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公开(公告)号：US20100269333A1
公开(公告)日：2010-10-28
申请号：US12766679
申请日：2010-04-23
IPC分类号： H05K3/30
CPC分类号： H05K3/328 , H01L23/49838 , H01L24/13 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81205 , H01L2224/81801 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/111 , H05K2201/09418 , H05K2201/10674 , H05K2203/0285 , Y02P70/611 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The objective of this invention is to provide an ultrasonic flip-chip mounting method with little variance in the formed electrode joints between a semiconductor chip and a substrate. The ultrasonic method for mounting a flip chip of the present invention may include a step for forming several bump electrodes (106) on the main surface of one side of a semiconductor chip (100) and a step for respectively bringing several projecting electrodes (106) into contact with the corresponding conductor patterns (132) on a substrate and for applying ultrasonic vibration to the semiconductor chip, where the ultrasonic vibration direction is oriented in a direction oblique to the electrode patterns (132). In this way, an effective width for joining formation W1 is greater than the width of the conductor patterns W of the electrode patterns (132).
摘要翻译： 本发明的目的是提供一种在半导体芯片和基板之间的形成的电极接头中几乎没有差异的超声波倒装芯片安装方法。 用于安装本发明的倒装芯片的超声波方法可以包括在半导体芯片（100）的一侧的主表面上形成多个凸起电极（106）的步骤和分别带有几个突出电极（106）的步骤， 与基板上的相应的导体图案（132）接触并且用于对半导体芯片施加超声波振动，其中超声波振动方向在与电极图案（132）相反的方向上取向。 以这种方式，用于接合结构W1的有效宽度大于电极图案（132）的导体图案W的宽度。
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