公开(公告)号：US09870864B2

公开(公告)日：2018-01-16

申请号：US14868882

申请日：2015-09-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuki Kurokawa ,  Hirobumi Adachi

IPC: H01G4/30 ,  H01G4/228 ,  H01L41/083 ,  H01F27/28 ,  H01G4/008 ,  H01C1/14 ,  H01C7/00 ,  H01F27/29 ,  H01G4/248 ,  H01L41/047 ,  H01L41/187 ,  H01L41/297 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01C1/14 ,  H01C7/008 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2027/2809 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/248 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/1876 ,  H01L41/297

Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.

公开(公告)号：US09911537B2

公开(公告)日：2018-03-06

申请号：US15609283

申请日：2017-05-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuki Kurokawa ,  Hirobumi Adachi

IPC: H01G4/228 ,  H01G4/30 ,  H01L41/083 ,  H01F27/28 ,  H01G4/008 ,  H01C1/14 ,  H01C7/00 ,  H01F27/29 ,  H01G4/248 ,  H01L41/047 ,  H01L41/187 ,  H01L41/297 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01C1/14 ,  H01C7/008 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2027/2809 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/248 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/1876 ,  H01L41/297

Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.

公开(公告)号：US09892856B2

公开(公告)日：2018-02-13

申请号：US15456692

申请日：2017-03-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuki Kurokawa ,  Hirobumi Adachi

IPC: H01G4/30 ,  H01G4/228 ,  H01L41/083 ,  H01F27/28 ,  H01G4/008 ,  H01C1/14 ,  H01C7/00 ,  H01F27/29 ,  H01G4/248 ,  H01L41/047 ,  H01L41/187 ,  H01L41/297 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01C1/14 ,  H01C7/008 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2027/2809 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/248 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/1876 ,  H01L41/297

Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.

公开(公告)号：US09818546B2

公开(公告)日：2017-11-14

申请号：US15456695

申请日：2017-03-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuki Kurokawa ,  Hirobumi Adachi

IPC: H01G4/30 ,  H01G4/228 ,  H01G4/12 ,  H01G4/008 ,  H01G4/248 ,  H01L41/083 ,  H01L41/187 ,  H01L41/047 ,  H01L41/297 ,  H01F27/28 ,  H01F27/29 ,  H01C1/14 ,  H01C7/00

CPC classification number: H01G4/30 ,  H01C1/14 ,  H01C7/008 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2027/2809 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/248 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/1876 ,  H01L41/297

Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.

公开(公告)号：US10074483B2

公开(公告)日：2018-09-11

申请号：US15691833

申请日：2017-08-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuki Kurokawa ,  Hirobumi Adachi

IPC: H01G4/30 ,  H01G4/228 ,  H01G4/008 ,  H01L41/083 ,  H01F27/28 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01C1/14 ,  H01C7/008 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2027/2809 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/248 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/1876 ,  H01L41/297

Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.

公开(公告)号：US09916933B2

公开(公告)日：2018-03-13

申请号：US15623757

申请日：2017-06-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuki Kurokawa ,  Hirobumi Adachi

IPC: H01L41/08 ,  H01G4/30 ,  H01L41/083 ,  H01F27/28 ,  H01G4/008 ,  H01C1/14 ,  H01C7/00 ,  H01F27/29 ,  H01G4/248 ,  H01L41/047 ,  H01L41/187 ,  H01L41/297 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01C1/14 ,  H01C7/008 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2027/2809 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/248 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/1876 ,  H01L41/297

Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.