公开(公告)号：US09978515B2

公开(公告)日：2018-05-22

申请号：US14568446

申请日：2014-12-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto Ogawa ,  Isao Kato

IPC: H05K7/00 ,  H05K1/16 ,  H01G2/06 ,  H05K1/11 ,  H01G4/12 ,  H01G4/30 ,  H05K1/18 ,  H05K3/30 ,  H05K3/00

CPC classification number: H01G2/065 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y10T29/4913

Abstract: An electronic component unit includes a substrate including principal surfaces opposing each other and side surfaces between the principal surfaces, and components mounted on the principal surface of the substrate. The side surfaces include first side surfaces formed before the components are mounted and second side surfaces formed after the components are mounted. As viewed from a line normal to the principal surface of the substrate, distances between the first side surfaces and the components are different from distances between the second side surfaces and the components.