公开(公告)号：US20180132356A1

公开(公告)日：2018-05-10

申请号：US15846492

申请日：2017-12-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： TATSUYA FUNAKI ,  Noriyuki Inoue

IPC: H05K1/18 ,  H01G4/005 ,  H01G4/248

CPC classification number: H05K1/185 ,  H01G2/06 ,  H01G4/005 ,  H01G4/10 ,  H01G4/228 ,  H01G4/248 ,  H01G4/33 ,  H05K3/022 ,  H05K3/32 ,  H05K3/4602 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10537 ,  H05K2201/10553 ,  H05K2201/1056

Abstract: A method for manufacturing a capacitor built-in substrate includes: preparing a capacitor built-in core insulating film and laminating a respective buildup layer to each of opposed main surfaces of the capacitor built-in core insulating film. The capacitor built-in core insulating film includes a first and second metal layers, an insulating layer and a capacitor. The first and second metal layers are disposed so as to face each other with the insulating layer interposed therebetween. The capacitor is disposed so as to extend through the insulating layer with one capacitor electrode being electrically connected to the first metal layer and the other capacitor electrode being electrically connected to the second metal layer.