公开(公告)号：US10536779B2

公开(公告)日：2020-01-14

申请号：US16205264

申请日：2018-11-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shunsuke Kitamura ,  Kansho Yamamoto ,  Takao Mouri ,  Takuo Hada

IPC: H04R17/00 ,  H04R19/00 ,  B81B7/00 ,  B06B1/06 ,  H04R3/00 ,  H04R7/04

Abstract: An electroacoustic transducer includes an ultrasonic element that includes a diaphragm and a support frame, a case body that accommodates the ultrasonic element, and fixing portions that join the support frame portion to a bottom plate portion of the case body. First and second main surfaces of the diaphragm face top and bottom plate portions of the case body, respectively, and a sound hole is provided in the case body. The fixing portions are partially provided along the circumferential direction of the support frame such that a space between the second main surface and the bottom plate portion communicates with a space around the ultrasonic element, and an acoustic path connecting the first main surface and the second main surface and the sound hole is provided in the case body. The fixing portions are defined by a die bonding agent including spherical spacers.

公开(公告)号：US09408311B2

公开(公告)日：2016-08-02

申请号：US13936007

申请日：2013-07-05

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Koichi Kanryo ,  Akio Katsube ,  Shunsuke Kitamura

IPC: H05K3/30 ,  H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H05K3/28 ,  H05K9/00 ,  H05K1/18 ,  H01L21/683 ,  H01L23/00 ,  H05K3/00 ,  H01L23/29

CPC classification number: H05K3/301 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0052 ,  H05K3/284 ,  H05K9/0045 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2203/302 ,  Y10T29/49146 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2924/00

Abstract: A method of manufacturing an electronic component module includes sealing a surface of an aggregate substrate on which a plurality of electronic components are mounted with a sealing resin and cutting boundary portions between electronic component modules from an outer surface of the sealing resin to a position at least partially through the aggregate substrate to form first grooves. A shield layer is formed by coating the outer surface of the sealing resin with a conductive resin and filling the first grooves with the conductive resin, and recesses are formed at positions on the shield layer where the first grooves are formed. The boundary portions between electronic component modules are cut along the corresponding recesses so that second grooves each having a width smaller than the width of a corresponding one of the recesses are formed, and the aggregate substrate is singulated into the individual electronic component modules.

Abstract translation: 一种电子部件模块的制造方法，其特征在于，使用密封树脂密封其上安装有多个电子部件的集合基板的表面，将密封树脂的外表面的电子部件模块之间的边界部分切断至至少 部分地通过聚集基底以形成第一凹槽。 通过用导电树脂涂覆密封树脂的外表面并用导电树脂填充第一凹槽来形成屏蔽层，并且在形成有第一凹槽的屏蔽层上形成凹部。 电子部件模块之间的边界部分沿对应的凹部被切割，从而形成宽度小于相应的一个凹槽的宽度的第二凹槽，并且将聚集基片分割成各个电子部件模块。