的相对比例中变化。 编程方案包含至少两个晶体编程状态,并且还包括至少第三编程状态,其可以是晶体,无定形或混合晶体 - 非晶状态。

    Utilizing atomic layer deposition for programmable device
    7.
    发明申请
    Utilizing atomic layer deposition for programmable device 审中-公开
    利用原子层沉积可编程器件

    公开(公告)号:US20050124157A1

    公开(公告)日:2005-06-09

    申请号:US10971812

    申请日:2004-10-22

    摘要: In an aspect, an apparatus is provided that sets and reprograms the state of programmable devices. In an aspect, a method is provided such that an opening is formed through a dielectric exposing a contact, the contact formed on a substrate. An electrode is conformally deposited on a wall of the dielectric, utilizing atomic layer deposition (ALD). A programmable material is formed on the electrode and a conductor is formed to the programmable material. In an aspect, a barrier is conformally deposited utilizing ALD, between the electrode and the programmable material.

    摘要翻译: 在一方面,提供一种设置和重新编程可编程设备的状态的设备。 在一方面,提供了一种方法,使得通过暴露接触的电介质形成开口,接触形成在基底上。 利用原子层沉积(ALD)将电极保形地沉积在电介质的壁上。 可编程材料形成在电极上,导体形成可编程材料。 在一个方面,在电极和可编程材料之间利用ALD共形沉积屏障。

    Forming phase change memories
    8.
    发明授权
    Forming phase change memories 失效
    形成相变记忆

    公开(公告)号:US06869883B2

    公开(公告)日:2005-03-22

    申请号:US10319214

    申请日:2002-12-13

    IPC分类号: H01L45/00 H01L21/311

    摘要: Phase change memories may exhibit improved properties and lower cost in some cases by forming the phase change material layers in a planar configuration. A heater may be provided below the phase change material layers to appropriately heat the material to induce the phase changes. The heater may be coupled to an appropriate conductor.

    摘要翻译: 在一些情况下,通过将相变材料层形成为平面构型,相变存储器可以表现出改善的性能和较低的成本。 可以在相变材料层的下方设置加热器,以适当地加热材料以引起相变。 加热器可以耦合到适当的导体。

    Planar thin film transistor structures
    9.
    发明授权
    Planar thin film transistor structures 失效
    平面薄膜晶体管结构

    公开(公告)号:US5691547A

    公开(公告)日:1997-11-25

    申请号:US376866

    申请日:1995-01-23

    摘要: The disclosure includes preferred semiconductor transistor devices utilizing thin film transistors, as well as preferred methods of forming such devices. Specifically, a bottom thin film transistor gate is formed having a top surface. An insulating filler is provided adjacent the thin film transistor gate to an elevation at least as high as the thin film transistor gate top surface, and subsequently levelled to provide generally planar insulating surfaces adjacent the thin film transistor gate. The planar insulating surfaces are substantially coplanar with the thin film transistor gate top surface. A planar semiconductor thin film is then formed over the thin film transistor gate and over the adjacent planar insulating surfaces. The thin film is doped to form source and drain regions of a thin film transistor which is bottom gated by the thin film transistor gate.

    摘要翻译: 本公开包括使用薄膜晶体管的优选半导体晶体管器件以及形成这种器件的优选方法。 具体地,形成具有顶表面的底部薄膜晶体管栅极。 在薄膜晶体管栅极附近提供绝缘填充物,至少与薄膜晶体管栅极顶表面一样高,并且随后平整以提供与薄膜晶体管栅极相邻的大致平面的绝缘表面。 平面绝缘表面基本上与薄膜晶体管栅极顶表面共面。 然后在薄膜晶体管栅极上方并在相邻的平面绝缘表面上形成平面半导体薄膜。 掺杂薄膜以形成薄膜晶体管的源区和漏极区,薄膜晶体管是由薄膜晶体管栅极选通的。

    Multilevel Variable Resistance Memory Cell Utilizing Crystalline Programming States
    10.
    发明申请
    Multilevel Variable Resistance Memory Cell Utilizing Crystalline Programming States 有权
    使用结晶编程国家的多电平可变电阻记忆单元

    公开(公告)号:US20100027328A1

    公开(公告)日:2010-02-04

    申请号:US12578638

    申请日:2009-10-14

    IPC分类号: G11C11/00 G11C7/00

    摘要: A method of programming an electrical variable resistance memory device. When applied to variable resistance memory devices that incorporate a phase-change material as the active material, the method utilizes a plurality of crystalline programming states. The crystalline programming states are distinguishable on the basis of resistance, where the resistance values of the different states are stable with time and exhibit little or no drift. As a result, the programming scheme is particularly suited to multilevel memory applications. The crystalline programming states may be achieved by stabilizing crystalline phases that adopt different crystallographic structures or by stabilizing crystalline phases that include mixtures of two or more distinct crystallographic structures that vary in the relative proportions of the different crystallographic structures. The programming scheme incorporates at least two crystalline programming states and further includes at least a third programming state that may be a crystalline, amorphous or mixed crystalline-amorphous state.

    摘要翻译: 一种编程电可变电阻存储器件的方法。 当应用于包含相变材料作为活性材料的可变电阻存储器件时,该方法利用多个晶体编程状态。 结晶编程状态可以根据电阻进行区分,其中不同状态的电阻值随时间稳定并且表现出很小的或没有漂移。 因此,编程方案特别适用于多层存储器应用。 晶体编程状态可以通过稳定采用不同晶体结构的结晶相或通过稳定结晶相来实现,所述结晶相包括两种或更多种不同结晶学结构的混合物,其在不同结晶学结构的相对比例中变化。 编程方案包含至少两个晶体编程状态,并且还包括至少第三编程状态,其可以是晶体,无定形或混合晶体 - 非晶状态。