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公开(公告)号：US11510315B2
公开(公告)日：2022-11-22
申请号：US17368912
申请日：2021-07-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromasa Koyama , Ryosuke Takada , Atsushi Kasuya
Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
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公开(公告)号：US11751321B2
公开(公告)日：2023-09-05
申请号：US17863451
申请日：2022-07-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi Kasuya , Tomohiko Naruoka
CPC classification number: H05K1/0237 , H05K1/0218 , H05K1/032 , H05K2201/0141 , H05K2201/068 , H05K2201/09027
Abstract: A resin multilayer substrate includes a multilayer body including resin base-material layers in a thickness direction, a side-surface conductor on at least a side surface of the multilayer body and made of a metallic material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction, a circuit component in the multilayer body and defining a circuit, and inner conductors in the multilayer body, located between the side-surface conductor and the circuit component along the side-surface conductor, and at least partially overlapping each other when viewed in the thickness direction, each of the inner conductors being one of a dummy conductor and a ground conductor.
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公开(公告)号：US10813218B2
公开(公告)日：2020-10-20
申请号：US16788426
申请日：2020-02-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi Kasuya , Yusuke Kamitsubo
Abstract: A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.
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Patent Agency Ranking
公开(公告)号：US11406013B2
公开(公告)日：2022-08-02
申请号：US17083361
申请日：2020-10-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi Kasuya
Abstract: A resin multilayer substrate includes a stacked body including a first main surface, a cavity provided in the first main surface, and conductor patterns provided in the stacked body. The stacked body includes insulating substrate layers including resin as a main material that are stacked. The cavity includes a side surface and a bottom surface. At least a portion of a boundary between the side surface and the bottom surface includes conductor patterns continuous with the side surface and the bottom surface.
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公开(公告)号：US11102885B2
公开(公告)日：2021-08-24
申请号：US17007015
申请日：2020-08-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi Kasuya , Yusuke Kamitsubo
Abstract: A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.
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公开(公告)号：US11096282B2
公开(公告)日：2021-08-17
申请号：US17076844
申请日：2020-10-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi Kasuya
Abstract: A substrate bonding structure includes a first substrate including a first resin substrate that melts by heating, a second substrate having a second resin substrate that melts by heating, and an overlapping portion with the first substrate. The overlapping portion between the first substrate and the second substrate includes a hole continuously extending from the first substrate to the second substrate. The first substrate includes a melted portion of the first resin substrate around the hole, and the second substrate includes a melted portion of the second resin substrate around the hole. The first substrate and the second substrate are bonded to each other with a fused portion between the melted portion of the first resin substrate and the melted of the second resin substrate.
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公开(公告)号：US12052818B2
公开(公告)日：2024-07-30
申请号：US17898548
申请日：2022-08-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi Kasuya , Tomohiko Naruoka , Noriaki Okuda , Kosuke Nishio , Nobuo Ikemoto
CPC classification number: H05K1/036 , H05K1/0201 , H05K1/0215 , H05K3/0064 , H05K2201/0129 , H05K2201/0141 , H05K2201/015 , H05K2201/0323 , H05K2201/068
Abstract: A resin multilayer substrate includes a multilayer body including resin base-material layers laminated in a thickness direction and a circuit conductor therein, an end-surface ground conductor provided directly on each end surface of the multilayer body in the thickness direction, an adhesion layer on a side surface of the multilayer body, and a side-surface ground conductor on the adhesion layer. The end-surface and side-surface ground conductors are made of a ground conductor material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction. The adhesion layer is made of a material with higher adhesiveness to the side surface of the multilayer body than adhesiveness of the ground conductor material.
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公开(公告)号：US11089680B2
公开(公告)日：2021-08-10
申请号：US16850174
申请日：2020-04-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromasa Koyama , Ryosuke Takada , Atsushi Kasuya
Abstract: A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.
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