Multi-ported register files
    1.
    发明授权
    Multi-ported register files 有权
    多端口寄存器文件

    公开(公告)号:US07200068B2

    公开(公告)日:2007-04-03

    申请号:US10330652

    申请日:2002-12-27

    IPC分类号: G11C8/00

    CPC分类号: G11C8/16 G06F9/30141 G11C7/18

    摘要: A multi-ported register comprises a Global Bit Line (GBL) to couple a gate to a data output line via an output transistor. A Local bit Line (LBL) couples the gate to a first register file cell and a second register file cell, said second register file cell disposed closer to the data output line than the first register file cell. At least one transistor in the first register file cell having a stronger drive current than the at least one transistor in the second register file cell. At least one of, the output transistor, the gate, and the first register file cell of a first bank have a stronger drive current than the corresponding output transistor, the gate and the first register file cell of a second bank said second bank being closer to the data output line.

    摘要翻译: 多端口寄存器包括通过输出晶体管将栅极耦合到数据输出线的全局位线(GBL)。 本地位线(LBL)将门耦合到第一寄存器堆单元和第二寄存器堆单元,所述第二寄存器堆单元布置成比第一寄存器堆单元靠近数据输出线。 第一寄存器堆单元中的至少一个晶体管具有比第二寄存器堆单元中的至少一个晶体管更强的驱动电流。 第一组的输出晶体管,栅极和第一寄存器堆单元中的至少一个具有比对应的输出晶体管更强的驱动电流,第二存储体的栅极和第一存储体的第一寄存器堆单元表示第二存储体更接近 到数据输出线。

    Dual gate oxide one time programmable (OTP) antifuse cell
    2.
    发明授权
    Dual gate oxide one time programmable (OTP) antifuse cell 有权
    双栅氧化层一次可编程(OTP)反熔丝

    公开(公告)号:US07280425B2

    公开(公告)日:2007-10-09

    申请号:US11239903

    申请日:2005-09-30

    IPC分类号: G11C17/18

    摘要: A one-time programmable (OTP) cell includes an access transistor coupled to an antifuse transistor. Access transistor has a gate oxide thickness that is greater than the gate oxide thickness of the antifuse transistor so that if the antifuse transistor is programmed, the voltage felt across the gate/drain junction of the access transistor is insufficient to cause the gate oxide of the access transistor to break down. The dual gate oxide OTP cell may be used in an array in which only one OTP cell is programmed at a time. The dual gate oxide OTP cell also may be used in an array in which several OTP cells are programmed simultaneously.

    摘要翻译: 一次性可编程(OTP)单元包括耦合到反熔丝晶体管的存取晶体管。 存取晶体管具有大于反熔丝晶体管的栅极氧化物厚度的栅极氧化物厚度,使得如果对反熔丝晶体管进行编程,则在存取晶体管的栅极/漏极结附近的电压不足以引起栅极氧化物 存取晶体管分解。 双栅氧化物OTP单元可以用于其中一次只编写一个OTP单元的阵列中。 双栅氧化物OTP电池也可用于其中同时编程几个OTP电池的阵列中。

    OTP antifuse cell and cell array
    3.
    发明授权
    OTP antifuse cell and cell array 有权
    OTP反熔丝电池和电池阵列

    公开(公告)号:US07102951B2

    公开(公告)日:2006-09-05

    申请号:US10979605

    申请日:2004-11-01

    IPC分类号: G11C17/18

    摘要: Different embodiments of a one-time-programmable antifuse cell included. In one embodiment, a circuit is provided that includes an antifuse element, a high voltage device, and a sense circuit. The antifuse element has a voltage supply terminal to be at a sense voltage during sensing/reading and a higher programming voltage during programming. The sense circuit is configured to enable programming the antifuse element during programming and to sense the state of the antifuse element during sensing. The high voltage device is coupled between the antifuse element and the sense circuit to couple the antifuse element to the sense circuit during programming and sensing and to protectively shield the sense circuit from the higher programming voltage during programming.

