公开(公告)号：US20160156331A1

公开(公告)日：2016-06-02

申请号：US15014239

申请日：2016-02-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuji MIWA ,  Hijiri SUMII ,  Junpei YASUDA ,  Taku KIKUCHI ,  Hisashi YAMAZAKI

IPC: H03H9/02 ,  H03H3/08 ,  H03H9/10 ,  H03H9/05

CPC classification number: H03H9/02992 ,  H01L2224/16225 ,  H03H3/08 ,  H03H9/02574 ,  H03H9/0542 ,  H03H9/059 ,  H03H9/1064

Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, wiring, a pad, an under bump metal, a first dielectric layer, and a second dielectric layer. At least a portion of the IDT electrode includes a first electrically conductive film, at least a portion of the wiring includes a multilayer body including the first electrically conductive film and a second electrically conductive film, and at least a portion of the pad includes the second electrically conductive film. The second dielectric layer covers the region other than the contact region between the second electrically conductive film and the under bump metal. Consequently, the second electrically conductive film is covered with the second dielectric layer and the under bump metal and is not exposed to air.

Abstract translation: 弹性波装置包括压电基板，IDT电极，布线，焊盘，凸块下金属，第一电介质层和第二电介质层。 所述IDT电极的至少一部分包括第一导电膜，所述布线的至少一部分包括包括所述第一导电膜和第二导电膜的多层体，并且所述垫的至少一部分包括所述第二导电膜 导电膜。 第二电介质层覆盖除了第二导电膜和下凸块金属之间的接触区域之外的区域。 因此，第二导电膜被第二介电层和下凸块金属覆盖，并且不暴露于空气。

公开(公告)号：US20170366158A1

公开(公告)日：2017-12-21

申请号：US15673442

申请日：2017-08-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshishige KOREEDA ,  Hijiri SUMII

IPC: H03H9/02 ,  H03H3/08

CPC classification number: H03H9/0222 ,  H03H3/08 ,  H03H9/059 ,  H03H9/1071

Abstract: An elastic wave device includes an elastic wave element including a piezoelectric substrate with a first main surface and a second main surface that face each other, an IDT electrode disposed on the second main surface of the piezoelectric substrate, a support disposed on the second main surface of the piezoelectric substrate so as to surround the IDT electrode in plan view, and a cover that is disposed on the support and seals the IDT electrode together with the support and the piezoelectric substrate, a mounting substrate above which the elastic wave element is mounted, and a sealing resin that is disposed on the side of the side of the upper surface of the mounting substrate and seals the elastic wave element. A thickness of the mounting substrate is less than a thickness of the sealing resin that corresponds to a distance from a surface of the sealing resin in contact with the upper surface of the mounting substrate to a surface of the sealing resin on an opposite side of the mounting substrate.

公开(公告)号：US20140217581A1

公开(公告)日：2014-08-07

申请号：US14248380

申请日：2014-04-09

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Hijiri SUMII ,  Manabu NAKAHORI

IPC: H01L23/00

CPC classification number: H01L24/10 ,  H01L23/315 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2924/181 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/0097 ,  H05K3/303 ,  H05K2201/09918 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: An electronic component includes a plurality of electrodes provided in a rectangular or substantially rectangular box-shaped area on an upper surface of a substrate, an electronic component element mounted on the substrate by flip-chip bonding, and an identification mark. The identification mark is provided between a first electrode, which is arranged along one side of the rectangular or substantially rectangular box-shaped area, and a second electrode, which is adjacent to the first electrode along the one side, of the plurality of electrodes provided on the upper surface of the substrate, and is located on or outside a line connecting the outer side edges of the first and second electrodes.

Abstract translation: 电子部件包括设置在基板的上表面上的矩形或大致矩形的箱形区域中的多个电极，通过倒装芯片接合安装在基板上的电子部件元件和识别标记。 识别标记设置在沿着矩形或大致矩形的箱形区域的一侧布置的第一电极和与设置的多个电极中的沿着一侧的第一电极相邻的第二电极 在基板的上表面上，并且位于连接第一和第二电极的外侧边缘的线之上或之外。