公开(公告)号：US20140312744A1

公开(公告)日：2014-10-23

申请号：US14320776

申请日：2014-07-01

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Akihiro MOTOKI ,  Makoto OGAWA ,  Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Shigeyuki KURODA

IPC: H01C7/00 ,  H01L41/083 ,  H01F27/28 ,  H01G4/30

CPC classification number: H01C7/008 ,  B05D5/12 ,  H01F27/2804 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/308 ,  H01L41/083

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

公开(公告)号：US20140158293A1

公开(公告)日：2014-06-12

申请号：US14177472

申请日：2014-02-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiro MOTOKI ,  Makoto OGAWA ,  Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Shigeyuki KURODA

IPC: H01G4/30

CPC classification number: H01C7/008 ,  B05D5/12 ,  H01F27/2804 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/308 ,  H01L41/083

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

Abstract translation: 一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘 并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤 在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。

公开(公告)号：US20130141836A1

公开(公告)日：2013-06-06

申请号：US13749741

申请日：2013-01-25

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Junichi SAITO ,  Toshihiko KOBAYASHI ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Kenichi KAWASAKI ,  Tatsuo KUNISHI

IPC: H01G2/10

CPC classification number: H01G2/103 ,  B05D1/38 ,  B05D5/12 ,  B05D7/14 ,  H01G4/224

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract translation: 为了防止水分进入陶瓷电子部件的部件主体的空隙部，至少陶瓷电子部件的部件主体使用防水剂赋予防水性。 将防水剂溶解在超临界流体如超临界CO 2流体中作为溶剂，以至少提供组分主体的防水性。 在提供拒水性之后，除去组分主体外表面上的防水剂。 作为防水剂，可以使用硅烷偶联剂。

公开(公告)号：US20150325374A1

公开(公告)日：2015-11-12

申请号：US14805491

申请日：2015-07-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiro MOTOKI ,  Syunsuke TAKEUCHI ,  Makoto OGAWA ,  Seiichi NISHIHARA ,  Kenichi KAWASAKI ,  Shuji MATSUMOTO

IPC: H01G4/248 ,  B32B37/18 ,  H01G4/012 ,  H01G4/30 ,  H01G4/12 ,  B32B18/00 ,  C23C18/40

CPC classification number: H01G4/248 ,  B32B18/00 ,  B32B37/18 ,  B32B2307/202 ,  B32B2315/02 ,  B32B2457/00 ,  C23C18/40 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Abstract translation: 在形成外部端子电极用镀层的方法中，例如通过对内部电极的两端露出的部件主体的端面进行镀铜，然后在约1000℃的温度下进行热处理 ℃以上，为了提高外部端子电极的粘合强度和耐湿性，可以使镀层部分熔融，降低镀层的接合强度。 在其上形成有镀层的组件主体上，在约1000℃以上的温度下进行热处理的步骤中，平均温度从室温升高至约1000℃以上的温度 设定为约100℃/分钟以上。 该平均升温速率在镀层中保持中等的共晶状态，并确保镀层的充分的接合强度。