Electronic component
    1.
    发明授权

    公开(公告)号:US11094464B2

    公开(公告)日:2021-08-17

    申请号:US16547641

    申请日:2019-08-22

    摘要: An electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. A side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. An outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction.

    Electronic component
    2.
    发明授权

    公开(公告)号:US11610736B2

    公开(公告)日:2023-03-21

    申请号:US17368909

    申请日:2021-07-07

    摘要: An electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. A side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. An outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction.

    Multilayer ceramic capacitor
    3.
    发明授权

    公开(公告)号:US11842852B2

    公开(公告)日:2023-12-12

    申请号:US17693712

    申请日:2022-03-14

    发明人: Daisuke Hamada

    摘要: A multilayer ceramic capacitor includes first and second main surfaces opposite to each other in a thickness direction, first and second side surfaces opposite to each other in a width direction, first and second end surfaces opposite to each other in a longitudinal direction, an element body including dielectric layers and internal electrode layers stacked in the thickness direction, and a pair of external electrodes on the first and second end surfaces and electrically connected to the internal electrode layers, in which the dielectric layers include, as a main component, a perovskite oxide including barium and titanium, and the dielectric layers include an inner portion that is in contact with the internal electrode layer and includes an interface layer including a non-perovskite oxide including tin, barium, and titanium.

    MULTILAYER ELECTRONIC COMPONENT
    5.
    发明申请

    公开(公告)号:US20210043380A1

    公开(公告)日:2021-02-11

    申请号:US16983411

    申请日:2020-08-03

    IPC分类号: H01G4/12 H01G4/232

    摘要: A multilayer electronic component having an electrode facing portion in which a plurality of internal electrode layers face one another with a dielectric layer interposed therebetween. Each dielectric layer includes Ba, Ti, Si, Re, and M. M is at least one element selected from Mn, Ni, Co, Fe, Cr, Cu, Mg, Li, Al, Mo, W, and V. When the Ti is represented in an amount of 100 parts by mole the dielectric layer at the electrode facing portion has Si in an amount a of 0.01≤a≤0.1, Re in an amount b of 0.1≤b≤3.0, and M in an amount c of 0.2≤c≤5.0. A ratio m of the amount of Ba to the amount of Ti is 0.965≤m≤0.990.

    Multilayer electronic component and method for manufacturing multilayer electronic component

    公开(公告)号:US11532438B2

    公开(公告)日:2022-12-20

    申请号:US16930350

    申请日:2020-07-16

    摘要: A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers. Each of the dielectric layers includes first crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 300 nm and an average aspect ratio of more than or equal to about 5, each of the inner electrode layers includes second crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 150 nm and an average aspect ratio of more than or equal to about 5, where an aspect ratio is represented by a ratio of a major axis of each plate-shaped object to a thickness of the plate-shaped object with the major axis of the plate-shaped object being orthogonal or substantially orthogonal to a thickness direction of the plate-shaped object.

    Multilayer electronic component
    7.
    发明授权

    公开(公告)号:US11315730B2

    公开(公告)日:2022-04-26

    申请号:US16983411

    申请日:2020-08-03

    IPC分类号: H01G4/12 H01G4/232 H01G4/30

    摘要: A multilayer electronic component having an electrode facing portion in which a plurality of internal electrode layers face one another with a dielectric layer interposed therebetween. Each dielectric layer includes Ba, Ti, Si, Re, and M. M is at least one element selected from Mn, Ni, Co, Fe, Cr, Cu, Mg, Li, Al, Mo, W, and V. When the Ti is represented in an amount of 100 parts by mole the dielectric layer at the electrode facing portion has Si in an amount a of 0.01≤a≤0.1, Re in an amount b of 0.1≤b≤3.0, and M in an amount c of 0.2≤c≤5.0. A ratio m of the amount of Ba to the amount of Ti is 0.965≤m≤0.990.

    Method of manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor
    8.
    发明授权
    Method of manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor 有权
    多层陶瓷电容器和多层陶瓷电容器的制造方法

    公开(公告)号:US09190213B2

    公开(公告)日:2015-11-17

    申请号:US13764829

    申请日:2013-02-12

    IPC分类号: H01G4/30 H01G4/012 H01G4/12

    摘要: A rectangular or substantially rectangular parallelepiped chip including first and second end surfaces and first and second side surfaces is produced by cutting a mother block along a first direction in a portion where, of conductive layers that are adjacent to each other in a stacking direction, a first one is present and a second one is not present and cutting of the mother block along a second direction in a portion where, of the conductive layers that are adjacent to each other in the stacking direction, the second one is present and the first one is not present. A first internal electrode formed from the first conductive layer is exposed at the first end and side surfaces and not exposed at either of the second end and side surfaces. A second internal electrode formed from the second conductive layer is exposed at the second end and side surfaces and not exposed at either of the first end and side surfaces.

    摘要翻译: 包括第一和第二端面以及第一和第二侧表面的矩形或大致长方体的芯片通过沿着第一方向切割母块而产生,所述第一和第二端面在层叠方向上彼此相邻的导电层, 第一个存在,第二个不存在,并且沿着第二方向切割母块,其中在层叠方向上彼此相邻的导电层中存在第二个的导电层,第一个 不存在 由第一导电层形成的第一内部电极在第一端和侧表面露出,而不暴露在第二端和侧表面中的任何一个处。 由第二导电层形成的第二内部电极在第二端和侧表面处露出,而不暴露在第一端和侧表面中的任一个处。