摘要:
An apparatus for fault detection and classification (FDC) specification management including a storage device and a process module. The storage device stores a specification management record and a chart profile record. The specification management record stores statistical algorithm settings of a parameter and the chart profile record stores chart frame and alarm condition information. The process module, which resides in a memory, receives a manipulation message corresponding to the specification management record, and accordingly manipulates the chart profile record.
摘要:
An apparatus for fault detection and classification (FDC) specification management including a storage device and a process module. The storage device stores a specification management record and a chart profile record. The specification management record stores statistical algorithm settings of a parameter and the chart profile record stores chart frame and alarm condition information. The process module, which resides in a memory, receives a manipulation message corresponding to the specification management record, and accordingly manipulates the chart profile record.
摘要:
A system and method for automatic SPC chart generation including a storage device and a data acquisition module. The storage device stores a chamber management tree, a recipe window management tree, a parameter configuration table and multiple chart profile records. The data acquisition module, which resides in a memory, acquires multiple process events and parameter values corresponding to the process events and a process parameter, selects a relevant statistical algorithm, calculates a statistical value by applying the statistical algorithm to the parameter values, creates a new chart profile record and a parameter statistics record therein if the chart profile record is absent, and stores the statistical values and measured time in the parameter statistics record.
摘要:
A system and method for automatic SPC chart generation including a storage device and a data acquisition module. The storage device stores a chamber management tree, a recipe window management tree, a parameter configuration table and multiple chart profile records. The data acquisition module, which resides in a memory, acquires multiple process events and parameter values corresponding to the process events and a process parameter, selects a relevant statistical algorithm, calculates a statistical value by applying the statistical algorithm to the parameter values, creates a new chart profile record and a parameter statistics record therein if the chart profile record is absent, and stores the statistical values and measured time in the parameter statistics record.
摘要:
A wafer transfer chamber, such as a load-lock chamber used in a cluster processing tool for semiconductor devices that has reduced particle contamination problem is provided. In the wafer transfer chamber, a particle filter is provided to shield or isolate a wafer cassette during a chamber pumping and venting process such that not only particle contamination on the wafers situated in the wafer cassette can be drastically reduced, but also the cycle time or time for pumping and venting the load-lock chamber can be significantly reduced since turbulent flow in the chamber interior can be tolerated when the wafers are isolated from such flow which carries contaminating particles.
摘要:
A method for detecting abnormal operation of a manufacturing process, comprising the steps of: (a) detecting at least one acoustic signal created from a processing apparatus; (b) transforming the acoustic signal into a frequency spectrum; (c) comparing the frequency spectrum with a pre-determined frequency spectrum, and (d) generating a signal indicating an abnormal operation of the processing apparatus, if an amplitude of at least one first frequency of the frequency spectrum is substantially different from an amplitude of the same frequency of the pre-determined frequency spectrum.
摘要:
A temperature-sensing wafer position detection system and method which uses temperature to determine whether a wafer is properly positioned on a bake plate prior to commencement of a photolithography baking process, for example. The system includes a bake plate and a temperature-sensing apparatus which engages the bake plate and measures the change in temperature (ΔT) of the bake plate over a specified time interval to determine whether the wafer is properly or improperly positioned on the support. In the event that the ΔT of the bake plate is at least as great as a given temperature change threshold value over a specified time interval, this indicates that the wafer is properly positioned for processing.
摘要:
A method of building a problem troubleshooting database for use in a semiconductor manufacturing system includes storing semiconductor manufacturing problem data in a problem troubleshooting database; storing cause data in the problem troubleshooting database, the cause data being associated with respective problem data; storing solution data in the problem troubleshooting database, the solution data being associated with respective semiconductor manufacturing problem data and cause data; evaluating the effectiveness of the solution data; and updating the solution data with information with respect to the effectiveness determined in the evaluating step.
摘要:
The direct detection of dielectric etch system magnet driver and coil malfunctions is disclosed. A dielectric etch system includes a plasma chamber in which a semiconductor wafer is placed to remove dielectric therefrom, and a number of coils positioned around the chamber to excite the plasma. Magnet drivers of a magnet driver circuitry provide configurable preset current from a power source to the coils. Malfunction detection circuitry includes a number of comparators connected in parallel. Each comparator couples between one of the magnet drivers and one of the coils. A relay couples the comparators to ground, and turns off the power source when any of the comparators yields a substantially non-zero current, which indicates that either the driver or the coil coupled to the comparator is malfunctioning.
摘要:
Within a method for forming a plasma etched layer, there is first provided a substrate. There is then formed over the substrate a microelectronic layer. There is then etched within a plasma reactor chamber, and while employing a plasma etch method, the microelectronic layer to form a plasma etched microelectronic layer. Finally, there is then purged the plasma reactor chamber with an inert purge gas, without subsequently evacuating the plasma reactor chamber, prior to removing the substrate having formed thereover the plasma etched microelectronic layer from the plasma reactor chamber. In an alternative there is purged a load lock chamber integral to the plasma reactor chamber with an inert purge gas, without subsequently evacuating the load lock chamber, prior to removing the substrate having formed thereover the plasma etched microelectronic layer from the load lock chamber.