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公开(公告)号：US09293446B2
公开(公告)日：2016-03-22
申请号：US14603433
申请日：2015-01-23
发明人： Mitsuhiro Matsumoto , Yoichi Takagi , Tadashi Nomura , Akihiko Kamada , Nobuaki Ogawa , Kensei Nishida
IPC分类号： H01L23/31 , H01L25/16 , H01L23/498 , H01L25/065 , H01L23/00 , H01L23/50
CPC分类号： H01L25/165 , H01L23/3128 , H01L23/3135 , H01L23/49811 , H01L23/49838 , H01L23/50 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04026 , H01L2224/056 , H01L2224/06181 , H01L2224/131 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/291 , H01L2224/32225 , H01L2224/32227 , H01L2224/73253 , H01L2224/92225 , H01L2924/12042 , H01L2924/15321 , H01L2924/18161 , H01L2924/19106 , H01L2924/00 , H01L2924/00014 , H01L2924/014
摘要： A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.
摘要翻译： 提供了具有通过增加部件安装密度而实现的高功能性的低轮廓模块。 尽管通过在布线基板101的两个主表面101a和101b上分别安装诸如半导体基板104和芯片部件105的部件来实现模块100中的高功能性，但是可以提供低轮廓模块100，其具有 通过形成通过仅将半导体衬底104仅仅安装在布线基板101的一个主表面101a上而形成的第一部件层102的厚度Ha，从而增加其部件安装密度，从而提高其高功能性，使其小于厚度 通过将多个芯片部件105安装在布线基板101的另一个主表面101b上而形成的第二部件层103。
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公开(公告)号：US09456503B2
公开(公告)日：2016-09-27
申请号：US14209106
申请日：2014-03-13
发明人： Tadashi Nomura , Akihiko Kamada
CPC分类号： H05K3/284 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/19105 , H05K1/0306 , H05K1/144 , H05K2201/09063 , H05K2201/09154 , H05K2201/09163 , H05K2201/096 , H05K2201/09845 , H05K2201/10378 , H05K2201/2018 , H05K2201/2072 , H05K2203/063 , H05K2203/1327 , Y10T29/49146 , H01L2924/00014
摘要： An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.
摘要翻译： 在连接部件中的绝缘基板的接触面上形成防止树脂层分离的接合结构，该接触面与树脂层接触。 树脂层与绝缘基板的与树脂层接触的接触表面中的接合结构接合，接触表面形成连接部件的侧表面。
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公开(公告)号：US20150103495A1
公开(公告)日：2015-04-16
申请号：US14576452
申请日：2014-12-19
发明人： Hideo Nakagoshi , Yoichi Takagi , Nobuaki Ogawa , Hidekiyo Takaoka , Kosuke Nakono , Akihiko Kamada , Masaaki Mizushiro
CPC分类号： H05K7/02 , H01L23/15 , H01L23/49811 , H01L23/49822 , H01L25/16 , H01L2224/16225 , H01L2924/1531 , H01L2924/19106 , H05K1/141 , H05K1/186 , H05K3/284 , H05K3/368 , H05K3/4015 , H05K2201/0367 , H05K2201/10318 , H05K2201/10477 , H05K2201/10977 , H05K2201/10992 , H05K2203/047
摘要： A plating layer of a Cu—M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu—M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu—M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.
摘要翻译： 在暴露侧的连接端子构件的端面上形成Cu-M系合金的镀层（M表示Ni和/或Mn），Cu-M系合金能够产生金属间化合物 所述Sn基低熔点金属包含在形成接合部分并且具有不同于金属间化合物的晶格常数的接合材料中的50％以上。 在回流工序中，即使接合材料通过再熔化即将流出，由于接合材料与Cu-M系镀层接触，所以金属间化合物的高熔点合金 形成为阻挡连接端子构件和树脂层之间的界面。
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公开(公告)号：US20140268587A1
公开(公告)日：2014-09-18
申请号：US14209106
申请日：2014-03-13
发明人： Tadashi Nomura , Akihiko Kamada
CPC分类号： H05K3/284 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/19105 , H05K1/0306 , H05K1/144 , H05K2201/09063 , H05K2201/09154 , H05K2201/09163 , H05K2201/096 , H05K2201/09845 , H05K2201/10378 , H05K2201/2018 , H05K2201/2072 , H05K2203/063 , H05K2203/1327 , Y10T29/49146 , H01L2924/00014
摘要： An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.
摘要翻译： 在连接部件中的绝缘基板的接触面上形成防止树脂层分离的接合结构，该接触面与树脂层接触。 树脂层与绝缘基板的与树脂层接触的接触表面中的接合结构接合，接触表面形成连接部件的侧表面。
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公开(公告)号：US20140262442A1
公开(公告)日：2014-09-18
申请号：US14181036
申请日：2014-02-14
发明人： Tadashi Nomura , Yoichi Takagi , Nobuaki Ogawa , Akihiko Kamada
CPC分类号： H05K3/4007 , H01L2224/16225 , H01L2924/19105 , H01L2924/19106 , H05K1/113 , H05K3/243 , H05K3/3436 , H05K2201/09436 , H05K2201/10318 , H05K2201/10984 , H05K2203/025 , H05K2203/0346 , H05K2203/1327
摘要： A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.