    摘要翻译: 包括一次性可编程反熔丝电池的不同实施例。 在一个实施例中,提供了包括反熔丝元件,高压器件和感测电路的电路。 反熔丝元件在编程期间具有在感测/读取期间处于感测电压的电压提供端子和更高的编程电压。 感测电路被配置为能够在编程期间对反熔丝元件进行编程,并且在感测期间感测反熔丝元件的状态。 高电压设备耦合在反熔丝元件和感测电路之间,以在编程和感测期间将反熔断元件耦合到感测电路,并且在编程期间将感测电路与更高的编程电压保护性地屏蔽。

    Memory cell without halo implant
    4.
    发明授权
    Memory cell without halo implant 有权
    无光晕植入的记忆细胞

    公开(公告)号:US07355246B2

    公开(公告)日:2008-04-08

    申请号:US11268430

    申请日:2005-11-07

    IPC分类号: H01L29/76

    摘要: Some embodiments provide a memory cell comprising a body region doped with charge carriers of a first type, a source region disposed in the body region and doped with charge carriers of a second type, and a drain region disposed in the body region and doped with charge carriers of the second type. According to some embodiments, the body region, the source region, and the drain region are oriented in a first direction, the body region and the source region form a first junction, and the body region and the drain region form a second junction. Moreover, a conductivity of the first junction from the body region to the source region in a case that the first junction is unbiased is substantially less than a conductivity of the second junction from the body region to the drain region in a case that the second junction is unbiased. Some embodiments further include a transistor oriented in a second direction, wherein the second direction is not parallel to the first direction.

    摘要翻译: 一些实施例提供一种存储单元,其包括掺杂有第一类型的电荷载体的体区,设置在体区中的源极区,并掺杂有第二类型的电荷载流子,以及设置在体区中的掺杂电荷 第二种载体。 根据一些实施例,身体区域,源区域和漏极区域在第一方向上定向,身体区域和源区域形成第一结,并且体区域和漏区域形成第二结。 此外,在第一结无偏置的情况下,从体区到源极区的第一结的导电率基本上小于从体区到漏区的第二结的导电率,在第二结 是不偏不倚的 一些实施例还包括在第二方向上取向的晶体管,其中第二方向不平行于第一方向。

    SRAM device having forward body bias control
    8.
    发明授权
    SRAM device having forward body bias control 有权
    具有前向偏置控制的SRAM器件

    公开(公告)号:US07423899B2

    公开(公告)日:2008-09-09

    申请号:US10812894

    申请日:2004-03-31

    IPC分类号: G11C11/00 G11C5/14

    CPC分类号: G11C11/412

    摘要: A SRAM device is provided having a plurality of memory cells. Each memory cell may include a plurality of transistors coupled in a cross-coupled inverter configuration. An NMOS transistor may be coupled to a body of the two PMOS transistors in the cross-coupled inverter configuration so as to apply a forward body bias to the PMOS transistors of the cross-coupled inverter configuration. A power control unit may control a supply voltage to each of the PMOS transistors as well as apply the switching signal to the NMOS transistor based on a STANDBY mode of the memory cell.

    摘要翻译: 提供具有多个存储单元的SRAM器件。 每个存储单元可以包括以交叉耦合的反相器配置耦合的多个晶体管。 NMOS晶体管可以以交叉耦合的反相器配置耦合到两个PMOS晶体管的主体,以便向交叉耦合的反相器配置的PMOS晶体管施加正向偏置。 功率控制单元可以控制每个PMOS晶体管的电源电压,并且基于存储器单元的STANDBY模式将开关信号施加到NMOS晶体管。

    SRAM cell power reduction circuit
    10.
    发明授权
    SRAM cell power reduction circuit 有权
    SRAM单元功率降低电路

    公开(公告)号:US07206249B2

    公开(公告)日:2007-04-17

    申请号:US10956195

    申请日:2004-09-30

    IPC分类号: G11C5/14

    CPC分类号: G11C11/413

    摘要: A method is described that comprises modulating the power consumption of an SRAM as a function of its usage at least by reaching, with help of a transistor, a voltage on a node within an operational amplifier's feedback loop. The voltage is beyond another voltage that the operational amplifier would drive the node to be without the help of the transistor. The voltage helps the feedback loop establish a voltage drop across a cell within the SRAM.

    摘要翻译: 描述了一种方法,其包括至少通过在晶体管处达到运算放大器的反馈回路内的节点上的电压来调制作为其使用的函数的SRAM的功耗。 电压超过另一个电压,运算放大器将驱动节点没有晶体管的帮助。 电压有助于反馈回路在SRAM内的单元上建立一个压降。