公开(公告)号：US10098229B2

公开(公告)日：2018-10-09

申请号：US14832201

申请日：2015-08-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoichi Takagi ,  Tadashi Nomura ,  Masato Yoshida ,  Nobuaki Ogawa ,  Mitsuhiro Matsumoto

IPC: H05K1/14 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H05K3/28 ,  H05K1/09 ,  H05K3/34

Abstract: To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.

公开(公告)号：US20150179621A1

公开(公告)日：2015-06-25

申请号：US14603433

申请日：2015-01-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuhiro Matsumoto ,  Yoichi Takagi ,  Tadashi Nomura ,  Akihiko Kamada ,  Nobuaki Ogawa ,  Kensei Nishida

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L25/165 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/056 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/12042 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/19106 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.

Abstract translation: 提供了具有通过增加部件安装密度而实现的高功能性的低轮廓模块。 尽管通过在布线基板101的两个主表面101a和101b上分别安装诸如半导体基板104和芯片部件105的部件来实现模块100中的高功能性，但是可以提供低轮廓模块100，其具有 通过形成通过仅将半导体衬底104仅仅安装在布线基板101的一个主表面101a上而形成的第一部件层102的厚度Ha，从而增加其部件安装密度，从而提高其高功能性，使其小于厚度 通过将多个芯片部件105安装在布线基板101的另一个主表面101b上而形成的第二部件层103。

公开(公告)号：US09293446B2

公开(公告)日：2016-03-22

申请号：US14603433

申请日：2015-01-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuhiro Matsumoto ,  Yoichi Takagi ,  Tadashi Nomura ,  Akihiko Kamada ,  Nobuaki Ogawa ,  Kensei Nishida

IPC: H01L23/31 ,  H01L25/16 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L23/50

CPC classification number: H01L25/165 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/056 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/12042 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/19106 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.

Abstract translation: 提供了具有通过增加部件安装密度而实现的高功能性的低轮廓模块。 尽管通过在布线基板101的两个主表面101a和101b上分别安装诸如半导体基板104和芯片部件105的部件来实现模块100中的高功能性，但是可以提供低轮廓模块100，其具有 通过形成通过仅将半导体衬底104仅仅安装在布线基板101的一个主表面101a上而形成的第一部件层102的厚度Ha，从而增加其部件安装密度，从而提高其高功能性，使其小于厚度 通过将多个芯片部件105安装在布线基板101的另一个主表面101b上而形成的第二部件层103。