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公开(公告)号:US09892856B2
公开(公告)日:2018-02-13
申请号:US15456692
申请日:2017-03-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kazuki Kurokawa , Hirobumi Adachi
IPC: H01G4/30 , H01G4/228 , H01L41/083 , H01F27/28 , H01G4/008 , H01C1/14 , H01C7/00 , H01F27/29 , H01G4/248 , H01L41/047 , H01L41/187 , H01L41/297 , H01G4/12
CPC classification number: H01G4/30 , H01C1/14 , H01C7/008 , H01F17/0013 , H01F27/2804 , H01F27/29 , H01F27/292 , H01F2027/2809 , H01G4/0085 , H01G4/12 , H01G4/1227 , H01G4/248 , H01L41/0472 , H01L41/083 , H01L41/1876 , H01L41/297
Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.
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公开(公告)号:US09818546B2
公开(公告)日:2017-11-14
申请号:US15456695
申请日:2017-03-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kazuki Kurokawa , Hirobumi Adachi
IPC: H01G4/30 , H01G4/228 , H01G4/12 , H01G4/008 , H01G4/248 , H01L41/083 , H01L41/187 , H01L41/047 , H01L41/297 , H01F27/28 , H01F27/29 , H01C1/14 , H01C7/00
CPC classification number: H01G4/30 , H01C1/14 , H01C7/008 , H01F17/0013 , H01F27/2804 , H01F27/29 , H01F27/292 , H01F2027/2809 , H01G4/0085 , H01G4/12 , H01G4/1227 , H01G4/248 , H01L41/0472 , H01L41/083 , H01L41/1876 , H01L41/297
Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.
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公开(公告)号:US10356908B2
公开(公告)日:2019-07-16
申请号:US15444425
申请日:2017-02-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kazuo Hattori , Isamu Fujimoto , Masaru Takahashi , Choichiro Fujii , Hirobumi Adachi
Abstract: An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.
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公开(公告)号:US09715967B2
公开(公告)日:2017-07-25
申请号:US14661026
申请日:2015-03-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hirobumi Adachi , Mitsuru Ikeda , Hitoaki Kimura
CPC classification number: H01G4/232 , H01G4/0085 , H01G4/1227
Abstract: A three-terminal capacitor includes a capacitor element including first through sixth surfaces, first-side and second-side outer electrodes, a center outer electrode between the first-side and second-side outer electrodes, and conductor layers within the capacitor element. A height H2 is greater than a height H3, where the height H2 represents a higher one of a height at a center of a portion of the first-side outer electrode on the fifth surface and a height at a center of a portion of the first-side outer electrode on the sixth surface, and the height H3 represents a height at a center of a portion of the first-side outer electrode on the third surface, wherein the height H2 and the height H3 extend in the thickness direction.
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公开(公告)号:US09653214B2
公开(公告)日:2017-05-16
申请号:US14729239
申请日:2015-06-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kazuo Hattori , Isamu Fujimoto , Hirobumi Adachi
Abstract: In a laminated capacitor, a distance between an inner internal electrode at a first principal surface side, from a pair of internal electrodes that sandwich an effective dielectric layer located closest to a second principal surface side in a first sub-electrostatic capacitance portion, and a second principal surface is smaller than or equal to a distance between an internal electrode located closest to the second principal surface side in a main electrostatic capacitance portion and the inner internal electrode.
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公开(公告)号:US10079110B2
公开(公告)日:2018-09-18
申请号:US15084840
申请日:2016-03-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hirobumi Adachi , Hitoaki Kimura
Abstract: A composite electronic component includes a capacitor device and a resistance device which is disposed on the capacitor device and includes a resistor. The capacitor device includes a capacitor body and a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode each provided on a surface of the capacitor body. The resistor is electrically connected to each of the third external electrode and the fourth external electrode.
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公开(公告)号:US09911537B2
公开(公告)日:2018-03-06
申请号:US15609283
申请日:2017-05-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kazuki Kurokawa , Hirobumi Adachi
IPC: H01G4/228 , H01G4/30 , H01L41/083 , H01F27/28 , H01G4/008 , H01C1/14 , H01C7/00 , H01F27/29 , H01G4/248 , H01L41/047 , H01L41/187 , H01L41/297 , H01G4/12
CPC classification number: H01G4/30 , H01C1/14 , H01C7/008 , H01F17/0013 , H01F27/2804 , H01F27/29 , H01F27/292 , H01F2027/2809 , H01G4/0085 , H01G4/12 , H01G4/1227 , H01G4/248 , H01L41/0472 , H01L41/083 , H01L41/1876 , H01L41/297
Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.
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公开(公告)号:US09842700B2
公开(公告)日:2017-12-12
申请号:US14924827
申请日:2015-10-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Mitsuru Ikeda , Hirobumi Adachi , Hitoaki Kimura
CPC classification number: H01G4/30 , H01G4/012 , H01G4/232 , H01G4/2325
Abstract: A capacitor element includes first through sixth surfaces, a first-side outer electrode at a first end portion of the first surface and on portions of the third, fifth, and sixth surfaces, a second-side outer electrode at a second end portion of the first surface and on portions of the fourth, fifth, and sixth surfaces, a center outer electrode at a portion of the first surface between the first-side outer electrode and the second-side outer electrode and on portions of the fifth and sixth surfaces, and two outermost conductor layers of first and second conductor layers are disposed at both outermost ends in the width direction, a first of the two outermost conductor layers next to one of the first conductor layers with an inner dielectric layer therebetween is connected to the center outer electrode, and a second of the pair of outermost conductor layers next to one of the second conductor layers with an inner dielectric layer therebetween is connected to the first-side outer electrode and the second-side outer electrode.
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公开(公告)号:US09997295B2
公开(公告)日:2018-06-12
申请号:US14851114
申请日:2015-09-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Yukihiro Fujita , Tadateru Yamada , Hirobumi Adachi
Abstract: An electronic component includes an electronic element including two outer electrodes on surfaces thereof and a board terminal including a board main body and two mounting electrodes. The board main body has electrical insulating properties and a first principal surface. The two mounting electrodes are disposed on the first principal surface and electrically coupled to the two outer electrodes, respectively. The electronic element is mounted on the first principal surface side. The two outer electrodes are partially disposed outside an outer edge of the board terminal when viewed from the first principal surface side. The height from an end of each of the two outer electrodes opposite the board terminal to an end of the board terminal opposite the electronic element is not greater than a larger dimension of the width of the electronic element and the width of the board terminal.
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公开(公告)号:US09947466B2
公开(公告)日:2018-04-17
申请号:US14663725
申请日:2015-03-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kazuo Hattori , Isamu Fujimoto , Hirobumi Adachi
CPC classification number: H01G2/065 , H01G4/232 , H01G4/30 , H05K3/3442 , H05K3/403 , H05K2201/049 , H05K2201/09181 , H05K2201/10015 , H05K2201/2045 , Y02P70/613
Abstract: An electronic component includes an electronic element including outer electrodes on a surface, a substrate terminal on which the electronic element is mounted, and a conductor that covers at least a portion of the substrate terminal. The substrate terminal includes a first main surface, a second main surface at a side opposite to the first main surface, and a side surface connecting the first main surface and the second main surface. The substrate terminal includes a mounting electrode that is provided on the first main surface and is electrically connected to the outer electrodes of the electronic element. The mounting electrode includes adjacent portions that are located to be adjacent to the side surface of the substrate terminal. The conductor covers at least a portion of the adjacent portion.
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