Electronic component containing substrate

    公开(公告)号:US10356908B2

    公开(公告)日:2019-07-16

    申请号:US15444425

    申请日:2017-02-28

    Abstract: An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.

    Capacitor with center outer electrode disposed between first and second outer electrodes

    公开(公告)号:US09715967B2

    公开(公告)日:2017-07-25

    申请号:US14661026

    申请日:2015-03-18

    CPC classification number: H01G4/232 H01G4/0085 H01G4/1227

    Abstract: A three-terminal capacitor includes a capacitor element including first through sixth surfaces, first-side and second-side outer electrodes, a center outer electrode between the first-side and second-side outer electrodes, and conductor layers within the capacitor element. A height H2 is greater than a height H3, where the height H2 represents a higher one of a height at a center of a portion of the first-side outer electrode on the fifth surface and a height at a center of a portion of the first-side outer electrode on the sixth surface, and the height H3 represents a height at a center of a portion of the first-side outer electrode on the third surface, wherein the height H2 and the height H3 extend in the thickness direction.

    Three-terminal capacitor
    8.
    发明授权

    公开(公告)号:US09842700B2

    公开(公告)日:2017-12-12

    申请号:US14924827

    申请日:2015-10-28

    CPC classification number: H01G4/30 H01G4/012 H01G4/232 H01G4/2325

    Abstract: A capacitor element includes first through sixth surfaces, a first-side outer electrode at a first end portion of the first surface and on portions of the third, fifth, and sixth surfaces, a second-side outer electrode at a second end portion of the first surface and on portions of the fourth, fifth, and sixth surfaces, a center outer electrode at a portion of the first surface between the first-side outer electrode and the second-side outer electrode and on portions of the fifth and sixth surfaces, and two outermost conductor layers of first and second conductor layers are disposed at both outermost ends in the width direction, a first of the two outermost conductor layers next to one of the first conductor layers with an inner dielectric layer therebetween is connected to the center outer electrode, and a second of the pair of outermost conductor layers next to one of the second conductor layers with an inner dielectric layer therebetween is connected to the first-side outer electrode and the second-side outer electrode.

    Electronic component
    9.
    发明授权

    公开(公告)号:US09997295B2

    公开(公告)日:2018-06-12

    申请号:US14851114

    申请日:2015-09-11

    CPC classification number: H01G4/228 H01G2/06 H01G4/005 H01G4/30

    Abstract: An electronic component includes an electronic element including two outer electrodes on surfaces thereof and a board terminal including a board main body and two mounting electrodes. The board main body has electrical insulating properties and a first principal surface. The two mounting electrodes are disposed on the first principal surface and electrically coupled to the two outer electrodes, respectively. The electronic element is mounted on the first principal surface side. The two outer electrodes are partially disposed outside an outer edge of the board terminal when viewed from the first principal surface side. The height from an end of each of the two outer electrodes opposite the board terminal to an end of the board terminal opposite the electronic element is not greater than a larger dimension of the width of the electronic element and the width of the board terminal.

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