公开(公告)号：US11751321B2

公开(公告)日：2023-09-05

申请号：US17863451

申请日：2022-07-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsushi Kasuya ,  Tomohiko Naruoka

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0237 ,  H05K1/0218 ,  H05K1/032 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2201/09027

Abstract: A resin multilayer substrate includes a multilayer body including resin base-material layers in a thickness direction, a side-surface conductor on at least a side surface of the multilayer body and made of a metallic material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction, a circuit component in the multilayer body and defining a circuit, and inner conductors in the multilayer body, located between the side-surface conductor and the circuit component along the side-surface conductor, and at least partially overlapping each other when viewed in the thickness direction, each of the inner conductors being one of a dummy conductor and a ground conductor.

公开(公告)号：US10154597B2

公开(公告)日：2018-12-11

申请号：US15956787

申请日：2018-04-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Makoto Takeoka ,  Masaki Kawata ,  Tomohiko Naruoka ,  Hayato Noma

IPC: H01L23/00 ,  H05K3/28 ,  H05K3/46 ,  H05K3/34 ,  H01L23/31 ,  H01L23/29

Abstract: A component mount board includes a resin board, an electronic component, and a molding resin. A land conductor is provided in the resin board. The electronic component is mounted on a surface of the resin board, and includes a mounting terminal that is bonded to the land conductor. The resin board includes a body resin portion including the land conductor provided on a surface thereof, and a surface resin layer disposed on a surface of the body resin portion and made of a material of the same type as that of the body resin portion. A conductor is not provided on a surface of the surface resin layer. The surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board. The mounting terminal is bonded to the land conductor via a bonding material filled in the through hole.

公开(公告)号：US12052818B2

公开(公告)日：2024-07-30

申请号：US17898548

申请日：2022-08-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsushi Kasuya ,  Tomohiko Naruoka ,  Noriaki Okuda ,  Kosuke Nishio ,  Nobuo Ikemoto

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/036 ,  H05K1/0201 ,  H05K1/0215 ,  H05K3/0064 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0323 ,  H05K2201/068

Abstract: A resin multilayer substrate includes a multilayer body including resin base-material layers laminated in a thickness direction and a circuit conductor therein, an end-surface ground conductor provided directly on each end surface of the multilayer body in the thickness direction, an adhesion layer on a side surface of the multilayer body, and a side-surface ground conductor on the adhesion layer. The end-surface and side-surface ground conductors are made of a ground conductor material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction. The adhesion layer is made of a material with higher adhesiveness to the side surface of the multilayer body than adhesiveness of the ground conductor material.