ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20230215827A1

    公开(公告)日:2023-07-06

    申请号:US18181791

    申请日:2023-03-10

    Abstract: Provided is an electronic component capable of reducing a possibility that insulating layers covering from outer edge portions of electrodes to surrounding portions, around the electrodes, of a substrate are separated from the electrodes and the substrate. An electronic component includes: a substrate; an electrode formed on a surface of the substrate; a protective portion covering at least a part of a peripheral portion of the electrode and a surrounding portion, around the electrode, of the surface of the substrate, across outer edge portions of the electrode, and extending in a circumferential direction along the outer edge portions of the electrode; and an extending portion extending, on the surface of the substrate, from the protective portion in an extending direction away from the electrode. A width of the extending portion perpendicular to the extending direction is longer than a width of the protective portion perpendicular to the circumferential direction.

    CERAMIC ELECTRONIC COMPONENT
    2.
    发明公开

    公开(公告)号:US20240153709A1

    公开(公告)日:2024-05-09

    申请号:US18413380

    申请日:2024-01-16

    CPC classification number: H01G4/2325 H01G4/30 H01G4/12

    Abstract: A ceramic electronic component of the present disclosure includes a first surface, a second surface opposite to the first surface, and a side surface interconnecting the first surface and the second surface, wherein a first base electrode is on the first surface, a side electrode connected to the first base electrode is on the side surface, and a ceramic protective layer covers at least a portion of an outline of at least one external electrode selected from the group consisting of the first base electrode and the side electrode.

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    公开(公告)号:US20230119828A1

    公开(公告)日:2023-04-20

    申请号:US18067042

    申请日:2022-12-16

    Abstract: An electronic component of the present disclosure includes: an electronic component body; an electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a portion of a perimeter of the electrode and extending across a boundary between the perimeter of the electrode and the surface of the electronic component body, wherein in a plan view of the electronic component body seen from a side where the electrode is disposed, the electrode includes corners each provided by two segments defining a portion of the perimeter of the electrode, and a thickness of at least a portion of the cover layer on at least one of the corners is greater than a thickness of the other portions of the cover layer on portions other than the corners.

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    公开(公告)号:US20230113966A1

    公开(公告)日:2023-04-13

    申请号:US18064968

    申请日:2022-12-13

    Abstract: An electronic component including: an electronic component body; at least one electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a part of a periphery of the electrode and extending across a boundary between the periphery of the electrode and the surface of the electronic component body, wherein the electrode includes, on the at least part of the periphery, a lower electrode closer to the surface of the electronic component body and an upper electrode on the lower electrode, the lower electrode extends more outward than the upper electrode to create a step at the at least part of the periphery of the electrode, and at the step at the periphery of the electrode, the cover layer extends from a surface of the upper electrode to a portion with no electrodes on the surface of the electronic component body.

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