摘要翻译： 模块包括电路板，树脂层，外部连接导体，焊料凸块。 树脂层设置在电路板的第一主表面上。 外部连接导体布置在树脂层中，具有连接到电路板的第一端和通过树脂层的表面突出的第二端，并且包括沿着树脂层的表面延伸的突出部分，突出部分 树脂层的表面。 焊料凸点设置在外部连接导体的第二端上。
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公开(公告)号：US09674970B2
公开(公告)日：2017-06-06
申请号：US13684608
申请日：2012-11-26
发明人： Issei Yamamoto , Akihiko Kamada
CPC分类号： H05K3/4697 , H01L2224/16225 , H01L2924/19105 , H05K1/141 , H05K1/145 , H05K1/182 , H05K1/186 , H05K3/284 , H05K3/4629 , H05K2201/049 , H05K2203/1316 , Y10T29/49126
摘要： In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface electrode arranged around the cavity. Resin layers are formed on both principal surfaces of the core board, and resin flows through a gap between the core board and the small board. Hence, the inside of the cavity is filled with the resin, and the electronic component is sealed with the resin.
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公开(公告)号：US09414513B2
公开(公告)日：2016-08-09
申请号：US14576452
申请日：2014-12-19
发明人： Hideo Nakagoshi , Yoichi Takagi , Nobuaki Ogawa , Hidekiyo Takaoka , Kosuke Nakono , Akihiko Kamada , Masaaki Mizushiro
IPC分类号： H05K1/18 , H05K7/02 , H01L23/498 , H01L25/16 , H05K1/14 , H05K3/36 , H05K3/40 , H01L23/15 , H05K3/28
CPC分类号： H05K7/02 , H01L23/15 , H01L23/49811 , H01L23/49822 , H01L25/16 , H01L2224/16225 , H01L2924/1531 , H01L2924/19106 , H05K1/141 , H05K1/186 , H05K3/284 , H05K3/368 , H05K3/4015 , H05K2201/0367 , H05K2201/10318 , H05K2201/10477 , H05K2201/10977 , H05K2201/10992 , H05K2203/047
摘要： A plating layer of a Cu-M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu-M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu-M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.
摘要翻译： 在暴露侧的连接端子构件的端面上形成Cu-M系合金的镀层（M表示Ni和/或Mn），Cu-M系合金能够产生金属间化合物 所述Sn基低熔点金属包含在形成接合部分并且具有不同于金属间化合物的晶格常数的接合材料中的50％以上。 在回流工序中，即使接合材料通过再熔化即将流出，由于接合材料与Cu-M系镀层接触，所以金属间化合物的高熔点合金 形成为阻挡连接端子构件和树脂层之间的界面。
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公开(公告)号：US09137904B2
公开(公告)日：2015-09-15
申请号：US14181036
申请日：2014-02-14
发明人： Tadashi Nomura , Yoichi Takagi , Nobuaki Ogawa , Akihiko Kamada
CPC分类号： H05K3/4007 , H01L2224/16225 , H01L2924/19105 , H01L2924/19106 , H05K1/113 , H05K3/243 , H05K3/3436 , H05K2201/09436 , H05K2201/10318 , H05K2201/10984 , H05K2203/025 , H05K2203/0346 , H05K2203/1327
摘要： A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.
摘要翻译： 模块包括电路板，树脂层，外部连接导体，焊料凸块。 树脂层设置在电路板的第一主表面上。 外部连接导体布置在树脂层中，具有连接到电路板的第一端和通过树脂层的表面突出的第二端，并且包括沿着树脂层的表面延伸的突出部分，突出部分 树脂层的表面。 焊料凸点设置在外部连接导体的第二端上。
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公开(公告)号：US20150179621A1
公开(公告)日：2015-06-25
申请号：US14603433
申请日：2015-01-23
发明人： Mitsuhiro Matsumoto , Yoichi Takagi , Tadashi Nomura , Akihiko Kamada , Nobuaki Ogawa , Kensei Nishida
IPC分类号： H01L25/16 , H01L23/498 , H01L23/00 , H01L25/065 , H01L23/31
CPC分类号： H01L25/165 , H01L23/3128 , H01L23/3135 , H01L23/49811 , H01L23/49838 , H01L23/50 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04026 , H01L2224/056 , H01L2224/06181 , H01L2224/131 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/291 , H01L2224/32225 , H01L2224/32227 , H01L2224/73253 , H01L2224/92225 , H01L2924/12042 , H01L2924/15321 , H01L2924/18161 , H01L2924/19106 , H01L2924/00 , H01L2924/00014 , H01L2924/014
摘要： A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.
摘要翻译： 提供了具有通过增加部件安装密度而实现的高功能性的低轮廓模块。 尽管通过在布线基板101的两个主表面101a和101b上分别安装诸如半导体基板104和芯片部件105的部件来实现模块100中的高功能性，但是可以提供低轮廓模块100，其具有 通过形成通过仅将半导体衬底104仅仅安装在布线基板101的一个主表面101a上而形成的第一部件层102的厚度Ha，从而增加其部件安装密度，从而提高其高功能性，使其小于厚度 通过将多个芯片部件105安装在布线基板101的另一个主表面101b上而形成的第二部件层103。
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