公开(公告)号：US20180358950A1

公开(公告)日：2018-12-13

申请号：US16108165

申请日：2018-08-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koji YAMAMOTO ,  Tsutomu TAKAI ,  Seiji KAI ,  Hisashi YAMAZAKI ,  Yuji MIWA ,  Takashi YAMANE ,  Noriyoshi OTA ,  Atsushi TANAKA

IPC: H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/145

CPC classification number: H03H9/02897 ,  H03H9/02866 ,  H03H9/0561 ,  H03H9/1092 ,  H03H9/14544 ,  H03H9/6489

Abstract: An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode has a width of about 6 μm and extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.

公开(公告)号：US20160156331A1

公开(公告)日：2016-06-02

申请号：US15014239

申请日：2016-02-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuji MIWA ,  Hijiri SUMII ,  Junpei YASUDA ,  Taku KIKUCHI ,  Hisashi YAMAZAKI

IPC: H03H9/02 ,  H03H3/08 ,  H03H9/10 ,  H03H9/05

CPC classification number: H03H9/02992 ,  H01L2224/16225 ,  H03H3/08 ,  H03H9/02574 ,  H03H9/0542 ,  H03H9/059 ,  H03H9/1064

Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, wiring, a pad, an under bump metal, a first dielectric layer, and a second dielectric layer. At least a portion of the IDT electrode includes a first electrically conductive film, at least a portion of the wiring includes a multilayer body including the first electrically conductive film and a second electrically conductive film, and at least a portion of the pad includes the second electrically conductive film. The second dielectric layer covers the region other than the contact region between the second electrically conductive film and the under bump metal. Consequently, the second electrically conductive film is covered with the second dielectric layer and the under bump metal and is not exposed to air.

Abstract translation: 弹性波装置包括压电基板，IDT电极，布线，焊盘，凸块下金属，第一电介质层和第二电介质层。 所述IDT电极的至少一部分包括第一导电膜，所述布线的至少一部分包括包括所述第一导电膜和第二导电膜的多层体，并且所述垫的至少一部分包括所述第二导电膜 导电膜。 第二电介质层覆盖除了第二导电膜和下凸块金属之间的接触区域之外的区域。 因此，第二导电膜被第二介电层和下凸块金属覆盖，并且不暴露于空气。

公开(公告)号：US20160277003A1

公开(公告)日：2016-09-22

申请号：US15171181

申请日：2016-06-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Taku KIKUCHI ,  Shin SAIJO ,  Hisashi YAMAZAKI ,  Masahiro FUKUSHIMA ,  Yuji MIWA

IPC: H03H9/05 ,  H01L41/047 ,  H03H9/145

CPC classification number: H03H9/058 ,  H01L41/0475 ,  H01L2224/24 ,  H03H3/08 ,  H03H9/1071 ,  H03H9/14541

Abstract: An elastic wave device includes a multilayer film provided on a support substrate and including a piezoelectric thin film and a layer other than the piezoelectric thin film, an interdigital transducer electrode provided on one surface of the piezoelectric thin film, and an external connection terminal electrically connected to the interdigital transducer electrode. In a plan view, the multilayer film is partially absent or omitted in a region outside a region where the interdigital transducer electrode is provided, and the elastic wave device further includes a first insulating layer provided on the support substrate in at least a portion of a region where the multilayer film is absent or omitted.

Abstract translation: 弹性波装置包括设置在支撑基板上的多层膜，包括压电薄膜和压电薄膜以外的层，设置在压电薄膜的一个表面上的叉指式换能器电极和电连接的外部连接端子 到指数式换能器电极。 在平面图中，在设置叉指式换能器电极的区域外的区域部分地不存在或省略多层膜，弹性波装置还包括设置在支撑基板上的至少一部分中的第一绝缘层 多层膜不存在或省略的区域。